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Deals / Success Stories News

• Actions Technology's smart watch SoC adopted VeriSilicon's 2.5D GPU IP (Wednesday May. 15, 2024)
  VeriSilicon today announced that Actions Technology (688049.SH), a low-power AIoT fabless semiconductor company, has adopted VeriSilicon’s power-efficient and feature-rich 2.5D Graphics Processor Unit (GPU) IP in its highly integrated dual-mode Bluetooth smart watch SoC series, ATS3085S and ATS3089.
  
  
• SAPEON Enhances AI Accelerator with proteanTecs Reliability and Performance Monitoring (Thursday May. 09, 2024)
  Deep data monitoring based on chip telemetry provides data centers with high compute, low power, and robust server-based AI inference
  
  
• Google Cloud Delivers Customized Silicon Powered by Arm Neoverse for General-Purpose Compute and AI Inference Workloads (Wednesday Apr. 10, 2024)
  Today, Google Cloud introduced custom Google Axion Processors, based on Neoverse V2, for general-purpose compute and AI inference workloads.
  
  
• Rebellions Selects Arteris for Its Next-Generation Neural Processing Unit Aimed at Generative AI (Tuesday Apr. 09, 2024)
  Arteris’ FlexNoC interconnect IP and Magillem SoC integration software enable superior performance and efficient customization of AI inference chips for the emerging Generative AI market and other AI applications.
  
  
• Ambiq and PUFsecurity Join Forces on Energy-Efficient, Security-Enhanced SoC with PUF-based Root of Trust (Tuesday Apr. 09, 2024)
  Ambiq, a globally recognized leader in ultra-low power semiconductors, and PUFsecurity, a subsidiary of eMemory dedicated to innovating PUF-based security IP solutions, announced a successful collaboration on Ambiq's latest Apollo510 integrated with PUFsecurity's PUF-based Root of Trust IP, PUFrt.
  
  
• Autotalks and Secure-IC Collaborate to Create the Most Secure V2X Communication Chipset (Tuesday Apr. 09, 2024)
  The collaboration is set to boost the cybersecurity of today’s V2X technology, which must be fortified to withstand potential cyberattacks, data breaches, and unauthorized access.
  
  
• ZeroPoint Technologies Signs Global Customer to Bring Hardware-Accelerated Compression to Hyperscale Data Centers (Tuesday Mar. 26, 2024)
  ZeroPoint Technologies AB today announced that it has licensed its DenseMem CXL memory expansion solution to a major global semiconductor manufacturer.
  
  
• Faraday Partnered with SONIX to Create a New Product Featuring Its SONOS eFlash Solution (Tuesday Mar. 26, 2024)
  Sonix adopted Faraday’s SONOS eFlash subsystem, which is specially designed to develop edge AI, smart grid, IoT, and MCU applications, to facilitate the integration of the eFlash function into the SoC without modifying the existing proven IP at 40ULP.
  
  
• Qualitas Semiconductor and Ambarella Sign Licensing Agreement (Tuesday Mar. 26, 2024)
  QUALITAS SEMICONDUCTOR has signed a licensing agreement with Ambarella. This collaboration is primarily focused on the next generation of autonomous driving vehicle safety systems, providing unprecedented levels of AI processing performance, power efficiency and reliability.
  
  
• ScaleFlux To Integrate Arm Cortex-R82 Processors in Its Next-Generation Enterprise SSD Controllers (Monday Mar. 25, 2024)
  ScaleFlux, a computational storage leader, has announced plans to incorporate the Arm® Cortex®-R82 processor into its next-gen enterprise SSD controllers, aiming to significantly boost processing power and efficiency.
  
  
• StarFive's RISC-V based JH-7110 intelligent vision processing platform adopted VeriSilicon's Display Processor IP (Thursday Mar. 21, 2024)
  VeriSilicon’s scalable and flexible DC8200 IP delivers display device adaptability and high-quality effects, offering immersive visual experience
  
  
• Canaan's RISC-V based edge AIoT SoC adopted VeriSilicon's ISP and GPU IPs (Thursday Mar. 14, 2024)
  VeriSilicon today announced the integration of its Image Signal Processor (ISP) IP ISP8000, DeWarp Processor IP DW200, and 2.5D Graphics Processor Unit (GPU) IP GCNanoV into Canaan’s K230 chip, the world’s first commercial mass production edge AIoT chip supporting the RISC-V Vector 1.0 standard.
  
  
• BrainChip Boosts Space Heritage with Launch of Akida into Low Earth Orbit (Tuesday Mar. 05, 2024)
  BrainChip, the world’s first commercial producer of ultra-low power, fully digital, event- based, neuromorphic AI, today saw its Akida™ AI technology launched into low earth orbit aboard the Optimus-1 spacecraft built by the Space Machines Company.
  
  
• VeriSilicon's industry-leading embedded GPU IP powers HPMicro's high-performance HPM6800 series RISC-V MCU (Monday Mar. 04, 2024)
  VeriSilicon today announced that HPMicro’s HPM6800 series, a new generation digital dashboard display and human-machine interface system application platform has adopted VeriSilicon’s high-performance 2.5D Graphics Processor Unit (GPU) IP.
  
  
• VeriSilicon NPU IP is shipped in over 100 million AI-enabled chips worldwide (Thursday Feb. 29, 2024)
  VeriSilicon today announced that it has reached a milestone achievement with its Neural Network Processor (NPU) IP integrated into over 100 million AI-enabled chips across 10 major application sectors worldwide, including Internet of Things (IoT), wearables, smart TVs, smart home, security monitoring, servers, automotive electronics, smartphones, tablets, and smart healthcare.
  
  
• QuickLogic Signs 7-Figure eFPGA IP Contract for GlobalFoundries' 12LP Process (Wednesday Feb. 28, 2024)
  QuickLogic is proud to announce its selection by a top-tier Defense Industrial Base company for eFPGA IP targeting the GlobalFoundries' 12LP, 12nm low-power process.
  
  
• LX Semicon Enters Mass Production with OPENEDGES' 22nm LPDDR4 PHY IP (Tuesday Feb. 27, 2024)
  OPENEDGES Technology proudly announce the commencement of mass production for its 22nm LPDDR4 PHY IP, licensed to LX Semicon for their latest chipset.
  
  
• Tenstorrent RISC-V and Chiplet Technology Selected to Build the Future of AI in Japan (Tuesday Feb. 27, 2024)
  Tenstorrent is pleased to announce a multi-tiered partnership deal with Japan's Leading-edge Semiconductor Technology Center (LSTC), which selected Tenstorrent's world-class RISC-V and Chiplet IP for its all-new edge 2nm AI Accelerator.
  
  
• Xiphera and Missing Link Electronics Announce a Partnership for Encrypted Network Accelerator Solutions (ENAS) (Tuesday Feb. 27, 2024)
  Xiphera and Missing Link Electronics (MLE) announce a partnership to introduce Encrypted Network Accelerator Solutions (ENAS). With the joint solutions brought to the market, Xiphera and MLE offer a cryptographically secure and reliable connection between devices over TCP/IP.
  
  
• Andes Technology and MetaSilicon Collaborate to Build the World's First Automotive-Grade CMOS Image Sensor Product Using RISC-V IP SoC (Thursday Feb. 22, 2024)
  RISC-V IP vendor Andes Technology and edge computing chip provider MetaSilicon jointly announced that the MetaSilicon MAT Series is the world’s first automotive-grade CMOS image sensor series using RISC-V IP SoC, using Andes’ AndesCore™ N25F-SE processor.
  
  
• Logic Fruit's ARINC Innovation Journey: Delivering Diverse Products to DRDO Labs (Monday Feb. 19, 2024)
  Logic Fruit Technologies, a leading provider of cutting-edge solutions in the aerospace and defense sectors, proudly announces its successful venture into ARINC innovation, culminating in delivering a range of high-quality products to DRDO Labs.
  
  
• EdgeQ Deploys Arteris IP for its 5G+AI Base Station-on-a-Chip for Wireless Infrastructure (Tuesday Feb. 13, 2024)
  Arteris’ FlexNoC network-on-chip IP enables high-bandwidth, low latency on-chip connectivity for low power consumption and optimized performance.
  
  
• Tenstorrent Selects Blue Cheetah Chiplet Interconnect IP For Its AI and RISC-V Solutions (Tuesday Feb. 06, 2024)
  Tenstorrent and Blue Cheetah Analog Design today announced that Tenstorrent has licensed Blue Cheetah's die-to-die interconnect IP for its AI and RISC-V chiplet solutions.
  
  
• SKAIChips License Ceva Bluetooth IP for Electronic Shelf Label IC (Tuesday Feb. 06, 2024)
  IC combines RivieraWaves Bluetooth 5.4 IP with SKAIChips inhouse RF/Power/Analog/AI expertise to achieve lowest power draw, critical for ESL tags and related industrial applications
  
  
• Arteris Selected by Rain AI for Use in the Next Generation of AI (Tuesday Jan. 30, 2024)
  Optimizing on-chip mesh connectivity with Arteris’ FlexNoC 5 physically aware network-on-chip enables Rain AI to realize faster data transfers at ultra-low power to achieve record performance for Generative AI and Edge AI computing at scale.
  
  
• Ceva and Actions Technology Commemorate Landmark Achievement, Surpassing 100 Million Ceva-Powered Wireless Audio and AIoT Processors Shipped (Wednesday Jan. 10, 2024)
  Ceva and Actions Technology are celebrating a monumental achievement today, with Actions surpassing sales of more than 100 million wireless audio and AIoT chips powered by Ceva's audio, voice, AI sensing and wireless communications IPs.
  
  
• Sunplus and Ceva Expand Collaboration to Bring Bluetooth Audio to the airlyra SoC Family for Wireless Speakers, Soundbars and other Wireless Audio Devices (Wednesday Jan. 10, 2024)
  Ceva and Sunplus today announced the companies have expanded their collaboration to integrate Ceva's latest generation RivieraWaves Bluetooth audio solution into the Sunplus airlyra family of HD audio processors targeting wireless speakers, soundbars and other premium wireless audio devices.
  
  
• Andes Technology and Spacetouch Collaborate to Unveil High-Tech Edge-Side AI Audio Processor Featuring the Powerful RISC-V AndesCore™ D25F (Tuesday Jan. 09, 2024)
  
  
  
• BrainChip and Unigen Partner to Deliver Powerful, Energy-Efficient Edge AI Server (Monday Dec. 18, 2023)
  BrainChip and Unigen today announced a strategic partnership to deliver a new configuration of the recently released Unigen Cupcake Edge AI Server, a compact and powerful solution based on BrainChip’s Akida™ neuromorphic processor.
  
  
• Infineon, POLYN to Collaborate on Advanced Tire Monitoring Products (Monday Dec. 18, 2023)
  POLYN Technology and Infineon Technologies AG (FSE: IFX), the global leader in automotive semiconductors, today announced a collaboration in next-generation tire monitoring products.