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MIPI Alliance Announces Milestones in Membership Growth and Industry InfluenceExpansion to 300 members from across the world highlights the broadening reach of MIPI Alliance specifications to more markets and ecosystems in the mobile industry PISCATAWAY, N.J., October 17, 2017 - The MIPI® Alliance, an international organization that develops interface specifications for mobile and mobile-influenced industries, today announced a new milestone in the organization’s growth and development: Its membership now numbers 300 companies representing semiconductor, device manufacturers and other innovators in mobile, IoT, automotive and other industries. "MIPI Alliance has grown year-over-year since its inception and the 300-member mark is particularly meaningful because it reflects increased adoption of MIPI specifications, broadened geographic reach of the organization and the extended application of our specifications to new markets and ecosystems," said Joel Huloux, chairman of MIPI Alliance. "We thank all of our members for their commitment and look forward to continuing our dedicated work to serve our members in the years ahead." MIPI Alliance was formed in 2003. Its initial charter was to provide specifications for the intricate wiring that interconnects cameras and other multimedia components in mobile devices, with the vision of spurring innovation in the smartphone industry and helping companies accelerate time-to-market with their designs. The impact of that vision is well established, and today every smartphone uses at least one MIPI specification. As MIPI Alliance approaches its 15-year anniversary in 2018, it is highlighting the breadth of its specifications—which simplify the integration of components in mobile devices—and the steadily increasing adoption of its specifications for use in more sectors. The milestones include: Its industry-leading role enabling the "wires behind wireless." MIPI Alliance’s specifications are universally used to interconnect RF-components, processors, cameras and displays in a device. The most widely adopted specifications include MIPI CSI-2SM, MIPI DSI SM, MIPI RFFESM and MIPI physical layers: MIPI C-PHYSM, MIPI D-PHYSM, and MIPI M-PHY®. "MIPI Alliance specifications are widely used throughout the mobile industry, making it more convenient for manufacturers to combine new components and create powerful, feature-rich smartphones," said Linley Gwennap, principal analyst of The Linley Group. "Building on this success in mobile, MIPI specifications are now appearing in automotive, IoT, and drones, bringing similar benefits to these emerging applications." To discover more about MIPI Alliance and to connect with its social networks, follow its Twitter page, join its LinkedIn group and like its Facebook page. To join MIPI Alliance, use the Join MIPI link on the organization's site. About MIPI Alliance
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