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Xilinx Announces 2014 Fiscal Q1 Results; Sales Increase 9% SequentiallySAN JOSE, Calif. -- July 17, 2013 -- Xilinx, Inc. (Nasdaq: XLNX) today announced first quarter fiscal 2014 sales of $579 million, up 9% from the prior quarter and down 1% from the same quarter of the prior fiscal year. First quarter fiscal 2014 net income was $157 million or $0.56 per diluted share. The Xilinx Board of Directors announced a quarterly cash dividend of $0.25 per outstanding share of common stock, payable on August 28, 2013 to all stockholders of record at the close of business on August 7, 2013. Additional first quarter comparisons are represented in the charts below: GAAP Results
"The June quarter was exceptional on many fronts. Better than expected sales during the quarter were driven by broad-based end market strength, with particularly strong growth from wired communications and aerospace and defense applications. Gross margin was 69% in the quarter, up from 66% in prior quarter, and a new record for the Company. Operating margin of 33% was up from 28% in the prior quarter and a direct result of improved gross margin and continued spending discipline," said Moshe Gavrielov, Xilinx President and Chief Executive Officer. "Sales of our 28-nm products exceeded $50 million during the quarter, once again surpassing our expectations with strong growth from all five products. With the first 20-nm product in the semiconductor industry recently taped out by the Company, I am confident that Xilinx will continue to drive market expansion opportunities and augment our PLD leadership." Net Revenues by Geography: Net Revenues by End Market: Net Revenues by Product: Products are classified as follows:
Key Statistics: (Dollars in millions) *Return on equity calculation: Annualized net income/average equities, including temporary equity Highlights – June Quarter Fiscal 2014
Business Outlook – September Quarter Fiscal 2014
About Xilinx Xilinx develops All Programmable technologies and devices, beyond hardware to software, digital to analog, and single to multiple die in 3D ICs. These industry leading devices are coupled with a next-generation design environment and IP to serve a broad range of customer needs, from programmable logic to programmable systems integration. For more information visit www.xilinx.com.
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