AGIC C-Fuse OTP High-Temperature-Immunity Tailored for AEC-Q100 Grade 0 Applications

September 12, 2019 — AGI Corporation (AGIC), a leading-edged logic-compatible one-time programmable (OTP) memory IP provider specialized in automotive, AIoT and edge computing solutions, announced that AGIC C-Fuse OTP macros are tailored for AEC-Q100 Grade 0 applications that require high reliable operation and long-life data retention in high-temperature environments.

Expertise in analog/mixed-signal IC production focus on high-growth automotive, medical and industrial end markets with long lifecycles. The crucial challenge for IC designers is designing and implementing electronic devices that compliant with stringent automotive requirements; high reliability, small area, high temperature immunity, and low power. In addition to the system itself, OTP IP and its integrated components must also meet the same requirements.

According to Automotive Electronics Council, the standard for Integrated Circuit (IC) is AEC-Q100. For device containing Non-Volatile Memory (NVM), endurance preconditioning must be performed before High-Temperature Operating Life (HTOL) at -40°C to 150°C. This level of qualification supports customers requiring devices to conform to AEC-Q100 Grade 0 specifications. Figure 1. Shows the overview of typical NVM applications in modern cars, especially in high-temperature environment (close to engine, exhaust etc.).

Figure 1. High temperature spots in different zones of a car

(source: www.eetimes.com)

High Reliability NVM Adopts APM Programming Mechanism

Different from other NVM programming methods that use high current to explode either poly fuse or metal fuse, or by rupturing device’s oxide. C-Fuse OTP memory uses AGIC Particle Momentum (APM) to control atom movement in semiconductor.

APM programming mechanism can change the uniformity of atoms as the PGM temperature above the stable temperature of thermal stability of common silicide materials and below the silicon melting point (1,414°C). Take CoSi₂ in CMOS process for instance, its stable temperature on Si is 950°C. With key know-how of well-controlled energy, the PGM temperature can be monitored between 950°C and 1,414°C to complete on-field programming. Once the temperature is below the thermal stability of CoSi₂, which is 950°C, the distribution of atoms will be fixed forever. Unless the read mode or PGM mode temperature surpass the thermal stability of such silicide materials.

C-Fuse contains features of High-Temp Immunity (>650°C~1000°C) and high reliability from -55°C to 175°C that do not need additional masks, additional process steps, or Charge-Pump, which are the cost and the issues from traditional AntiFuse, EEPROM, Floating Gate NVM and e-Fuse. It is a robust technology serving automotive needs such as high temperature, power efficient for OTP IP solutions.

AGIC Technology C-Fuse OTP Provides Following Benefits:

1. High-Temp Immunity (>400°C~1000°C).

2. Portable across all process nodes including CMOS Logic, BCD, eHV, DRAM, etc.

3. No additional masks.

4. No additional steps.

5. No special/material requested.

6. Support geometry from 350 nm to 5 nm and beyond.

7. Qualification for AEQ-100 Grade 0 requirements.

8. MLC feature for high security requirement.

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