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Silicon & Software Systems (S3) announce availability of Mixed Signal IP for IEEE 802.11 IC DesignsDublin, Ireland, 12th September 2003 - , a leading supplier of mixed signal circuit solutions, today announced the availability of a range of IP for the analog front-end section of IEEE802.11a/b/g ICs. This IP is silicon-proven on TSMC's 0.18um CMOS process and has been characterized for applications in the multi-band WLAN market. In a highly competitive market such as the WLAN chip sector, IC designers are facing schedules of less than 12 weeks from specification to tape-out including full chip integration. Many are turning to specialist design houses, such as S3, for fully characterized silicon upon which to base their designs. S3's IP can be delivered in matched "I&Q" pair configurations - ensuring minimum chip finishing requirements. "Our customers are keen to use S3's IP to accelerate their chip integration and design cycle times," said Bob Tait, Product Marketing Manager at S3. "Using S3's IP removes significant risk from 802.11 WLAN product developments. This allows valuable engineering effort to be focused on clear differentiation in the system product design." S3 will present their complete mixed signal portfolio at the TSMC Europe Technology Symposium, Brussels, on September 23rd next. About Silicon & Software Systems Ltd. (S3) S3 delivers leading edge design solutions in the areas of Wireless Connectivity (Bluetooth, 802.11, Zigbee, etc.) and Digital Telephony (GSM, 3G, DECT, PHS, etc.). These solutions are enabled by S3's wide variety of expertise in areas such as embedded Wireless SoC design, system integration, embedded software and lower layer software development. S3 provides solutions for both OEMs and IC vendors including hardware reference designs. The company specializes in the integration of wireless technologies into end products for both the consumer and enterprise markets. S3 web site: www.s3group.com
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