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CEVA to Showcase Latest IP for Digital Home and Mobile Products at CES 2012Demonstrations include innovative solutions for 3D video, finger tracking, scene analysis, DTV demodulation, HD audio, and 4G LTE baseband
MOUNTAIN VIEW, Calif., Dec. 5, 2011 -- CEVA, Inc. (NASDAQ: CEVA); (LSE: CVA), the leading licensor of silicon intellectual property (SIP) platform solutions and digital signal processors (DSP) cores, today announced that it will showcase a range of innovative multimedia and communications solutions for the digital home and mobile markets at CES 2012 in Las Vegas from January 10-13th, 2012. At the show, CEVA will host a private meeting suite in the Las Vegas Hilton where invitees can interact with the demonstrations and meet with members of the CEVA executive team. The diverse portfolio of technologies being displayed by CEVA at CES is indicative of the company's continued strategic expansion into new addressable markets where high-performance, fully programmable DSPs play a critical role in cost reduction and true product differentiation. Demonstration platforms on display will include:
To request a meeting with CEVA at CES to view the latest advancements in high-performance DSP platforms, please email info@ceva-dsp.com or contact your local CEVA sales office. About CEVA, Inc. CEVA is the world's leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile handset, portable and consumer electronics markets. CEVA's IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia (HD video, Image Signal Processing (ISP) and HD audio), voice over packet (VoP), Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2010, CEVA's IP was shipped in over 600 million devices, powering handsets from 7 out of the top 8 handset OEMs, including Nokia, Samsung, LG, Motorola, Sony Ericsson and ZTE. Today, more than one in every three handsets shipped worldwide is powered by a CEVA DSP core. For more information, visit www.ceva-dsp.com.
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