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austriamicrosystems announces its Multi Product Wafer Service for CMOS, High Voltage and RF ProcessesUnterpremstätten - February 17, 2003 - austriamicrosystems provides a cost-efficient and fast ASIC prototyping service by combining several designs from different customers onto one wafer. This approach, known as Multi-Project Wafer (MPW) or shuttle run, allows to share the costs for wafer and masks among a number of customers.
The customer delivers GDSII-Data's at fixed dates and receives untested packaged samples within a lead-time of typically 8 weeks for CMOS processes, 10 weeks for High Voltage CMOS, BiCMOS and SiGe-BiCMOS processes. All MPW-Runs will be produced at the new 8 inch wafer fab in Unterpremstätten, Austria.
In addition to the proven 0,8µm mixed signal processes in CMOS, BiCMOS, SiGe BiCMOS and High Voltage CMOS austriamicrosystems offers this process portfolio also in 0.35µm. The 0.35µm CMOS process is licensed from TSMC and therefore 100% compatible. austriamicrosystems' 0.35µm Silicon-Germanium BICMOS technologies enable RF circuits with an operating frequency of up to 10 GHz combined with high-density digital parts on one single ASIC.
Advanced Design-Kits for CADENCE, MENTOR Graphics and Agilent ADS design environments are available for the mentioned technologies. These design kits include high precision simulation models, libraries of transistors and passive devices, logic gates, peripheral cells and simulation models for several packages.
In addition to standard prototype services austriamicrosystems is offering analog IP blocks, memory (RAM/ROM) generation service and packaging services in ceramic or plastic.
austriamicrosystems Full Service Foundry has successfully positioned itself in the mixed signal foundry market offering well-established RF CMOS, High Voltage CMOS, BiCMOS and SiGe-BiCMOS processes. With superior support during the design phase, with high end tools and experienced engineers, austriamicrosystems About austriamicrosystems
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