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Deals / Success Stories News

• Neurxcore leverages Aedvices VIPs for the verification of its neural processors (Thursday Dec. 14, 2023)
  Neurxcore, a leading provider of optimized solutions for artificial intelligence (AI), has just announced the launch of a complete range of neural processors (NPUs) developed and verified using Aedvices’ VIPs.
  
  
• SCALINX and Arteris Partner on Advanced Communications Innovation (Tuesday Dec. 12, 2023)
  Arteris today announced that SCALINX, a fabless semiconductor company specializing in mixed-signal SoC design, has licensed Ncore and FlexNoC interconnect IP for its next-generation Modem SoC dedicated to wireless communication infrastructures.
  
  
• AccelerComm Expands LDPC Accelerator IP Licenses for 5G Cloud RAN High-Capacity Solutions (Tuesday Dec. 12, 2023)
  AccelerComm, the Layer 1 5G IP specialists, today announced that US-based global ICT industry leader AMD has licensed its 3GPP LDPC accelerator IP for use on its T2 Telco Accelerator Card.
  
  
• Lockheed Martin Prepares First 5G.MIL® Payload for Orbit (Friday Dec. 01, 2023)
  Lockheed Martin recently announced that the company has completed a final demo of the first regenerative non-terrestrial network 5G Satellite Base Station.
  
  
• Agnisys Announces Wacom Selects IDesignSpec™ to Automate Its IP and Chip Development Flow from Executable Specifications (Thursday Nov. 30, 2023)
  Agnisys announces that Wacom, the global leader in digital pen solutions, creative pen displays, and pen tablets, has selected Agnisys and its flagship product suite, IDesignSpec™, for development of its Intellectual Property (IP) and Application-Specific Integrated Circuits (ASICs).
  
  
• QuickLogic Secures New eFPGA IP Contract on UMC's 22nm Process (Thursday Nov. 30, 2023)
  QuickLogic today announced that it has been selected by a leading global semiconductor company for an eFPGA IP targeting the UMC 22nm platform.
  
  
• VeriSilicon's Vector Graphics GPU is selected by LG Electronics (Wednesday Nov. 22, 2023)
  VeriSilicontoday announced that LG Electronics, Inc. (LG) has adopted the company’s mass market proven and low-power consumption GCNanoUltraV 2.5D GPU for its next in-house SoC for various applications to equip them with captivating graphics capabilities.
  
  
• Secure-IC announces the integration of Securyzr™ technology in MediaTek's new flagship smartphone chip, Dimensity 9300 (Thursday Nov. 16, 2023)
  Secure-IC is thrilled to announce its embedded cybersecurity solution Securyzr™ iSE (integrated Secure Element) 900 was integrated in MediaTek’s flagship smartphone chip, the Dimensity 9300. Secure-IC’s Securyzr™ ensures the protection of sensitive data and critical processes within the chipset, preventing unauthorized access and safeguarding the system’s integrity.
  
  
• Bringing Arm TCS23 to Life on Next-gen Flagship Smartphones with MediaTek and vivo (Thursday Nov. 16, 2023)
  TCS23 is now coming to life thanks to unprecedented ecosystem collaborations that make it easier for SoC designers and OEMs to bring their product designs to market faster, and with increasing flexibility that allows for true hardware and software differentiation.
  
  
• Ubilite Licenses RISC-V Application Processor IP Core from CAST (Tuesday Nov. 07, 2023)
  Semiconductor intellectual property provider CAST today announced that ultra-low-power Wi-Fi chipset developer Ubilite, Inc. has licensed a RISC-V IP core for use as an application processor in Ubilite’s next generation of products.
  
  
• proteanTecs Enhances Astera Labs' Connectivity Solutions with Performance and Reliability Monitoring (Thursday Nov. 02, 2023)
  proteanTecs, a global leader of deep data analytics for advanced electronics, announced today that Astera Labs has selected the company’s health and performance monitoring solutions in multiple projects for data center applications.
  
  
• Sophgo Licenses SiFive RISC-V Processor Cores to Drive High-Performance AI Computing Innovation (Thursday Nov. 02, 2023)
  Today, Sophgo announced that the company has licensed several SiFive RISC-V high performance processor cores, the SiFive Performance P670 and SiFive Intelligence X280 to develop RISC-V AI computing processors.
  
  
• EnSilica to supply beamforming SatCom ICs to Germany's VITES to enable power- and cost-efficient flat panel terminals for NGSO-constellations (Monday Oct. 30, 2023)
  EnSilica (AIM: ENSI), a leading turnkey supplier of mixed signal ASICs and SoCs, has announced it is to supply VITES with a new beamformer chip for satellite user terminals. VITES will use the chip at the heart of its new ViSAT-Ka-band terminal.
  
  
• Green Mountain Semiconductor Inc. awarded a contract from NASA to Pave the Way for Space-Ready Neural Processors (Monday Oct. 23, 2023)
  Green Mountain Semiconductor Inc. (GMS), a custom circuit design provider, is proud to announce its recent achievement of a Phase I Small Business Innovation Research (SBIR) contract.
  
  
• Weebit Nano licenses ReRAM to DB HiTek, a global top-10 foundry (Thursday Oct. 19, 2023)
  Weebit and DB HiTek have signed a commercial agreement whereby DB HiTek has licensed Weebit ReRAM for its customers to integrate as embedded non-volatile memory (NVM) in their systems on chips (SoCs).
  
  
• OPENEDGES Extends Partnership with InnoGrit Corp for 6nm LPDDR5/4X/4 Memory Controller IP (Monday Oct. 16, 2023)
  OPENEDGES Technology, Inc. (OPENEDGES), a leading silicon IP provider, is pleased to announce the expansion of its collaboration with InnoGrit, a globally renowned supplier of solid-state drive (SSD) storage IC, since 2020.
  
  
• Arteris Interconnect IP Deployed in NeuReality Inference Server for Generative AI and Large Language Model Applications (Wednesday Oct. 11, 2023)
  FlexNoC network-on-chip IP seamlessly provides connectivity across the NR1 chip within the inference server to efficiently meet high-density, low-latency AI performance needs at a minimal total cost of ownership.
  
  
• BrainChip and Circle8 Clean Technologies/AVID Group Work to Reduce and Recycle Waste Through Joint Development of Intelligent "Smart Bins" (Wednesday Oct. 11, 2023)
  BrainChip today announced that it has entered into a strategic partnership with Circle8 Clean Technologies and AVID Group to develop “Smart Bins” that can automatically sort and recycle different types of waste through a combination of AI-powered sensors and robotics.
  
  
• Inuitive Adopts VeriSilicon's Advanced ISP IP for its Vision AI Processor (Thursday Sep. 21, 2023)
  VeriSilicon (688521.SH) today announced that Inuitive, a leading vision-on-chip processor company, has adopted its dual-channel Image Signal Processor (ISP) IP, featuring low latency and low power capabilities, into its mass-produced NU4100 vision AI processor.
  
  
• OPENEDGES and VisioNexT Shapes the Future of Vision AI SoCs (Tuesday Sep. 19, 2023)
  OPENEDGES Technology, Inc. (OPENEDGES), a leading silicon IP provider, is proud to announce its extensive memory subsystem IP licensing partnership with VisioNexT.
  
  
• Fraunhofer IIS and IHSE announce their partnership for new JPEG XS implementations at IBC 2023 (Thursday Sep. 14, 2023)
  By using Fraunhofer’s JPEG XS SDK and IHSE’s JPEG XS IP-core for FPGAs, innovative and ultra-low latency broadcast, in-house and gaming video routes can be realized with predictive and precise rate control.
  
  
• Lawo and intoPIX Partner to Deliver Edge-Compute JPEG XS Support at IBC 2023 (Thursday Sep. 14, 2023)
  intoPIX, the leading provider of innovative compression technology, and Lawo proudly announce that .edge users can now benefit from the intoPIX TicoXS codec to encode and decode JPEG XS-compressed streams.
  
  
• intoPIX and Cobalt unveil the future of content delivery with JPEG XS: Introducing the Sapphire mini-converters and Sapphire openGear card powered by intoPIX technology (Wednesday Sep. 13, 2023)
  intoPIX, the leading provider of innovative image processing and video compression technologies, is thrilled to announce its groundbreaking partnership with Cobalt Digital, a leading innovator in broadcast technology.
  
  
• Hailo Selected VeriSilicon's ISP and Video IP for its AI Vision Processors Empowering Intelligent Surveillance Cameras (Tuesday Sep. 12, 2023)
  VeriSilicon (688521.SH) today announced that its Image Signal Processor (ISP) IP ISP8000L-FS and Video Processor Unit (VPU) IP VC8000E have been adopted by Hailo, an AI-focused chipmaker in Israel, to empower its line of high-performance AI vision processors, Hailo-15TM.
  
  
• Enhanced Artel SMART openGear® Leverages intoPIX JPEG XS Technology for Ultimate Low-Latency Transport Solutions (Monday Sep. 11, 2023)
  intoPIX, leading provider of innovative image processing and video compression technologies, proudly announces its collaboration with Artel, resulting in the integration of intoPIX's cutting-edge JPEG XS technologyinto the Artel SMART openGear solution.
  
  
• Cybertek Solution Wins Multiple Contracts in Asia (Tuesday Sep. 05, 2023)
  Cybertek Solution, a leading provider of Multimedia IPs and Security IPs, announced today that it has won multiple Display Stream Compression (DSC) contracts for 4K TV at FPGA and ASIC implementations in Asia.
  
  
• Metanoia Adopts Omni Design's Multi Giga Sample Data Converters in 5G products (Thursday Aug. 17, 2023)
  Omni Design Technologies today announced that Metanoia is adopting Omni Design’s multi-gigasample data converters and related IP in advanced FinFET nodes. Metanoia 5G products, incorporating Omni Design IP, will power future smart devices with ultra-fast mobile internet, self-driving cars, virtual reality, and a variety of smart home applications.
  
  
• OPENEDGES and Telechips Collaborates for Automotive Applications (Monday Aug. 14, 2023)
  OPENEDGES, the leading provider of memory subsystem intellectual property (IP), has joined forces with Telechips, a leading fabless semiconductor company specializing in automotive to innovate the automotive industry by delivering exceptional performance and enhanced efficiency in their automotive applications.
  
  
• Andes Technology and TetraMem Collaborate to Build Groundbreaking AI Accelerator Chip with Analog In-Memory Computing (Friday Aug. 11, 2023)
  Andes Technology and TetraMem are proud to announce a strategic partnership aimed at delivering a fast, highly efficient, AI inference chip that will revolutionize the landscape of artificial intelligence and edge computing.
  
  
• Dolphin Design enables Orca's RF SoCs for direct-to-satellite communications (Tuesday Aug. 01, 2023)
  Orca’s wireless SoCs include a power management unit (PMU) based on Dolphin Design’s full suite of power management IPs tailored for ultra-low power applications such as Satellite IoT endpoint SoC and other power-sensitive SoC devices for direct-to-satellite and other industrial applications.