What’s the cost for 3-D chips?

Mark LaPedus, EETimes
12/9/2010 6:46 PM EST

BURLINGAME, Calif. – What’s the biggest hurdle to bring 3-D chips based on through-silicon via (TSV) technology into mass production?

There are many, but cost is perhaps the big issue.

Antun Domic, senior vice president and general manager of the Implementation Group for Synopsys Inc., said the cost overhead for a TSV-based 3-D device is $150 per wafer. That is 5 percent of the total cost of a 300-mm wafer. 

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