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Deals / Success Stories News

• Everspin Announces a $9.25M Contract to Provide MRAM Technology for Strategic Radiation Hardened eMRAM Macro (Monday Aug. 19, 2024)
  Everspin Technologies today announced a new strategic contract with Frontgrade Technologies.
  
  
• Everspin Announces Contract to Provide MRAM Technology for Strategic Radiation Hardened FPGA (Monday Aug. 19, 2024)
  This contract is part of the third tranche of the $5.26 Million Strategic Radiation Hardened Contract awarded to QuickLogic
  
  
• AutoChips integrated multiple VeriSilicon's IPs in its intelligent cockpit domain control SoC (Wednesday Aug. 14, 2024)
  VeriSilicon today announced that AutoChips has adopted VeriSilicon’s high-performance IP portfolio in its new generation intelligent cockpit domain control SoC AC8025, including Neural Network Processing Unit (NPU) IP, Video Processing Unit (VPU) IP, and Display Processing IP.
  
  
• Qualitas Semiconductor Expands Licensing Agreement with Key South Korean Fabless company (Monday Aug. 12, 2024)
  QUALITAS SEMICONDUCTOR, a leading provider of high-speed interface IP, has entered into a substantial licensing agreement with a leading fabless company based in South Korea.
  
  
• M31 cooperates with Tower Semiconductor to develop advanced SRAM and ROM solutions for its 65nm Power Management Platform (Thursday Aug. 01, 2024)
  M31 Technology Corporation (M31), a leading global provider of silicon intellectual property (IP), announced a collaboration with Tower Semiconductor yielding the successful development of static random access memory (SRAM) and read-only memory (ROM) IP products using a 65nm process.
  
  
• FuriosaAI and GUC Partner on RNGD, the Most Efficient AI Accelerator for LLMs (Wednesday Jul. 31, 2024)
  FuriosaAI Inc. is pleased to announce its collaboration with GUC (Global Unichip Corporation) as a key partner on the second-gen AI accelerator, RNGD (pronounced “Renegade”), the most efficient data center accelerator for high-performance large language and multimodal models.
  
  
• Raaam signs lead licensee for SRAM replacement technology (Monday Jul. 29, 2024)
  Memory IP licensing startup Raaam Memory Technologies Ltd. (Petah Tikva, Israel) has signed a major fabless chip company as its lead partner to help it develop an alternative to static RAM.
  
  
• Ceva Bluetooth Low Energy and 802.15.4 IPs Bring Ultra-Low Power Wireless Connectivity to Alif Semiconductor's Balletto Family of MCUs (Thursday Jul. 25, 2024)
  Balletto BLE 5.3 and Matter Wireless Microcontroller family features Neural Co-Processor for AI/ML Workloads targeting wireless audio and the smart home
  
  
• Comcores supports BAE systems as a key partner with JESD204C IP (Wednesday Jul. 24, 2024)
  Comcores, a leading provider of high-performance and silicon-proven digital IP cores is chosen by BAE Systems as a key partner for the STEAM PIPE project to supply JESD204C IP.
  
  
• STMicroelectronics Integrates Ceva Cellular IoT Platform in its NB-IoT Industrial Module (Thursday Jul. 11, 2024)
  Fully programmable certified ST87M01 LTE Cat-NB2 NB-IoT industrial module leverages Ceva-Waves Dragonfly NB-IoT platform IP to deliver ultra-reliable Low Power Wide Area Network (LPWAN) connectivity
  
  
• Frontgrade Gaisler Awarded ESA Contract to Qualify Spacecraft Avionics Microcontroller for Flight (Thursday Jun. 27, 2024)
  The European Space Agency (ESA) has awarded Frontgrade Gaisler, a leading provider of radiation-hardened microprocessors for space applications, a contract under the ARTES Core Competitiveness programme to qualify the GR716B microcontroller for flight.
  
  
• Tenstorrent Licenses Baya Systems' Fabric into next-generation AI and Compute Chiplet Solutions (Friday Jun. 21, 2024)
  Baya’s IP and software flow enables Tenstorrent and its partners to analyze, customize and deploy its intelligent compute platform for current and future workloads and deliver highly scalable chiplet solutions to meet the emerging demand.
  
  
• Primemas Selects Achronix Embedded FPGA Technology For System-on-Chip (SoC) Hub Chiplet Platform (Thursday Jun. 20, 2024)
  Achronix and Primemas today announced a collaboration to bring FPGA programmability to the Primemas suite of products. Primemas chose the Speedcore™ eFPGA IP from Achronix for the Primemas Hublet to support organizations requiring programmability and testing capabilities.
  
  
• Arteris Selected by Esperanto Technologies to Integrate RISC-V Processors for High-Performance AI and Machine Learning Solutions (Tuesday Jun. 11, 2024)
  CSRCompiler, an SoC integration automation software solution, enables faster time-to-market and energy-efficient designs for AI inference and HPC applications at a fraction of the cost
  
  
• Rain AI Unveils Andes Technology as Its RISC-V Partner (Monday Jun. 03, 2024)
  Andes Technology announces that Rain AI, a pioneer in compute-in-memory (CIM) technology, licensed Andes’ AX45MPV RISC-V vector processor.
  
  
• OPENEDGES' Memory Subsystem IPs Selected by ASICLAND for Next-gen AI Applications (Friday May. 31, 2024)
  OPENEDGES Technology, Inc. (OPENEDGES), the leading provider of memory subsystem IPs, is pleased to announce a recent licensing agreement with ASICLAND.
  
  
• MerlinTPS Partners with Bluespec to Provide Urgently Needed GPS Augmentation and Backup Without Satellites (Monday May. 27, 2024)
  Using Bluespec’s RISC-V processor, MerlinTPS will deliver new PNT security capabilities and accelerate time to market
  
  
• Dolphin Design teams up with Raspberry Pi for advanced chip power management (Monday May. 27, 2024)
  Dolphin Design and Raspberry Pi are proud to announce a groundbreaking partnership that leverages Dolphin’s cutting-edge power management solutions in the development of Raspberry Pi’s chip technology.
  
  
• Actions Technology's smart watch SoC adopted VeriSilicon's 2.5D GPU IP (Wednesday May. 15, 2024)
  VeriSilicon today announced that Actions Technology (688049.SH), a low-power AIoT fabless semiconductor company, has adopted VeriSilicon’s power-efficient and feature-rich 2.5D Graphics Processor Unit (GPU) IP in its highly integrated dual-mode Bluetooth smart watch SoC series, ATS3085S and ATS3089.
  
  
• SAPEON Enhances AI Accelerator with proteanTecs Reliability and Performance Monitoring (Thursday May. 09, 2024)
  Deep data monitoring based on chip telemetry provides data centers with high compute, low power, and robust server-based AI inference
  
  
• Google Cloud Delivers Customized Silicon Powered by Arm Neoverse for General-Purpose Compute and AI Inference Workloads (Wednesday Apr. 10, 2024)
  Today, Google Cloud introduced custom Google Axion Processors, based on Neoverse V2, for general-purpose compute and AI inference workloads.
  
  
• Rebellions Selects Arteris for Its Next-Generation Neural Processing Unit Aimed at Generative AI (Tuesday Apr. 09, 2024)
  Arteris’ FlexNoC interconnect IP and Magillem SoC integration software enable superior performance and efficient customization of AI inference chips for the emerging Generative AI market and other AI applications.
  
  
• Ambiq and PUFsecurity Join Forces on Energy-Efficient, Security-Enhanced SoC with PUF-based Root of Trust (Tuesday Apr. 09, 2024)
  Ambiq, a globally recognized leader in ultra-low power semiconductors, and PUFsecurity, a subsidiary of eMemory dedicated to innovating PUF-based security IP solutions, announced a successful collaboration on Ambiq's latest Apollo510 integrated with PUFsecurity's PUF-based Root of Trust IP, PUFrt.
  
  
• Autotalks and Secure-IC Collaborate to Create the Most Secure V2X Communication Chipset (Tuesday Apr. 09, 2024)
  The collaboration is set to boost the cybersecurity of today’s V2X technology, which must be fortified to withstand potential cyberattacks, data breaches, and unauthorized access.
  
  
• ZeroPoint Technologies Signs Global Customer to Bring Hardware-Accelerated Compression to Hyperscale Data Centers (Tuesday Mar. 26, 2024)
  ZeroPoint Technologies AB today announced that it has licensed its DenseMem CXL memory expansion solution to a major global semiconductor manufacturer.
  
  
• Faraday Partnered with SONIX to Create a New Product Featuring Its SONOS eFlash Solution (Tuesday Mar. 26, 2024)
  Sonix adopted Faraday’s SONOS eFlash subsystem, which is specially designed to develop edge AI, smart grid, IoT, and MCU applications, to facilitate the integration of the eFlash function into the SoC without modifying the existing proven IP at 40ULP.
  
  
• Qualitas Semiconductor and Ambarella Sign Licensing Agreement (Tuesday Mar. 26, 2024)
  QUALITAS SEMICONDUCTOR has signed a licensing agreement with Ambarella. This collaboration is primarily focused on the next generation of autonomous driving vehicle safety systems, providing unprecedented levels of AI processing performance, power efficiency and reliability.
  
  
• ScaleFlux To Integrate Arm Cortex-R82 Processors in Its Next-Generation Enterprise SSD Controllers (Monday Mar. 25, 2024)
  ScaleFlux, a computational storage leader, has announced plans to incorporate the Arm® Cortex®-R82 processor into its next-gen enterprise SSD controllers, aiming to significantly boost processing power and efficiency.
  
  
• StarFive's RISC-V based JH-7110 intelligent vision processing platform adopted VeriSilicon's Display Processor IP (Thursday Mar. 21, 2024)
  VeriSilicon’s scalable and flexible DC8200 IP delivers display device adaptability and high-quality effects, offering immersive visual experience
  
  
• Canaan's RISC-V based edge AIoT SoC adopted VeriSilicon's ISP and GPU IPs (Thursday Mar. 14, 2024)
  VeriSilicon today announced the integration of its Image Signal Processor (ISP) IP ISP8000, DeWarp Processor IP DW200, and 2.5D Graphics Processor Unit (GPU) IP GCNanoV into Canaan’s K230 chip, the world’s first commercial mass production edge AIoT chip supporting the RISC-V Vector 1.0 standard.