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TSMC 0.13-Micron Copper Process Delivers Altera's Stratix Devices In Record TimeStratix Devices Are Now in Customers Hands Earlier than Expected San Jose, Calif., June 17, 2002 -- Altera Corporation's (NASDAQ: ALTR) earlier than planned release of its first Stratix™ device family is proof positive that Taiwan Semiconductor Manufacturing Company's (TSMC) 0.13-micron copper process is now operating in high gear. Analysis of early production runs of the Stratix EP1S25 devices indicate that all process parameters are on target and that performance has exceeded expectations. This achievement was made possible by the advanced technology collaboration between the two companies, beginning in December 2001 with the first shipments of Altera's 0.13-micron APEX™ II EP2A70 devices. "Altera is among our largest consumers of 0.13-micron wafers and was instrumental in fine-tuning this process," said Genda Hu, vice president of marketing at TSMC. "Our technology development partnership and our shared goal of aggressive innovation benefit our customers who depend on us to deliver cost effective, high-performance products so they can then pass these advantages on to their customers." The Stratix architecture simplifies the design process for customers building more complex system-on-a-programmable-chip (SOPC) solutions. The Stratix architecture is the first in the industry to allow for a true timing locked block-based methodology for team-based SOPC design. All Stratix devices also include redundancy circuitry. Altera pioneered the concept of redundancy in their programmable logic devices (PLDs) to ensure the performance and reliability of the device. "Clearly, TSMC's investment and experience with this technology is going to pay off for Altera with high yields and a rapid production ramp for the Stratix device family. This translates to reduced cost and faster time-to-market benefits for our customers," said Francois Gregoire, Altera's vice president of technology. "The TSMC 0.13-micron process, which is the foundation of the Stratix device family, is further along the defect density curve than any previous TSMC process at a similar time in its ramp. We currently have a high volume of wafers in the pipeline because we have extreme confidence in this process." After successful, intense testing and analysis of the EP1S25 devices, Altera will have taped out two additional members of the Stratix family by the end of the month. These products are expected to ship to customers in the third quarter of this year. For more information on Stratix device shipping, please visit today's related press release at http://www.altera.com/corporate/nr-stx_shipping.html. About Stratix Devices About TSMC About Altera
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