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Deals / Success Stories News

• Omni Design Technologies extends partnership with EnSilica and expands Swift™ Data Converter IP portfolio (Monday Sep. 23, 2024)
  The companies are expanding their collaboration where Omni Design’s advanced multi-gigahertz Swift™ data converters and supporting cores are deployed in EnSilica’s turnkey ASIC solutions for advanced wireless communications and digital beamformer applications.
  
  
• RaaS, a collaborative initiative, adopted Menta's eFPGA technology for RaaS Edge Computing platform (Wednesday Sep. 18, 2024)
  Menta has delivered its best technology to the Research Association for Advanced Systems (RaaS).
  
  
• Cadence Tensilica HiFi 5 DSPs Used in NXP's Next-Gen Audio DSP Family (Wednesday Sep. 18, 2024)
  In a significant achievement for the automotive industry, Cadence's Tensilica HiFi 5 Digital Signal Processors (DSPs) are now a key component in NXP® Semiconductors' latest automotive audio DSP family
  
  
• Omni Design Technologies Partners with Aura Intelligent Systems on Next Generation Radar (Monday Sep. 16, 2024)
  Under the partnership agreement, Omni Design is providing custom, advanced Swift™ data converters, analog front-end (AFE), and supporting IP solutions.
  
  
• Rivos Selects Andes NX45 for Control Functions in Upcoming High-Performance RISC-V SoC (Wednesday Sep. 11, 2024)
  NX45 Becomes the Only RISC-V Core to Pass Rivos’ Rigorous Verification Process After Extensive Evaluation of Leading RISC-V Cores
  
  
• Arteris Interconnect IP Selected by VeriSilicon for High-Performance SoC Design (Tuesday Sep. 10, 2024)
  Arteris FlexNoC 5 interconnect IP physical awareness feature enhances timing closure, alleviates wire congestion and reduces design iterations for more reliable chip design
  
  
• intoPIX and BCnexxt Join Forces to Revolutionize Live Playout with JPEG XS Technology (Tuesday Sep. 10, 2024)
  intoPIX, the leading expert in innovative video compression solutions, is proud to announce the integration of its revolutionary JPEG XS technology into BCnexxt's playout platform, Vipe.
  
  
• EXTOLL collaborates with PsiQuantum as a Key Partner for High-Speed SerDes IP (Tuesday Sep. 10, 2024)
  EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by PsiQuantum as a key SerDes IP block supplier for its digital ASIC development.
  
  
• Tenstorrent and Movellus Form Strategic Engagement for Next-Generation Chiplet-Based AI and HPC Solutions (Monday Sep. 09, 2024)
  Movellus and Tenstorrent announced that Tenstorrent has licensed Movellus’ digital IP family as part of a strategic engagement, for its AI and HPC chiplets
  
  
• Qualitas Semiconductor Enters into Landmark the World's 1st 2nm MIPI DCPHY Licensing Agreement with Leading U.S. Fabless Company (Monday Sep. 09, 2024)
  Qualitas Semiconductor announced a groundbreaking licensing agreement with a major fabless company based in the United States. This agreement highlights Qualitas' cutting-edge 2nm GAAFET MIPI DCPHY IP solutions, designed to enhance SoC(System on Chip) design architecture.
  
  
• SiFive and Arkmicro Accelerate RISC-V Adoption in Automotive Electronics with SiFive's Automotive IP for the High-end SoC Market (Monday Sep. 02, 2024)
  Today SiFive, Inc. announced that it has licensed its SiFive Automotive RISC-V IP cores to Arkmicro Technologies (Shenzhen), accelerating the adoption of RISC-V in automotive electronics.
  
  
• Dolphin Design announces partnership with Fraunhofer IIS to enhance power management in edge AI (Tuesday Aug. 27, 2024)
  Dolphin Design announces a new strategic partnership with the Fraunhofer Institute for Integrated Circuits IIS, a research Institute and member of the European Union’s PREVAIL project consortium. This collaboration aims to push the boundaries of power management in next-generation edge AI (Artificial Intelligence) technologies.
  
  
• Everspin Announces a $9.25M Contract to Provide MRAM Technology for Strategic Radiation Hardened eMRAM Macro (Monday Aug. 19, 2024)
  Everspin Technologies today announced a new strategic contract with Frontgrade Technologies.
  
  
• Everspin Announces Contract to Provide MRAM Technology for Strategic Radiation Hardened FPGA (Monday Aug. 19, 2024)
  This contract is part of the third tranche of the $5.26 Million Strategic Radiation Hardened Contract awarded to QuickLogic
  
  
• AutoChips integrated multiple VeriSilicon's IPs in its intelligent cockpit domain control SoC (Wednesday Aug. 14, 2024)
  VeriSilicon today announced that AutoChips has adopted VeriSilicon’s high-performance IP portfolio in its new generation intelligent cockpit domain control SoC AC8025, including Neural Network Processing Unit (NPU) IP, Video Processing Unit (VPU) IP, and Display Processing IP.
  
  
• Qualitas Semiconductor Expands Licensing Agreement with Key South Korean Fabless company (Monday Aug. 12, 2024)
  QUALITAS SEMICONDUCTOR, a leading provider of high-speed interface IP, has entered into a substantial licensing agreement with a leading fabless company based in South Korea.
  
  
• M31 cooperates with Tower Semiconductor to develop advanced SRAM and ROM solutions for its 65nm Power Management Platform (Thursday Aug. 01, 2024)
  M31 Technology Corporation (M31), a leading global provider of silicon intellectual property (IP), announced a collaboration with Tower Semiconductor yielding the successful development of static random access memory (SRAM) and read-only memory (ROM) IP products using a 65nm process.
  
  
• FuriosaAI and GUC Partner on RNGD, the Most Efficient AI Accelerator for LLMs (Wednesday Jul. 31, 2024)
  FuriosaAI Inc. is pleased to announce its collaboration with GUC (Global Unichip Corporation) as a key partner on the second-gen AI accelerator, RNGD (pronounced “Renegade”), the most efficient data center accelerator for high-performance large language and multimodal models.
  
  
• Raaam signs lead licensee for SRAM replacement technology (Monday Jul. 29, 2024)
  Memory IP licensing startup Raaam Memory Technologies Ltd. (Petah Tikva, Israel) has signed a major fabless chip company as its lead partner to help it develop an alternative to static RAM.
  
  
• Ceva Bluetooth Low Energy and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor's Balletto Family of MCUs (Thursday Jul. 25, 2024)
  Balletto BLE 5.3 and Matter Wireless Microcontroller family features Neural Co-Processor for AI/ML Workloads targeting wireless audio and the smart home
  
  
• Comcores supports BAE systems as a key partner with JESD204C IP (Wednesday Jul. 24, 2024)
  Comcores, a leading provider of high-performance and silicon-proven digital IP cores is chosen by BAE Systems as a key partner for the STEAM PIPE project to supply JESD204C IP.
  
  
• STMicroelectronics Integrates Ceva Cellular IoT Platform in its NB-IoT Industrial Module (Thursday Jul. 11, 2024)
  Fully programmable certified ST87M01 LTE Cat-NB2 NB-IoT industrial module leverages Ceva-Waves Dragonfly NB-IoT platform IP to deliver ultra-reliable Low Power Wide Area Network (LPWAN) connectivity
  
  
• Frontgrade Gaisler Awarded ESA Contract to Qualify Spacecraft Avionics Microcontroller for Flight (Thursday Jun. 27, 2024)
  The European Space Agency (ESA) has awarded Frontgrade Gaisler, a leading provider of radiation-hardened microprocessors for space applications, a contract under the ARTES Core Competitiveness programme to qualify the GR716B microcontroller for flight.
  
  
• Tenstorrent Licenses Baya Systems' Fabric into next-generation AI and Compute Chiplet Solutions (Friday Jun. 21, 2024)
  Baya’s IP and software flow enables Tenstorrent and its partners to analyze, customize and deploy its intelligent compute platform for current and future workloads and deliver highly scalable chiplet solutions to meet the emerging demand.
  
  
• Primemas Selects Achronix Embedded FPGA Technology For System-on-Chip (SoC) Hub Chiplet Platform (Thursday Jun. 20, 2024)
  Achronix and Primemas today announced a collaboration to bring FPGA programmability to the Primemas suite of products. Primemas chose the Speedcore™ eFPGA IP from Achronix for the Primemas Hublet to support organizations requiring programmability and testing capabilities.
  
  
• Arteris Selected by Esperanto Technologies to Integrate RISC-V Processors for High-Performance AI and Machine Learning Solutions (Tuesday Jun. 11, 2024)
  CSRCompiler, an SoC integration automation software solution, enables faster time-to-market and energy-efficient designs for AI inference and HPC applications at a fraction of the cost
  
  
• Rain AI Unveils Andes Technology as Its RISC-V Partner (Monday Jun. 03, 2024)
  Andes Technology announces that Rain AI, a pioneer in compute-in-memory (CIM) technology, licensed Andes’ AX45MPV RISC-V vector processor.
  
  
• OPENEDGES' Memory Subsystem IPs Selected by ASICLAND for Next-gen AI Applications (Friday May. 31, 2024)
  OPENEDGES Technology, Inc. (OPENEDGES), the leading provider of memory subsystem IPs, is pleased to announce a recent licensing agreement with ASICLAND.
  
  
• MerlinTPS Partners with Bluespec to Provide Urgently Needed GPS Augmentation and Backup Without Satellites (Monday May. 27, 2024)
  Using Bluespec’s RISC-V processor, MerlinTPS will deliver new PNT security capabilities and accelerate time to market
  
  
• Dolphin Design teams up with Raspberry Pi for advanced chip power management (Monday May. 27, 2024)
  Dolphin Design and Raspberry Pi are proud to announce a groundbreaking partnership that leverages Dolphin’s cutting-edge power management solutions in the development of Raspberry Pi’s chip technology.