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Synopsys Reduces Area and Power With Lowest Gate Count, Modular Hi-Speed USB On-The-Go Core
Builds on Market Leading DesignWare Hi-Speed USB IP Solutions
MOUNTAIN VIEW, Calif. - February 7, 2005 - Synopsys, Inc. (Nasdaq:SNPS), a world leader in semiconductor design software, today announced the release of its DesignWare® Hi-Speed Universal Serial Bus (USB) On-The-Go (OTG) controller core, the lowest gate count IP available on the market. The core lowers per-chip cost with reduced area and power requirements. As part of the only complete IP solution for USB, which includes Synopsys' digital cores, mixed-signal physical interface (PHY) cores and verification intellectual property (VIP), the DesignWare IP solution reduces designer risk. The core is a modular version of earlier silicon-proven DesignWare Hi-Speed USB and OTG cores. The modular core allows designers to select the specific features to match their applications and then use the included Synopsys coreConsultant tool to automatically optimize the core. USB OTG enables "outside-the-box" connectivity with hot-swap capability for industrial, consumer, embedded, PC and PC peripheral products. "This configurable, optimized version of our silicon-proven DesignWare Hi-Speed USB OTG IP allows designers to add OTG functionality while minimizing silicon area," said Eric Huang, product marketing manager, Synopsys DesignWare USB IP. "This saves both chip cost and power, making the Synopsys' USB OTG core a cost-effective solution for designers wanting to add USB functionality to their designs." Synopsys continues to lead the way in risk reduction by participating in the first Hi-Speed USB OTG testing, which will be held by the USB Implementers Forum in February 7-11, 2005 in Milpitas, California. Huang also serves as chair of the On-The-Go Working Group, the USB-IF committee that develops the OTG specifications. Availability About DesignWare Cores About Synopsys Synopsys and DesignWare are registered trademarks of Synopsys, Inc. All other trademarks or registered trademarks mentioned in this release are the intellectual property of their respective owners.
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