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ARM Reinforces Low-power Credentials With New Features For Microprocessor CoreTargets low-voltage 0.13µm processes resulting in 75 percent less power consumption, 50 percent smaller die area CAMBRIDGE, UK – Apr. 30, 2002 – ARM [(LSE:ARM); (Nasdaq:ARMHY)], the industry's leading provider of 16/32-bit embedded RISC processor solutions, today announced at the Embedded Processor Forum, San Jose, Calif., the availability of a new version of the industry's most popular 16/32-bit embedded RISC microprocessor solution, the ARM7TDMI® core. This new version can be ported to leading-edge process technologies significantly reducing die area and allowing operation at lower voltages. Product designers using the new version can choose between increasing operating frequency or significantly reducing power consumption depending on the application. When targeted at a standard 0.13µm, 1.2V ASIC process, the new version of the ARM7TDMI core achieves a worst case frequency of >133MHz, a die area of 0.26mm2 and typical power consumption of less than 0.06mW/MHz. This represents a 50 percent reduction in die area and more than 75 percent reduction in power consumption over earlier 0.18µm implementations. Furthermore, the new core can be powered down to 0.7V. At this voltage, the power consumption is reduced to an very low 18 µW/MHz, with a worst case frequency of close to 50 MHz. This capability will allow battery life to be extended even further than before, so adding value to a wide range of portable devices. At the other end of the scale, using a high-performance 0.13µm process, worst case frequencies in excess of 220MHz can been achieved, extending the top-end performance of this versatile core. "Since its inception, ARM has striven to achieve the best possible performance at the lowest possible power consumption and 10 years on, we still hold true to that philosophy – this new version of our most popular core is no exception," said Clive Watts, ARM7™ product manager. "With its very small die area and significantly reduced power consumption, ASIC designers are now in an even more advantageous position when designing solutions for products that demand exceptionally long battery life." "TI has worked closely with its Partner, ARM, to deliver more than half a billion wireless silicon and software devices that utilize the popular ARM7TDMI core along with TI's industry-leading DSPs," said Jeff Bellay, vice president, Wireless Operations, TI. "This new version of the ARM7TDMI core enables TI to provide its customers with lower power, wireless products based on leading-edge processes such as our recently-announced 90 nanometer technology and beyond." In addition to the reduced die size and power consumption, another feature of the new version of the ARM7TDMI core is the incorporation of ARM's EmbeddedICE-RT™ technology. The EmbeddedICE™ technology provides real-time address and data-dependant breakpoints, single stepping and full access and control of the ARM CPU, memory and I/O sub-systems. The new EmbeddedICE-RT technology allows interrupts to be enabled during a debug operation so that critical interrupt service routines (ISR) continue to run. In real-time systems these ISRs are typically coupled with physical equipment, such as drives, which would run out of control if interrupts were blocked during debug. Since EmbeddedICE-RT technology improves the ability to debug real-time systems, design cycles and time to market is significantly reduced. The ARM7TDMI core is ideal for devices where low-power consumption is critical in order to lengthen battery life in portable electronic devices such as digital cameras, personal organizers, mobile phones and handheld gaming devices. Price and availability About ARM |
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