Rambus Announces Tapeout of GDDR6 Memory PHY on TSMC 7nm Process Technology

Leading IP to support TSMC’s customers with AI, HPC, automotive and networking applications

SUNNYVALE and SANTA CLARA, Calif. – Jan. 30, 2019 – Rambus Inc. (NASDAQ: RMBS) today announced the tapeout of its GDDR6 PHY on TSMC 7nm FinFET process technology and is available from Rambus for licensing today. Leveraging almost 30 years of high-speed interface design expertise and using advanced process technology, Rambus has successfully taped out a GDDR6 PHY IP on TSMC 7nm process technology. With ongoing engagements among design and verification customers, GDDR6 is applicable to a broad range of high-performance applications including networking, data center, advanced driver assistance systems (ADAS), machine learning and artificial intelligence (AI). This fastest discrete memory interface from Rambus will add to TSMC’s large portfolio of silicon proven intellectual property (IP), design tools and reference flows.

Expanding beyond traditional GPU and graphic applications, GDDR6 helps to address market needs in multiple, high-bandwidth applications, as memory performance becomes more critical for overall system performance. This latest addition to the Rambus high-speed-interface IP portfolio highlights the company’s leadership and long tradition of signal- and power-integrity expertise, remaining at the forefront of innovation in interface technology. By providing the industry’s highest speed of up to 16 Gbps, while utilizing established packaging and testing techniques, GDDR6 offers system designers an alternative memory choice that is five times faster than traditional memory available today.

The Rambus GDDR6 offering will also add to TSMC’s portfolio of silicon-proven IP, via its Open Innovation Platform® (OIP) IP Alliance Program. In this program, TSMC’s IP and ecosystem partners like Rambus are able to tapeout and validate in silicon critical IP for TSMC’s various process nodes.

Benefits of the Rambus GDDR6 PHY:

• Provides the industry’s highest speed of up to 16 Gbps, providing a maximum bandwidth of up to 512 Gbps.
• Offers PCB and Package design support – allowing customers to quickly and reliably bring their high-speed designs to production.
• Delivers a timing-closed hard macro solution for easy ASIC integration.
• Provides access to Rambus system and SI/PI experts helping ASIC designers to ensure maximized signal and power integrity for devices and systems.
• Presents a LabStation™ development environment that enables quick system bring-up, characterization and debug.
• Supports high-performance applications including networking, data center, ADAS, machine learning and AI.

“By leveraging TSMC’s 7nm process technology, Rambus furthers its ability to offer first to market products and be on the leading edge of industry standards,” said Hemant Dhulla, VP and GM of IP Cores, Rambus. “We offer a complete system solution for integration, including PCB and package design, to help customers get to production faster. We’re excited to grow as a valuable ecosystem partner of TSMC and deliver a broad IP portfolio to maximize performance and flexibility for today’s most challenging systems.”

Availability

GDDR6 is available from Rambus today for licensing and integrating into system-on-chips (SoCs).

Demonstration Details at DesignCon 2019

At DesignCon from Jan. 29 – Jan. 31, 2019 in Santa Clara, California, Rambus will demonstrate a memory channel signaling at GDDR6 speeds. Rambus will also present, “Memory Options for High Performance Applications,” starting at 9:05 am PT on Jan. 30 in the room, “Great America 3,” that will discuss GDDR6 and other leading technologies. Visit Rambus at Booth 837 to learn more about GDDR6 applications.

For more information on our latest Rambus GDDR6 high speed memory offerings on TSMC, please visit https://www.rambus.com/gddr6.