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MoSys to port 1T-SRAM-Q technology to UMC's 0.13-micron and 90-nanometer processesQuad density memory technology to be offered on UMC's advanced logic processes SUNNYVALE, Calif., July 14, 2003 – MoSys, Inc. (NASDAQ: MOSY) the industry's leading provider of high density SoC embedded memory solutions, today announced it will port its innovative quad density 1T-SRAMÒ-Qä technology to UMC's 0.13-micron and 90-nanometer logic processes. This extends the existing cooperation between the companies to offer additional optimized high-density memory solutions to UMC's foundry customers, which already include the 0.13-micron silicon proven 1T-SRAM-R. "We are pleased to cooperate with UMC for the support of our 1T-SRAM-Q technology," noted Mark-Eric Jones, vice president and general manager of Intellectual Property at MoSys. "This addition broadens the range of options for UMC's foundry customers requiring integration from one to hundreds of megabits of SRAM in their SoCs." MoSys' 1T-SRAM-Q technology achieves its exceptional density by using bit cells of just 0.5-square microns in the 0.13-micron logic process and 0.28-square microns in the 90-nanometer logic process. Using only one additional, non-critical mask on the standard logic process, 1T-SRAM-Q enables cost-effective integration of large amounts of SRAM on SoC designs without any change to the other logic IP blocks or libraries ABOUT MOSYS ### Note for Editors:
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