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Deals / Success Stories News

• Oriole Networks Selects EnSilica as ASIC Partner and Contract Award for Photonics Controller ASIC (Monday Nov. 11, 2024)
  EnSilica is pleased to announce that it has been selected by Oriole Networks, a developer of artificial intelligence (“AI”) optimisation technology, as its ASIC partner. EnSilica has also been awarded a contract for the design and supply of Oriole's Photonics Controller ASICs to be used in its optical network switch products.
  
  
• Tenstorrent Expands Deployment of Arteris' Network-on-Chip IP to Next-Generation of Chiplet-Based AI Solutions (Tuesday Nov. 05, 2024)
  
  
  
• PiMCHIP Deploys Ceva Sensor Hub DSP in New Edge AI SoC (Thursday Oct. 31, 2024)
  Ceva-SensPro2 DSP supports audio/video/sensor fusion processing in S300 edge computing chip for wearables, cameras, smart healthcare and more
  
  
• DENSO and U.S. Startup Quadric Sign Development License Agreement for AI Semiconductor (NPU) (Wednesday Oct. 30, 2024)
  Through the agreement, DENSO will acquire the intellectual property (IP) core license for Quadric's Chimera general purpose NPU (GPNPU) and the two companies will co-develop IP for an in-vehicle semiconductor.
  
  
• Arteris Selected by TIER IV for Intelligent Vehicles (Tuesday Oct. 29, 2024)
  FlexNoC 5 network-on-chip IP and Magillem Connectivity SoC integration automation software accelerate autonomous driving chip project timelines while meeting automotive functional safety and performance requirements and reducing the development risks.
  
  
• DeepComputing and Andes Technology Partner to Develop the World's First RISC-V AI PC with 7nm QiLai SoC, Featuring Ubuntu Desktop (Tuesday Oct. 22, 2024)
  Together, the two companies collaborate to develop the world’s first RISC-V AI PC, powered by Andes’ 7nm QiLai SoC.
  
  
• Fractile Licenses Andes Technology's RISC-V Vector Processor as It Builds Radical New Chip to Accelerate AI Inference (Tuesday Oct. 22, 2024)
  Andes Technology are proud to announce a partnership with Fractile, the company building the chips and systems needed to reach the next frontier of AI performance.
  
  
• EnSilica plc - Award of £2 million Controller ASIC Design Services Contract (Monday Oct. 21, 2024)
  EnSilica is pleased to announce that it has been awarded an ASIC design services contract with a prestigious supplier of power and propulsion systems used in the air, at sea, and on land (the “Contract”).
  
  
• EnSilica - Design and Supply contract award for a controller ASIC for automotive and industrial markets (Thursday Oct. 17, 2024)
  EnSilica, a leading chip maker of mixed signal ASICs (Application Specific Integrated Circuits), is pleased to announce that it has been awarded a design and supply contract for a mixed signal controller ASIC to be used in automotive and industrial motorised actuators.
  
  
• Successful tape out of Chip Interfaces' JESD204D IP by a tier 1 semiconductor company (Wednesday Oct. 16, 2024)
  Chip Interfaces is pleased to announce that the Industry’s first commercially available JESD204D IP core has been taped out with a Tier 1 semiconductor company
  
  
• SEMIFIVE Concluded Mass Production Contract for AI Chip with HyperAccel (Friday Oct. 11, 2024)
  SEMIFIVE has announced the conclusion of a contract with HyperAccel to develop a generative AI chip, Bertha, for mass production.
  
  
• Crypto Quantique collaborates with ADLINK to simplify and enhance device security in industrial PCs (Thursday Oct. 03, 2024)
  Crypto Quantique has announced a collaboration with ADLINK Technology Inc., a global leader in edge computing, to simplify the secure boot process for industrial PCs (IPCs) using its QuarkLink security platform.
  
  
• EXTOLL collaborates with Frontgrade Technologies for High-Speed SerDes IP (Wednesday Oct. 02, 2024)
  EXTOLL has been selected by Frontgrade Technologies, a leading provider of mission critical electronics for aerospace and defense, as a key SerDes IP block supplier for its ASIC development portfolio.
  
  
• SIAE Microelettronica Selects Ensilica as Key Partner to Design ASICs for Next-Generation Telecom Equipment (Thursday Sep. 26, 2024)
  SIAE MICROELETTRONICA has selected EnSilica to assist the design of Application-Specific Integrated Circuits (ASICs) for its next-generation telecommunication infrastructure products.
  
  
• EXTOLL collaborates with BAE Systems as a Key Partner for High-Speed SerDes IP (Thursday Sep. 26, 2024)
  EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by BAE Systems as a key partner for the STEAM PIPE project to provide a power-optimized very short-reach SerDes IP solution.
  
  
• GUC Announces Adoption of HBM3E IP by CSP Data Center (Tuesday Sep. 24, 2024)
  Global Unichip Corp. (GUC), the Advanced ASIC Leader, is pleased to announce that its 3nm HBM3E Controller and PHY IP have been adopted by a leading Cloud Service Provider (CSP) and several High-Performance Computing (HPC) solution providers.
  
  
• SigmaSense Teams Up with Dolphin Design to Deliver Power Efficiency in their Advanced SDC300 Touch Controller (Tuesday Sep. 24, 2024)
  Dolphin Design, the leader in Power management IP, and SigmaSense, the leader in direct-to-digital precision sensing, today announced a partnership to deliver Dolphin Design’s advanced power management solutions in the development of SigmaSense’s latest touch controller SDC300, now in volume production.
  
  
• Omni Design Technologies extends partnership with EnSilica and expands Swift™ Data Converter IP portfolio (Monday Sep. 23, 2024)
  The companies are expanding their collaboration where Omni Design’s advanced multi-gigahertz Swift™ data converters and supporting cores are deployed in EnSilica’s turnkey ASIC solutions for advanced wireless communications and digital beamformer applications.
  
  
• RaaS, a collaborative initiative, adopted Menta's eFPGA technology for RaaS Edge Computing platform (Wednesday Sep. 18, 2024)
  Menta has delivered its best technology to the Research Association for Advanced Systems (RaaS).
  
  
• Cadence Tensilica HiFi 5 DSPs Used in NXP's Next-Gen Audio DSP Family (Wednesday Sep. 18, 2024)
  In a significant achievement for the automotive industry, Cadence's Tensilica HiFi 5 Digital Signal Processors (DSPs) are now a key component in NXP® Semiconductors' latest automotive audio DSP family
  
  
• Omni Design Technologies Partners with Aura Intelligent Systems on Next Generation Radar (Monday Sep. 16, 2024)
  Under the partnership agreement, Omni Design is providing custom, advanced Swift™ data converters, analog front-end (AFE), and supporting IP solutions.
  
  
• Rivos Selects Andes NX45 for Control Functions in Upcoming High-Performance RISC-V SoC (Wednesday Sep. 11, 2024)
  NX45 Becomes the Only RISC-V Core to Pass Rivos’ Rigorous Verification Process After Extensive Evaluation of Leading RISC-V Cores
  
  
• Arteris Interconnect IP Selected by VeriSilicon for High-Performance SoC Design (Tuesday Sep. 10, 2024)
  Arteris FlexNoC 5 interconnect IP physical awareness feature enhances timing closure, alleviates wire congestion and reduces design iterations for more reliable chip design
  
  
• intoPIX and BCnexxt Join Forces to Revolutionize Live Playout with JPEG XS Technology (Tuesday Sep. 10, 2024)
  intoPIX, the leading expert in innovative video compression solutions, is proud to announce the integration of its revolutionary JPEG XS technology into BCnexxt's playout platform, Vipe.
  
  
• EXTOLL collaborates with PsiQuantum as a Key Partner for High-Speed SerDes IP (Tuesday Sep. 10, 2024)
  EXTOLL, a leading provider of high-speed and ultra-low-power SerDes and Chiplet connectivity, has been selected by PsiQuantum as a key SerDes IP block supplier for its digital ASIC development.
  
  
• Tenstorrent and Movellus Form Strategic Engagement for Next-Generation Chiplet-Based AI and HPC Solutions (Monday Sep. 09, 2024)
  Movellus and Tenstorrent announced that Tenstorrent has licensed Movellus’ digital IP family as part of a strategic engagement, for its AI and HPC chiplets
  
  
• Qualitas Semiconductor Enters into Landmark the World's 1st 2nm MIPI DCPHY Licensing Agreement with Leading U.S. Fabless Company (Monday Sep. 09, 2024)
  Qualitas Semiconductor announced a groundbreaking licensing agreement with a major fabless company based in the United States. This agreement highlights Qualitas' cutting-edge 2nm GAAFET MIPI DCPHY IP solutions, designed to enhance SoC(System on Chip) design architecture.
  
  
• SiFive and Arkmicro Accelerate RISC-V Adoption in Automotive Electronics with SiFive's Automotive IP for the High-end SoC Market (Monday Sep. 02, 2024)
  Today SiFive, Inc. announced that it has licensed its SiFive Automotive RISC-V IP cores to Arkmicro Technologies (Shenzhen), accelerating the adoption of RISC-V in automotive electronics.
  
  
• Dolphin Design announces partnership with Fraunhofer IIS to enhance power management in edge AI (Tuesday Aug. 27, 2024)
  Dolphin Design announces a new strategic partnership with the Fraunhofer Institute for Integrated Circuits IIS, a research Institute and member of the European Union’s PREVAIL project consortium. This collaboration aims to push the boundaries of power management in next-generation edge AI (Artificial Intelligence) technologies.
  
  
• Everspin Announces a $9.25M Contract to Provide MRAM Technology for Strategic Radiation Hardened eMRAM Macro (Monday Aug. 19, 2024)
  Everspin Technologies today announced a new strategic contract with Frontgrade Technologies.