PORTLAND, ORE. — June 14, 2004 — OCP-IP today announced that the OCP interface is at the heart of the new OMAP™ 2 “All-in-One-Entertainment” architecture from Texas Instruments Incorporated (TI). The announcement represents the world’s largest point usage for the OCP interface. Specifically targeting 2.5G and 3G mobile phones, the OMAP 2 architecture is the second generation of the processors to utilize the OCP interface; previous generations include the OMAP16xx and OMAP17xx product series.
Using OCP in OMAP chips allows TI designers to build their cores independent of specific bus protocols, and of any particular design implementation. This allows easier reuse of OCP-compliant cores across multiple SoC designs. OCP eliminates the need to repeatedly modify the core itself, and preserves the verification and test benches by defining all the core’s natural interface capabilities to be presented in an unchanging, universally understood manner. The latest OMAP 2 processor contains more than fifty OCP-compliant building blocks. Previous generations of OMAP processors utilizing the OCP standard have been selected into many multimedia smartphone models.
TI is a Governing Steering Committee member of OCP-IP. Demonstrating its support for open standards and specifications, TI developed OMAP 2 chips in compliance of the OCP specification.
“The advantage of using OCP is the dramatically improved IP core reusability, which leads directly to a more predictable and more productive platform-based methodology for SoC design,” said Franck Seigneret, TI representative to the OCP-IP Governing Steering Committee. “By developing the OMAP2 architecture in compliance with the OCP specification, TI has achieved a very flexible architecture that enables TI to easily mix and match building blocks to quickly address different market needs and time to market.”
“Standards are only proven through real-world implementations, and many of our founding members, companies with world-class SoC design expertise, have adopted OCP and applied it in production SoC designs,” said Ian Mackintosh, president OCP-IP. “With millions of units already shipped, the use of OCP in TI OMAP architecture is a prolific illustration that OCP is the industry standard.”
About OCP-IP
The OCP International Partnership Association, Inc. (OCP-IP) was announced in December 2001 to promote and support the open core protocol (OCP) as the complete socket standard that ensures rapid creation and integration of interoperable virtual components. OCP-IP's Governing Steering Committee participants are: Nokia [NYSE: NOK], Texas Instruments [NYSE: TXN], STMicroelectronics [NYSE: STM], United Microelectronics Corporation [NYSE: UMC], Toshiba Semiconductor Group (including Toshiba America TAEC), Sonics, and other industry leading companies. OCP-IP is a non-profit corporation delivering the first fully supported, openly licensed core-centric protocol that comprehensively fulfills system-level integration requirements. The OCP facilitates IP core reusability and reduces design time and risk, along with manufacturing costs for SoC designs. VSIA endorses the OCP socket, and OCP-IP is an Adoption Group of the VSI Alliance.
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