Experienced Industry Veteran Seiji Miwa Appointed President of eASIC Japan

eASIC Recognizes the Significant Opportunity in Japan and Attracts Industry Veteran with Track Record of Success to Manage Operations and Accelerate Growth

San Jose, California, February 9, 2005 -- eASIC^® Corporation, a provider of Configurable Logic and Structured ASIC products, today announced the appointment of Seiji Miwa to the new position as President of eASIC Japan. Miwa-san will oversee all of eASIC’s operations in Japan, including sales, marketing and business development. He will report to Salah Werfelli, Executive Vice President of Strategic Business Worldwide. In conjunction with this appointment, eASIC has opened an office in Tokyo in response to the increasing need from Japanese customers for a viable low-cost and fast-turn ASIC solution such as provided by the eASIC’s patented Structured eASIC and configurable logic technology.

Seiji Miwa has over 40 years of experience in the electronics industry. During this period he has developed strong relationships with the top management of leading Japanese semiconductor companies. Before joining eASIC, he served as President of AmmoCore Japan. Previously, he was chairman and President of Magma Design Automation, K.K. Japan. And prior to Magma, Miwa-san served as President and then Chairman at Cadence Design Systems, K.K. Japan. Miwa-san moved his career to chip design and test when he joined the Japanese subsidiary of Teradyne as a Vice President. Earlier in his career, Miwa-san held several management positions at Topre Corp, including Board member, Executive VP of R&D, General Manager of New Business Units including Automotive.
Miwa-san received a degree in Economic and Business Management from the University of Kyushu and Business Consulting certificate from the Industrial Productivity Institute.

“We are very pleased to have such an experienced industry veteran join eASIC,” said Zvi Or-Bach, eASIC Founder and CEO. “Miwa-san brings an extraordinary record of accomplishment as both sales and business development executive. I am confident that his proven capabilities in addition to his strong relationships with major Japanese customers will help eASIC achieve its aggressive growth plan in Japan. The Japanese market is a key part of our global business development plan and the appointment of the company’s first local President marks a great step forward.”

“I’m very excited to join eASIC and have the opportunity to offer its breakthrough configurable logic products to the Japanese market,” said Seiji Miwa. “There is clearly an increasing need for an alternative ASIC methodology that can overcome the high cost barrier for ASIC designs as well as offer rapid time-to-market. In today’s sub-micron environment, the existing solutions can no longer provide the required cost-performance benefit. eASIC has a unique solution that has already gained a lot of attention and customer interest. The ability to wave the NRE cost while maintaining high performance and quick turnaround time is very compelling. The Japanese market is eager for such an innovative configurable logic technology and I am keen to offer this solution to leading OEMs.”

About eASIC

eASIC^® has developed a breakthrough Configurable Logic technology aimed at dramatically reducing the overall fabrication cost and time of customized high-performance semiconductor chips. Its Structured eASIC architecture enables rapid and low-cost ASIC and SoC (System-on-Chip) designs by innovative use of proven programmable logic fabric in conjunction with single-via customizable segmented routing. As single-via generates ten times higher throughput of Direct-write e-Beam customization, it enables eASIC to offer NRE-free Structured ASIC. The Structured eASIC technology was successfully proven in silicon and validated by world-class semiconductor vendors. Partnering with industry leaders to jointly develop, manufacture and market Structured ASIC products, the company is positioned to become the preferred Structured ASIC solution.

eASIC Corporation is a privately held company, Venture Capital backed by Kleiner Perkins Caufield and Byers. Headquartered in San-Jose, California, eASIC was founded in 1999 by Zvi Or-Bach, the founder of Chip Express.
www.eASIC.com

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2005 eASIC Corporation. All rights reserved. All company and/or product names may be trade names, trademarks and/or registered trademarks of the respective owners with which they are associated. Features, pricing, availability, and specifications are subject to change without notice.