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OmniPHY to Demonstrate Automotive Design Solutions at TSMC 2017 OIP Ecosystem ForumSeptember 8, 2017 -- OmniPHY Semiconductor, Inc. today announced it will be showcasing how it leverages TSMC manufacturing technology to create robust automotive semiconductor IP solutions at the TSMC 2017 Open Innovation Platform® Ecosystem Forum. The event is being held on September 13, 2017, at the Santa Clara Convention Center. What:
In addition, experts from our design and applications teams will be on hand to answer questions and engage in technical dialog. When: TSMC's OIP Forum is on September 13, 2017 from 8:00am -6:00pm. Where: Santa Clara Convention Center, Booth #420 About the TSMC Open Innovation Platform (OIP)® Forum This event is for TSMC’s OIP Alliance members to present to TSMC customers and for registered attendees only. Please contact your TSMC representative for registration details. About OmniPHY: OmniPHY is a leading provider of highly specialized interface IP and communication technology, offering customers greater design margins and fast time-to-market for emerging standards, including 1.25-28 GB/s PHY designs and 10/100/1000BASE-T Ethernet in advanced processes. The company serves the Automotive, Industrial, and Enterprise segments through its lineup of silicon-proven PHY IP. For more info: http://www.omniphysemi.com/
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