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Wafer Shipments Forecast to Set New Highs Through 2021MILPITAS, Calif. -- October 16, 2018 -- Total wafer shipments in 2018 year are expected to eclipse the all-time market high set in 2017 and continue to reach record levels through 2021, according to SEMI’s recent semiconductor industry annual silicon shipment forecast. The forecast of demand for silicon units for the period 2018 through 2021 shows polished and epitaxial silicon shipments totaling 12,445 million square inches in 2018; 13,090 million square inches in 2019; 13,440 million square inches in 2020, and 13,778 million square inches in 2021 (see table below). "As new greenfield fab projects continue to emerge for memory and foundry, silicon shipments are expected to remain strong for 2019 and through 2021," said Clark Tseng, director of Industry Research & Statistics at SEMI. "Silicon demand will continue to grow as semiconductor content increases in mobile, high-performance computing, automotive, and Internet of Things applications.” 2018 Silicon* Shipment Forecast (MSI = Millions of Square Inches)
*Total Electronic Grade Silicon Slices – Excludes Non-Polished Wafers Silicon wafers are the fundamental building material for semiconductors, which in turn, are vital components of virtually all electronics goods, including computers, telecommunications products, and consumer electronics. The highly engineered thin round disks are produced in various diameters (from one inch to 12 inches) and serve as the substrate material on which most semiconductor devices or chips are fabricated. All data cited in this release is inclusive of polished silicon wafers, including virgin test wafers and epitaxial silicon wafers shipped by the wafer manufacturers to the end-users. Data do not include non-polished or reclaimed wafers. For more information on the SEMI Worldwide Silicon Wafer Shipment Statistics, visit http://www.semi.org/en/MarketInfo/SiliconShipmentStatistics. About SEMI SEMI® connects over 2,000 member companies and 1.3 million professionals worldwide to advance the technology and business of electronics manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C. For more information, visit www.semi.org
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