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Cadence First Encounter Adopted by Silicon Integrated Systems (SiS) For High Performance Graphics Chip DesignsSiS Tapes Out Six-Million Gate, 533MHz Chip Using First Encounter San Jose, Calif., August 27, 2002: Cadence Design Systems, Inc. (NYSE: CDN), the world's leading supplier of electronic design products and services, today announced that Silicon Integrated Systems (SiS) Corporation has standardized on Cadence® First Encounter®, a proven silicon virtual prototyping technology, for the design of complex graphics integrated circuits (ICs). First Encounter's successful management of timing-driven placement issues was critical to the fast tape-out of SiS' six million-gate, 3D graphics IC. This new, high-performance chip from SiS supports a 16-bit, bi-directional data bus at 533MHz operating frequency. Wires First "SiS has always worked aggressively to deliver high performance graphics chips to our customers," said Chris Lin, vice president of the Multimedia Products Division of SiS. "Cadence First Encounter's ability to create a timing- and routing-accurate prototype dramatically reduces the time it takes to complete our cutting-edge multimedia designs. With so much of modern IC physical characteristics now dependent on the interconnect, First Encounter's ability to leverage wire information within the prototype is a big advantage." "Today's timing closure challenges can be met only if the designer has the knowledge of how the routing actually looks," said Eric Filseth, vice president of SP&R Marketing at Cadence. "We're extremely pleased that SiS, an industry leader, chose the First Encounter strategy for their silicon virtual prototyping requirements. We look forward to continuing to serve SiS' needs on large, high-performance SoC designs." About SiS About Cadence Cadence, the Cadence logo, and First Encounter are registered trademarks of Cadence Design Systems, Inc. All other trademarks are the property of their respective owners.
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