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Deals / Success Stories News

• BrainChip Boosts Space Heritage with Launch of Akida into Low Earth Orbit (Tuesday Mar. 05, 2024)
  BrainChip, the world’s first commercial producer of ultra-low power, fully digital, event- based, neuromorphic AI, today saw its Akida™ AI technology launched into low earth orbit aboard the Optimus-1 spacecraft built by the Space Machines Company.
  
  
• VeriSilicon's industry-leading embedded GPU IP powers HPMicro's high-performance HPM6800 series RISC-V MCU (Monday Mar. 04, 2024)
  VeriSilicon today announced that HPMicro’s HPM6800 series, a new generation digital dashboard display and human-machine interface system application platform has adopted VeriSilicon’s high-performance 2.5D Graphics Processor Unit (GPU) IP.
  
  
• VeriSilicon NPU IP is shipped in over 100 million AI-enabled chips worldwide (Thursday Feb. 29, 2024)
  VeriSilicon today announced that it has reached a milestone achievement with its Neural Network Processor (NPU) IP integrated into over 100 million AI-enabled chips across 10 major application sectors worldwide, including Internet of Things (IoT), wearables, smart TVs, smart home, security monitoring, servers, automotive electronics, smartphones, tablets, and smart healthcare.
  
  
• QuickLogic Signs 7-Figure eFPGA IP Contract for GlobalFoundries' 12LP Process (Wednesday Feb. 28, 2024)
  QuickLogic is proud to announce its selection by a top-tier Defense Industrial Base company for eFPGA IP targeting the GlobalFoundries' 12LP, 12nm low-power process.
  
  
• LX Semicon Enters Mass Production with OPENEDGES' 22nm LPDDR4 PHY IP (Tuesday Feb. 27, 2024)
  OPENEDGES Technology proudly announce the commencement of mass production for its 22nm LPDDR4 PHY IP, licensed to LX Semicon for their latest chipset.
  
  
• Tenstorrent RISC-V and Chiplet Technology Selected to Build the Future of AI in Japan (Tuesday Feb. 27, 2024)
  Tenstorrent is pleased to announce a multi-tiered partnership deal with Japan's Leading-edge Semiconductor Technology Center (LSTC), which selected Tenstorrent's world-class RISC-V and Chiplet IP for its all-new edge 2nm AI Accelerator.
  
  
• Xiphera and Missing Link Electronics Announce a Partnership for Encrypted Network Accelerator Solutions (ENAS) (Tuesday Feb. 27, 2024)
  Xiphera and Missing Link Electronics (MLE) announce a partnership to introduce Encrypted Network Accelerator Solutions (ENAS). With the joint solutions brought to the market, Xiphera and MLE offer a cryptographically secure and reliable connection between devices over TCP/IP.
  
  
• Andes Technology and MetaSilicon Collaborate to Build the World's First Automotive-Grade CMOS Image Sensor Product Using RISC-V IP SoC (Thursday Feb. 22, 2024)
  RISC-V IP vendor Andes Technology and edge computing chip provider MetaSilicon jointly announced that the MetaSilicon MAT Series is the world’s first automotive-grade CMOS image sensor series using RISC-V IP SoC, using Andes’ AndesCore™ N25F-SE processor.
  
  
• Logic Fruit's ARINC Innovation Journey: Delivering Diverse Products to DRDO Labs (Monday Feb. 19, 2024)
  Logic Fruit Technologies, a leading provider of cutting-edge solutions in the aerospace and defense sectors, proudly announces its successful venture into ARINC innovation, culminating in delivering a range of high-quality products to DRDO Labs.
  
  
• EdgeQ Deploys Arteris IP for its 5G+AI Base Station-on-a-Chip for Wireless Infrastructure (Tuesday Feb. 13, 2024)
  Arteris’ FlexNoC network-on-chip IP enables high-bandwidth, low latency on-chip connectivity for low power consumption and optimized performance.
  
  
• Tenstorrent Selects Blue Cheetah Chiplet Interconnect IP For Its AI and RISC-V Solutions (Tuesday Feb. 06, 2024)
  Tenstorrent and Blue Cheetah Analog Design today announced that Tenstorrent has licensed Blue Cheetah's die-to-die interconnect IP for its AI and RISC-V chiplet solutions.
  
  
• SKAIChips License Ceva Bluetooth IP for Electronic Shelf Label IC (Tuesday Feb. 06, 2024)
  IC combines RivieraWaves Bluetooth 5.4 IP with SKAIChips inhouse RF/Power/Analog/AI expertise to achieve lowest power draw, critical for ESL tags and related industrial applications
  
  
• Arteris Selected by Rain AI for Use in the Next Generation of AI (Tuesday Jan. 30, 2024)
  Optimizing on-chip mesh connectivity with Arteris’ FlexNoC 5 physically aware network-on-chip enables Rain AI to realize faster data transfers at ultra-low power to achieve record performance for Generative AI and Edge AI computing at scale.
  
  
• Ceva and Actions Technology Commemorate Landmark Achievement, Surpassing 100 Million Ceva-Powered Wireless Audio and AIoT Processors Shipped (Wednesday Jan. 10, 2024)
  Ceva and Actions Technology are celebrating a monumental achievement today, with Actions surpassing sales of more than 100 million wireless audio and AIoT chips powered by Ceva's audio, voice, AI sensing and wireless communications IPs.
  
  
• Sunplus and Ceva Expand Collaboration to Bring Bluetooth Audio to the airlyra SoC Family for Wireless Speakers, Soundbars and other Wireless Audio Devices (Wednesday Jan. 10, 2024)
  Ceva and Sunplus today announced the companies have expanded their collaboration to integrate Ceva's latest generation RivieraWaves Bluetooth audio solution into the Sunplus airlyra family of HD audio processors targeting wireless speakers, soundbars and other premium wireless audio devices.
  
  
• Andes Technology and Spacetouch Collaborate to Unveil High-Tech Edge-Side AI Audio Processor Featuring the Powerful RISC-V AndesCore™ D25F (Tuesday Jan. 09, 2024)
  
  
  
• BrainChip and Unigen Partner to Deliver Powerful, Energy-Efficient Edge AI Server (Monday Dec. 18, 2023)
  BrainChip and Unigen today announced a strategic partnership to deliver a new configuration of the recently released Unigen Cupcake Edge AI Server, a compact and powerful solution based on BrainChip’s Akida™ neuromorphic processor.
  
  
• Infineon, POLYN to Collaborate on Advanced Tire Monitoring Products (Monday Dec. 18, 2023)
  POLYN Technology and Infineon Technologies AG (FSE: IFX), the global leader in automotive semiconductors, today announced a collaboration in next-generation tire monitoring products.
  
  
• Neurxcore leverages Aedvices VIPs for the verification of its neural processors (Thursday Dec. 14, 2023)
  Neurxcore, a leading provider of optimized solutions for artificial intelligence (AI), has just announced the launch of a complete range of neural processors (NPUs) developed and verified using Aedvices’ VIPs.
  
  
• SCALINX and Arteris Partner on Advanced Communications Innovation (Tuesday Dec. 12, 2023)
  Arteris today announced that SCALINX, a fabless semiconductor company specializing in mixed-signal SoC design, has licensed Ncore and FlexNoC interconnect IP for its next-generation Modem SoC dedicated to wireless communication infrastructures.
  
  
• AccelerComm Expands LDPC Accelerator IP Licenses for 5G Cloud RAN High-Capacity Solutions (Tuesday Dec. 12, 2023)
  AccelerComm, the Layer 1 5G IP specialists, today announced that US-based global ICT industry leader AMD has licensed its 3GPP LDPC accelerator IP for use on its T2 Telco Accelerator Card.
  
  
• Lockheed Martin Prepares First 5G.MIL® Payload for Orbit (Friday Dec. 01, 2023)
  Lockheed Martin recently announced that the company has completed a final demo of the first regenerative non-terrestrial network 5G Satellite Base Station.
  
  
• Agnisys Announces Wacom Selects IDesignSpec™ to Automate Its IP and Chip Development Flow from Executable Specifications (Thursday Nov. 30, 2023)
  Agnisys announces that Wacom, the global leader in digital pen solutions, creative pen displays, and pen tablets, has selected Agnisys and its flagship product suite, IDesignSpec™, for development of its Intellectual Property (IP) and Application-Specific Integrated Circuits (ASICs).
  
  
• QuickLogic Secures New eFPGA IP Contract on UMC's 22nm Process (Thursday Nov. 30, 2023)
  QuickLogic today announced that it has been selected by a leading global semiconductor company for an eFPGA IP targeting the UMC 22nm platform.
  
  
• VeriSilicon's Vector Graphics GPU is selected by LG Electronics (Wednesday Nov. 22, 2023)
  VeriSilicontoday announced that LG Electronics, Inc. (LG) has adopted the company’s mass market proven and low-power consumption GCNanoUltraV 2.5D GPU for its next in-house SoC for various applications to equip them with captivating graphics capabilities.
  
  
• Secure-IC announces the integration of Securyzr™ technology in MediaTek's new flagship smartphone chip, Dimensity 9300 (Thursday Nov. 16, 2023)
  Secure-IC is thrilled to announce its embedded cybersecurity solution Securyzr™ iSE (integrated Secure Element) 900 was integrated in MediaTek’s flagship smartphone chip, the Dimensity 9300. Secure-IC’s Securyzr™ ensures the protection of sensitive data and critical processes within the chipset, preventing unauthorized access and safeguarding the system’s integrity.
  
  
• Bringing Arm TCS23 to Life on Next-gen Flagship Smartphones with MediaTek and vivo (Thursday Nov. 16, 2023)
  TCS23 is now coming to life thanks to unprecedented ecosystem collaborations that make it easier for SoC designers and OEMs to bring their product designs to market faster, and with increasing flexibility that allows for true hardware and software differentiation.
  
  
• Ubilite Licenses RISC-V Application Processor IP Core from CAST (Tuesday Nov. 07, 2023)
  Semiconductor intellectual property provider CAST today announced that ultra-low-power Wi-Fi chipset developer Ubilite, Inc. has licensed a RISC-V IP core for use as an application processor in Ubilite’s next generation of products.
  
  
• proteanTecs Enhances Astera Labs' Connectivity Solutions with Performance and Reliability Monitoring (Thursday Nov. 02, 2023)
  proteanTecs, a global leader of deep data analytics for advanced electronics, announced today that Astera Labs has selected the company’s health and performance monitoring solutions in multiple projects for data center applications.
  
  
• Sophgo Licenses SiFive RISC-V Processor Cores to Drive High-Performance AI Computing Innovation (Thursday Nov. 02, 2023)
  Today, Sophgo announced that the company has licensed several SiFive RISC-V high performance processor cores, the SiFive Performance P670 and SiFive Intelligence X280 to develop RISC-V AI computing processors.