Sony Joins FDSOI Club

Junko Yoshida
1/30/2015 05:15 PM EST

MADISON, Wis. — Sony Corp. revealed that the company’s next-generation Global Navigation Satellite System (GNSS) chip will use 28-nm Fully Depleted Silicon On Insulator (FDSOI) process.

The test chip based on the FDSOI process marks a dramatic reduction in power consumption. A Sony engineer, who spoke at the SOI Industry Consortium in Tokyo, told the audience that Sony was able to cut power consumption in its GNSS chip from 10mW to 1mW.

The Japanese company used STMicroelectronics’ 28nm FDSOI design kit, and manufactured its FDSOI samples at ST's fab.

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