SMIC and IMECAS Sign A Cooperation Agreement for MEMS R&D and Foundry Platform

SHANGHAI, Nov. 15, 2016 -- Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981), one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China, and The Institute of Microelectronics of the Chinese Academy of Sciences ("IMECAS") announced the signing of a cooperation agreement for a MEMS R&D foundry platform to jointly develop MEMS sensor standard processes and build a complete MEMS supply chain.

According to the agreement, SMIC and IMECAS will work together closely to take advantage of IMECAS's experiences in MEMS Sensor design and packaging technology design and SMIC's standardized process technology platforms, industry and market influence. Starting with the development of a MEMS environmental sensor and combining the features of other types of MEMS Sensors, SMIC and IMECAS will collaborate to create a platform-based standard as well as mass production technologies to shorten the development cycle from design to production,thus helping the MEMS industry grow more effectively and efficiently.

"SMIC's R&D team has made a lot of achievements in developing new sensor technology platforms and introducing new customers. SMIC is willing to open our platforms to support commercialized production and the R&D of universities and research institutions," said Dr. Tzu-Yin Chiu, Chief Executive Officer and Executive Director of SMIC. "SMIC and IMECAS have cooperated in numerous logic process development projects. This time we will expand our collaboration and promote the R&D of complete standardized MEMS sensor technologies to help integrate and improve the MEMS supply chain."

Ye Tianchun, Director of IMECAS, visited SMIC's middle-end production line of MEMS sensors and said, "Through the cooperation between SMIC and IMECAS, we can exploit our advantages and jointly build an open MEMS technology service platform and an electronic information integration platform for the MEMS supply chain. With the integration of design, manufacturing, packing, testing, public platform and venture investment, we can form a supply chain ecosystem and support the development of a global as well as domestic Chinese MEMS industry."

About SMIC

Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China. SMIC provides integrated circuit (IC) foundry and technology services on process nodes from 0.35 micron to 28 nanometer. Headquartered in Shanghai, China, SMIC has an international manufacturing and service base. In China, SMIC has a 300mm wafer fabrication facility (fab) and a 200mm mega-fab in Shanghai; a 300mm mega-fab and a majority-owned 300mm fab for advanced nodes in Beijing; 200mm fabs in Tianjin and Shenzhen; and a majority-owned joint-venture 300mm bumping facility in Jiangyin; additionally, in Italy SMIC has a majority-owned 200mm fab. SMIC also has marketing and customer service offices in the U.S., Europe, Japan, and Taiwan, and a representative office in Hong Kong. For more information, please visit www.smics.com.

About IMECAS

The Institute of Microelectronics of the Chinese Academy of Sciences ("IMECAS") has become a key research institution integrated with both fundamental research and technology development, which is quite industry-oriented. It is also an entity of two centers and one college under the name of CAS. They are the CAS R&D Center for The Internet of Things, the CAS EDA Center (Electronic Design Automation Center) and the college of Microelectronics of UCAS (University of the Chinese Academy of Sciences). There are 14 departments at IMECAS including two key CAS Laboratories, four R&D centers for industry service, five R&D centers for typical applications, and three R&D centers for core product development. Among which, the Smart Sensing Center is conducting the research and development of sensor design, fabrication, packaging and testing. The CAS R&D Center for The Internet of Things has also established public service platforms, including a MEMS Design and Manufacture Platform and SIP Packaging Platform, a Communication System and Chip Design Test and Verification Platform, and more. For more information, please visit http://english.ime.cas.cn.