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Basecomm Joins IBM Business Partner ProgramBasecomm Pte Ltd today announced it is an approved IBM Business Partner providing design solutions for customers using IBM technologies. SINGAPORE, June 10, 2003 - Basecomm Pte Ltd, a technology solution provider for RF & Wireless IC designs, today announced that it has become an IBM Business Partner to provide design solutions for IBM's silicon germanium (SiGe) BiCMOS and RFCMOS foundry technologies. This is Basecomm's first milestone toward providing a validated "Ready for IBM Technology" design solution for IBM foundry customers (see IBM's April 9, 2003, press release "Ready for IBM Technology" program for semiconductor products expanded). "We are excited to be part of this program. Basecomm plans to validate its design centre with IBM's technologies by year end. The validation will be a formal testament to our strong design capability in the RF & Wireless IC design arena and a symbol of recognition from a leading industry provider, IBM Microelectronics." said David M Fogg, President & Chief Executive Officer of Basecomm and Nano Silicon. After undergoing a stringent suite of silicon verification/qualification requirements, Basecomm customers will be able to channel all their energy to developing creative and innovative technologies with a peace of mind that design implementations are in good hands.
PartnerWorld is a worldwide marketing and enablement program for IBM Business Partners.IBM Business Partner solutions are listed in the Global Solutions Directory (GSD) at http://www.software.ibm.com/solutions/isv. About Basecomm Basecomm is an FTD company. The FTD group provides the full array of services related to the semiconductor industry, from concept to design to product development and training. It is a leading technology provider in the Asia-Pacific region. About IBM Microelectronics IBM is a recognized innovator in the chip industry, having been first with advances like more power-efficient copper wiring in place of aluminum, faster silicon-on-insulator (SOI) and silicon germanium transistors, and improved low-k dielectric insulator between chip wires. These and other innovations have contributed to IBM's standing as the number one U.S. patent holder for 10 consecutive years. More information about IBM Microelectronics can be found at: www.ibm.com/chips.
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