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Virtual Silicon Offers IP for IBM 130 nm Foundry ProcessSUNNYVALE, Calif., --November 18, 2002 - Virtual Silicon Technology Inc., a leader in semiconductor intellectual property (SIP), today announces the introduction of a family of IP products targeted for the IBM 130 nm foundry process. The offering includes Virtual Silicon's basic I/O, phase-locked loop (PLL), delay-locked loop (DLL), high-speed interface products and standard cells. Virtual Silicon's high-speed interface products are targeted at providing physical layer solutions for next generation chip-to-chip communications. Products include SSTL2, HSTL, LVDS, PCI 2.2 and PCI-X. The high-speed interface products are coupled with highly accurate PLLs and DLLs to provide customers with complete QDR (HSTL) and DDR (SSTL2) solutions. The offering includes basic CMOS I/Os that are flip-chip and area-array compatible. Virtual Silicon's high-performance standard cell library is a fundamental element of leading-edge computing and communication system-on-chip (SoC) designs. "Virtual Silicon is a respected provider of process-specific intellectual property," said Mike Concannon, vice president of foundry and manufacturing services at IBM Microelectronics." As IBM expands its foundry activity, cooperative relationships with SIP companies with established customer bases, like Virtual Silicon, help provide our customers with the IP they want, characterized and optimized to the process technologies they require." "Offering our products on IBM Foundry processes opens a new level of opportunity for Virtual Silicon," said Tim Unger, CEO of Virtual Silicon. "IBM's focus on leading-edge process technology matches well with Virtual Silicon's leadership in high-performance IP. We look forward to a continuing relationship with IBM in supporting our mutual customers' IP needs." Virtual Silicon's product offering for IBM's 130-nm foundry process is available for license now, and has already been used by three customers for the development of SoC designs for IBM's 130 nm process. Virtual Silicon's IP has been designed bottom-up, specifically for the IBM 130 nm (8SF) foundry process and their customers who require the utmost in performance. Additional products will be offered to customers in first half of 2003. Some of the interface IP was developed as a part of the OEM partnership with TriCN. About Virtual Silicon Technology
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