TSMC said to plan 450-mm production for 2018

Peter Clarke, EETimes
9/5/2012 8:37 AM EDT

LONDON – Foundry chip maker Taiwan Semiconductor Manufacturing Co. Ltd. now foresees the start of volume production of ICs on 450-mm diameter wafers in 2018, according to local reports that reference J.K.Wang, TSMC's vice president for operations speaking ahead of the Semicon Taiwan exhibition and conference. The reports said that TSMC believes pilot lines could be running in 2016 or 2017.

Click here to read more ...