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CYIT Licenses CEVA-TeakLite-4 Audio/Voice DSP for Mobile SoCsIndustry's most widely deployed DSP architecture enables ultra-low power audio, VoLTE and baseband processing in CYIT's multi-mode 4G terminal chips MOUNTAIN VIEW, Calif., Feb. 18, 2014 -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced that Chongqing CYIT Communication Technology Co., Ltd has licensed the CEVA-TeakLite-4 DSP for its multi-mode wireless baseband chips targeting 4G terminals, including smartphones and tablets. The fully programmable CEVA-TeakLite-4 DSP addresses the increasingly complex processing and stringent low-power requirements of advanced audio and voice algorithms, including the voice-over-LTE (VoLTE) standard required for China Mobile's 4G network. The CEVA-TeakLite-4 also provides ample processing headroom, allowing CYIT to implement wireless baseband processing on the same DSP in a highly power-efficient manner. "The advanced processing requirements of 4G handsets provide a superior user experience, but can significantly impact the battery life of the device if not implemented in a power-savvy form," said Mr.Daqin Peng, Marketing Director at CYIT. "The ultra-low power CEVA-TeakLite-4 DSP offers us the optimal platform on which to develop our LTE terminal chips, providing outstanding performance and flexibility and capable of handling a wide array of audio, voice and baseband processing tasks." "We are pleased to collaborate with CYIT in the development of their next-generation chipsets targeting China's 4G networks," said Eran Briman, vice president of marketing at CEVA. "With more than one billion wireless subscribers and growing, China is single-handedly the most important growth market for wireless devices, and CYIT are well positioned to address this with their CEVA-powered roadmap." The CEVA-TeakLite-4 is the fourth generation DSP based on the CEVA-TeakLite architecture, the most successful licensable DSP family in the history of the semiconductor industry, with more than 3 billion chips shipped, over 100 licensees, 30 active ecosystem partners and more than 100 audio and voice software packages available. The CEVA-TeakLite-4 is offered as a scalable and extensible architecture framework, allowing customers to choose the optimal family member core to address their specific audio/voice application needs. By taking advantage of a unified development infrastructure composed of code-compatible cores, a set of optimized software libraries and a unified tool chain, customers can significantly reduce software development costs while leveraging their software investment in future products. For more information, visit http://www.ceva-dsp.com/CEVA-TeakLite-4. About CEVA, Inc. About CYIT
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