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Synopsys Introduces Industry's First 90 Nanometer USB 2.0 On-The-Go PHY and Extends Its Hi-Speed USB PHY to 90 Nanometer NodeSilicon-Proven PHY Cores Expand Industry-Leading DesignWare USB IP Portfolio MOUNTAIN VIEW, Calif., August 30, 2004 - Synopsys, Inc. (Nasdaq:SNPS), the world leader in semiconductor design software, today announced the availability of the DesignWare® USB 2.0 On-The-Go (OTG) PHY (Physical Layer) Core targeted to TSMC's 90 nanometer (nm), 130-nm and 180-nm processes as well as an extension of the Hi-Speed USB 2.0 PHY Core product line to the 90-nm process node. The DesignWare USB 2.0 OTG PHY is the industry's first 90-nm USB OTG PHY Core. The DesignWare USB 2.0 OTG PHY is interoperability tested and jointly certified with Synopsys industry leading digital USB cores, thus providing a complete drop-in solution with lower cost, form factor and risk. These 90-nm product introductions complement Synopsys' certified Hi-Speed USB 2.0 PHYs currently in volume production on TSMC's 180-nm and 130-nm processes. The new USB PHYs, which are complete physical layer interface cores compliant with the USB 2.0 OTG standard that provide an integrated solution that has been implemented in silicon and tested with Synopsys' leading family of digital USB intellectual property (IP) cores, including the DesignWare Hi-Speed OTG controller, Host Controller and Device Controllers. The new OTG PHY handles HNP (host negotiation protocol) and SRP (session request protocol), which are the OTG-specific differences between the Hi-Speed 2.0 and the new OTG standard. Available targeted to TSMC's 180-nm, 130-nm and 90-nm processes, the OTG solution is based on the Synopsys USB 2.0 PHY that is already certified and shipping in volume. USB OTG is a supplement to the USB 2.0 specification that increases the capability of existing mobile devices and USB peripherals by adding host functionality for connections to USB peripherals. Many of the new peripherals connected to PCs and laptops are portable devices. As these portable devices increase in popularity, there is a growing need for them to communicate directly with each other when a PC is not available. The OTG supplement addresses this need for mobile inter-connectivity and defines a way for portable devices, through only one mini-connector, to connect to supported USB products in addition to the PC. "With the introduction of our USB 2.0 OTG PHY, designers can speed integration and reduce risk when designing a complete digital and mixed-signal OTG solution targeted to TSMC's most popular foundry processes," said Guri Stark, Synopsys' vice president of Marketing, Solutions Group. "For designers at the leading edge of system design, our Hi-Speed USB 2.0 PHY and USB 2.0 OTG PHY in TSMC's 90-nm process enable them to achieve USB 2.0 connectivity based on our USB-certified PHY architectures proven at 180-nm and 130-nm. Our complementary DesignWare USB PHY and digital IP solutions give designers a one-stop shop and help them lower design risk with proven, interoperable solutions." Pricing and Availability About DesignWare Cores About Synopsys
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