Third Quarter 2017 Silicon Wafer Shipments Increase Quarter-Over-Quarter; another Quarterly Record

MILPITAS, Calif. — November 7, 2017 — Worldwide silicon wafer area shipments increased during the third quarter 2017 when compared to second quarter 2017 area shipments according to the SEMI Silicon Manufacturers Group (SMG) in its quarterly analysis of the silicon wafer industry.

Total silicon wafer area shipments were 2,997 million square inches during the most recent quarter, a 0.7 percent increase from the record 2,978 million square inches shipped during the previous quarter. New quarterly total area shipments are 9.8 percent higher than third quarter 2016 shipments and continue to ship at their highest recorded quarterly level.

"Global silicon wafer shipment volumes surpassed record levels for the sixth quarter in a row, resulting in a new historical high,” said Chungwei (C.W.) Lee (李崇偉), chairman of SEMI SMG and spokesman, VP, Corporate Development and chief auditor of GlobalWafers (環球晶圓). “While silicon demand is strong, silicon pricing remains well below pre-downturn levels.”

Silicon* Area Shipment Trends

Source: SEMI (www.semi.org), November 2017

	Millions of Square Inches
	2Q2016	3Q2016	4Q2016	1Q2017	2Q2017	3Q2017
Total	2,706	2,730	2,764	2,858	2,978	2,997

*Semiconductor applications only

Silicon wafers are the fundamental building material for semiconductors, which in turn, are vital components of virtually all electronics goods, including computers, telecommunications products, and consumer electronics. The highly engineered thin round disks are produced in various diameters (from one inch to 12 inches) and serve as the substrate material on which most semiconductor devices or "chips" are fabricated.

All data cited in this release is inclusive of polished silicon wafers, including virgin test wafers and epitaxial silicon wafers, as well as non-polished silicon wafers shipped by the wafer manufacturers to the end-users.

The Silicon Manufacturers Group acts as an independent special interest group within the SEMI structure and is open to SEMI members involved in manufacturing polycrystalline silicon, monocrystalline silicon or silicon wafers (e.g., as cut, polished, epi, etc.). The purpose of the group is to facilitate collective efforts on issues related to the silicon industry including the development of market information and statistics about the silicon industry and the semiconductor market.

SEMI® connects over 2,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. FlexTech and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C. For more information, visit http://www.semi.org