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Xilinx Teams with Ansoft for Faster and Easier High-Speed Printed Circuit Board and Backplane Design10 Gbps Interconnect Design Kit Supports Xilinx Virtex-II Pro X Series FPGAs SAN JOSE, Calif., October 25, 2004 — Xilinx Inc. (NASDAQ: XLNX) and Ansoft Corp. (NASDAQ: ANST) today announced a new Gigabit Interconnect Design Kit that allows customers to perform extremely accurate “what if” analyses on high-speed printed circuit board (PCB) and backplane designs. Powered with Virtex-II Pro™ X series FPGAs from Xilinx, the kit enables engineers to anticipate problems early in the design phase and predict the quality of a signal, thereby significantly minimizing lab debug times and costly board respins. “The Xilinx modular FPGA technology combined with Ansoft’s simulation expertise is required for today’s devices with serial I/O speeds up to 10 Gbps,” said Dr. Larry Williams, director, Business Development at Ansoft. “Together, Xilinx and Ansoft are leading the industry in realizing right-the-first-time, high-speed designs.” According to Ed McGettigan, director, APD Systems Engineering at Xilinx, “The growing popularity of FPGA platform solutions with multi-gigabit I/O functionality has led to architectures that place greater demands on PCB designs. Extremely accurate signal-integrity design for proper system operation is required. The ‘what-if’ analyses from Ansoft provide an extra edge relative to simulating all circuit behavior, ensuring that our customers are making the right decisions early in the design process.” Significant signal degradation occurs after passing through the transmission path, including loss of signal amplitude, reduction of signal rise time and a spreading at the zero crossings. Given this backdrop, it is imperative to accurately model the transmission path when designing a high-performance, high-speed, serial interconnect system to ensure optimal performance. Xilinx teamed with Ansoft to provide methods and guidelines for modeling high-speed interconnect. Accurate electrical models that account for the physical effects have been created for the Xilinx Virtex-II Pro X IC package, microstrip and stripline transmission lines, connectors and circuit board via using electromagnetic-field simulation. The full channel response—from the integrated circuit through the package, onto the board and out the connector—was computed using Ansoft’s Nexxim™, DesignerSI™ and HFSS™ for circuit, system and electromagnetic simulation. The Gigabit Interconnect Design Kit is based on the Xilinx MK322 Platform, the primary circuit board used for the electrical evaluation and characterization of the RocketIO™ X high-speed serial multi-gigabit transceivers in Virtex-II Pro X FPGAs. The design kit is a virtual evaluation board that allows PCB and backplane designers to simulate their specific design and requirements. Because all critical variables are parameterized, use of the design kit enables simulation of topologies that are different from that on the MK322 board. Combined with the Virtex-II Pro X driver and receiver models—with programmable pre-emphasis levels, voltage swing and receive side equalization—this approach allows for complete virtual prototyping of the individual channels in very-high-data-rate systems. The kit currently supports Xilinx Virtex-II Pro X FPGAs and is scaleable to support Virtex-4™ FPGAs. Parameterized models associated with this effort have been assembled into the design kit and are available on www.gigabitbackplanedesign.com along with associated presentations and white paper. About Xilinx Virtex-II Pro X FPGAs About Virtex-4 FPGAs Virtex-4 FX platform devices embed up to two 32-bit RISC PowerPC™ processors delivering in excess of 1300 Dhrystone MIPS along with up to four integrated 10/100/1000 Ethernet MAC cores for high-performance embedded processing applications. A new Auxiliary Processor Unit (APU) provides an intimate connection between the processors and the FPGA hardware resources – enabling a new class of flexible yet extremely high-performance integrated software/hardware designs. FX platform devices also include up to 24 RocketIO high-speed serial transceivers supporting the industry’s widest performance range of 622 Mbps to 11.1 Gbps for industry-leading levels of high-speed serial performance. All key high-speed serial performance levels are supported including 10.3125, 8.5, 6.25, 4.25, 3.125, 2.5, 1.25 and 0.622 Gbps. About Ansoft About Xilinx
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