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Artisan And UMC Collaborate On PCI Express Compliant 0.13-Micron PHY CoreCore will expand relationship to system-level IP SUNNYVALE, Calif., and HSINCHU, Taiwan -- May 29, 2003 -- Artisan Components, Inc., (Nasdaq: ARTI), a leading provider of physical intellectual property (IP), and UMC (NYSE: UMC), a world leading semiconductor foundry, today announced that the long-term IP collaboration between the two companies is now focused on the development of a PCI-Express PHY IP core for 0.13-micron chip designs. The new core will be based on the PCI Express Architecture that has been proposed by the PCI-SIG (PCI Special Interest Group), which owns and manages PCI specifications as open industry standards. Jackson Hu, president of the New Business Development Group and head of Design Support Division at UMC said, "We are pleased with the collaborative efforts with Artisan regarding the availability of the 0.13-micron PCI-Express PHY core. The PCI Express open architecture to which this offering will comply will help designers to more easily integrate the core into their 0.13-micron product designs. This product will be a valuable asset for our customers that require a core that offers the benefits of high performance and design flexibility." Callan Carpenter, vice president and general manager of the Analog and Mixed Signal Business Unit at Artisan noted, "UMC continues to be an excellent foundry partner for Artisan and we are pleased to be working with UMC on the PCI-Express PHY. This serial link product is based on our silicon-proven XAUI compatible SerDes Core, allowing us to meet or exceed the PCI Express specifications. The PHYs modular architecture can enable a broad range of computing and communications target applications emphasizing performance, cost and scalability." About the PCI Express PHY About Artisan Components About UMC UMC (NYSE: UMC, TSE: 2303) is a leading global semiconductor foundry that manufactures advanced process ICs for applications spanning every major sector of the semiconductor industry. UMC delivers cutting-edge foundry technologies that enable sophisticated system-on-chip (SOC) designs, including 0.13um copper, embedded DRAM, and mixed signal/RFCMOS. UMC is also a leader in 300mm manufacturing; Fab 12A in Taiwan is currently in volume production for a variety of customer products, while the Singapore-based UMCi joint venture with Infineon Technologies will begin pilot production later this year. UMC employs over 8,500 people worldwide and has offices in Taiwan, Japan, Singapore, Europe, and the United States. UMC can be found on the web at http://www.umc.com. ### Artisan Components is a registered trademark and Process-Perfect is a trademark of Artisan Components, Inc. All other trademarks or registered trademarks are the property of their respective owners. Safe Harbor Statement This press release contains forward-looking statements, including statements regarding the availability of Artisan's PCI Express PHY IP core in the fourth quarter of 2003 and the characteristics of such product. Actual results may differ materially. These statements are subject to various risks and uncertainties, including whether there will be technical or other difficulties that delay or prevent the availability of Artisan's PCI Express PHY IP core, technical or other difficulties inherent in the design and manufacture of semiconductors, and market acceptance of Artisan's PCI Express PHY IP core. We refer you also to the documents that the Company files from time to time with the Securities and Exchange Commission, in particular the section entitled "Factors Affecting Future Operating Results" in the Company's annual report on form 10-K and its quarterly reports on Forms 10-Q. Artisan disclaims any obligation to update or correct the information contained in this press release as a result of financial, business or any other developments occurring after the date of the release. Note From UMC Concerning Forward-Looking Statements Some of the statements in the foregoing announcement are forward looking within the meaning of the U.S. Federal Securities laws, including statements about future outsourcing, wafer capacity, technologies, business relationships and market conditions. Investors are cautioned that actual events and results could differ materially from these statements as a result of a variety of factors, including conditions in the overall semiconductor market and economy; acceptance and demand for products from UMC; and technological and development risks.
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