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TricCN interface technology validated as "Ready for IBM Technology"Broad Range of High-Performance I/O Interface Products To Be Featured In IBM's Global Solutions Directory SAN FRANCISCO, CA – April 14, 2003 – TriCN, a leading developer of intellectual property (IP) for high-speed I/O interface technology, today announced that it has validated a broad range of TriCN products as "Ready for IBM Technology". This designation signifies to potential customers that these TriCN high-performance interface products are qualified as compatible with IBM's 0.13um CMOS foundry process technology. TriCN products included in this classification range from Base level I/O cells to multi-gigabit interface products. IBM's "Ready for IBM Technology" solutions are designed to help OEM customer's speed time to market, reduce development risk, lower development costs, and improve return on investment. The "Ready for IBM Technology" mark identifies solutions that have been tested and validated for compatibility with IBM Microelectronics products by the solution developers and assures that these solutions are compatible with IBM Microelectronics products. IBM Business Partners who are validated will be marketed visibly in the Global Solutions Directory http://www.software.ibm.com/solutions/isv - making it easier for customers to find solutions quickly and easily with the designation "Ready for IBM Technology". "We are extremely pleased to have our interface IP validated as ‘Ready for IBM Technology'," says Ron Nikel, Chief Technology Officer with TriCN. "Customers developing new chips now have complete assurance that TriCN's high-performance interface products are fully compatible with IBM's 0.13um foundry process. We expect this IBM initiative to significantly broaden the market opportunities for their foundry business, and for TriCN as well." Initial products in TriCN's "Ready for IBM Technology" offering include Base I/O cells such as HSTL, SSTL-2, PCI 2.2, PCI-X, LVTTL, and LVCMOS; TriCN's Multi-Function I/O (MFI/O), which self-configures upon power-up to operate as an HSTL, SSTL-2 or LVTTL I/O; a mixed signal DLL; and a number of TriCN's Interface Specific I/Os, including DDR SRAM, QDR SRAM, RLDRAM, DDR SDRAM, SDR SDRAM, SPI-4.2, SFI-4.1, NPSI, and CML. All products are available in the IBM 0.13um CMOS foundry process. About IBM Microelectronics IBM is a recognized innovator in the chip industry, having been first with advances like more power-efficient copper wiring in place of aluminum, faster silicon-on-insulator (SOI) and silicon germanium transistors, and improved low-k dielectric insulation between chip wires. These and other innovations have contributed to IBM's standing as the number one U.S. patent holder for 10 consecutive years. More information about IBM Microelectronics can be found at: http://www.ibm.com/chips. About TriCN For more information, please visit TriCN's web site at www.tricn.com.
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