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Deals / Success Stories News

• Ventana Micro Selects Imperas Solutions for RISC-V Processor Verification (Thursday Feb. 23, 2023)
  Imperas RISC-V reference models, simulator, tests, and verification IP are supporting Ventana Micro in delivering a performance-leading family of data center class CPU cores
  
  
• Andes And IAR Systems Together Enable Leading Vendor ILITEK To Accelerate The Development Of Its ISO 26262 Ready TDDI SoC ILI6600A (Wednesday Feb. 15, 2023)
  The joint Functional Safety solution from Andes and IAR Systems helps ILITEK develop its High-Performance Touch and Display Driver Integration (TDDI) SoC
  
  
• Würth Elektronik Partners with Crypto Quantique for IoT Security (Monday Feb. 13, 2023)
  Würth Elektronik has signed a partnership agreement with Crypto Quantique. Collaboration with the specialist in quantum-based cyber security in the Internet of Things (IoT) enhances security for Würth Elektronik’s wireless modules.
  
  
• Sino Wealth License and Deploy CEVA Bluetooth® Low Energy IP for its Connectivity MCUs (Friday Jan. 06, 2023)
  CEVA today announced that Sino Wealth Electronic has licensed and deployed CEVA's Bluetooth connectivity platform - RivieraWaves Bluetooth Low Energy 5 IP in its latest SH87F881X family of connectivity MCUs targeting white goods and the broader Industrial IoT (IIoT) markets.
  
  
• CEVA and Autotalks Expand Collaboration to Create World's First 5G-V2X Solution (Thursday Jan. 05, 2023)
  CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies and co-creation solutions, announced today that Autotalks, a world leader in V2X (Vehicle-to-Everything) communication solutions, has licensed and deployed the CEVA-XC4500 Communication Processor and CEVA-BX1 Digital Signal Controller in its 3rd generation V2X chipsets, TEKTON3 and SECTON3.
  
  
• CEVA and LG Partner to Bring Intelligent Vision Processing to Smart Home Appliances (Wednesday Jan. 04, 2023)
  CEVA today announced that LG Electronics (LG) has licensed and deployed the CEVA-XM4 intelligent vision DSP in its Edge AI system-on-chip (SoC) 'LG8111' to advance the user experience of a new generation of smart home appliances.
  
  
• Dream Chip Technologies Licensed its Real-time Pixel Processor IP to Renesas (Wednesday Dec. 21, 2022)
  Dream Chip Technologies by Goodix, a leading provider of Image Signal Processing IP and SoC Design with engineering sites in Hannover, Hamburg, Eindhoven and Brunswick, has licensed their Real-time Pixel Processor (RPP) to Renesas for the integration into their new generation of R-Car system-on-chip (SoC).
  
  
• PEZY Computing Selects proteanTecs to Monitor Die-to-Die Interconnects in Next-Generation Supercomputer Processors (Wednesday Dec. 21, 2022)
  proteanTecs, a global leader of deep data analytics for advanced electronics, announced today that PEZY Computing has selected the company’s 2.5D interconnect monitoring solution for interface validation, quality assurance and reliability monitoring.
  
  
• KI-FLEX AI chip tapes out with flexible videantis processor platform (Tuesday Dec. 13, 2022)
  videantis today announced the tape-out of the FlexAISIC AI chip based on its flexible v-MP6000UDX unified processing platform. The tape-out has been achieved in collaboration with the Fraunhofer Institute for Integrated Circuits IIS, and the chip development is funded by the German Federal Ministry of Education and Research (BMBF) within the KI-FLEX project.
  
  
• MIPS Partners With Mobileye to Accelerate Next Generation Autonomous Driving Technologies and Advanced Driver Assistance Systems (Monday Dec. 12, 2022)
  MIPS, a leading developer of highly scalable RISC processor IP, announced it is continuing its partnership with Mobileye, in accelerating innovation in autonomous driving technologies and advanced driver-assistance systems (ADAS).
  
  
• Mixel Patented MIPI D-PHY RX+ IP Integrated into Lumissil Automotive Microcontroller (Tuesday Dec. 06, 2022)
  Mixel, Inc.® (Mixel), a leading provider of mixed-signal intellectual property (IP), and Lumissil Microsystems (Lumissil), a division of Integrated Silicon Solution, Inc. (ISSI), announced today that Mixel’s MIPI® IP solution has been successfully integrated into Lumissil’s automotive microcontroller which will go to production next year.
  
  
• Arteris FlexNoC Interconnect Licensed by Telechips for Use in Advanced Automotive Applications (Tuesday Dec. 06, 2022)
  Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today announced its collaboration with Telechips to integrate the Arteris FlexNoC interconnect IP established technology into several SoC products for automotive.
  
  
• Novatek Adopts CEVA's Latest Sensor Hub DSP for New Multi-sensor IP Camera SoC (Monday Dec. 05, 2022)
  CEVA today announced that Novatek Microelelctonics Corp, a leading fabless chip design company, has licensed and deployed the SP500 DSP from CEVA’s SensPro2 Sensor Hub DSP architecture family in its newest generation NT98530 multi-sensor IP Camera SoC targeting surveillance, retail, smart city, transportation and more.
  
  
• CAES Design Win of RISC-V/NOEL-V IP for Idaho Scientific Secure Processor for US Critical Infrastructure (Tuesday Nov. 29, 2022)
  CAES, a leader in advanced mission-critical electronics for aerospace and defense, announced that it has won its first commercial U.S.-based license for its RISC-V/NOEL-V processor IP with Idaho Scientific, based in Boise, Idaho.
  
  
• eMemory Collaborates with Renesas on the Development of its Pure 5V OTP IP Using 130nm BCD Plus Process for Automotive Applications (Wednesday Nov. 16, 2022)
  eMemory Technology Inc. has collaborated with Renesas Electronics Corporation to develop a pure 5V OTP IP fabricated on TSMC’s 130nm BCD Plus process for automotive applications.
  
  
• CAES GR712RC Microprocessor Selected by Argotec for Multiple Space Missions (Wednesday Nov. 16, 2022)
  CAES is pleased to announce it has been chosen by Argotec, an Italian aerospace engineering company, to provide its radiation hardened GR712RC dual-core LEON3FT SPARC V8 Microprocessor on several key space missions.
  
  
• Codasip delivers custom RISC-V processing to SiliconArts ray-tracing GPUs (Wednesday Nov. 02, 2022)
  Codasip, the leader in customizable RISC-V processor IP, today announced that SiliconArts has adopted application-specific Codasip 7-series RISC-V processors with Codasip Studio customization tools.
  
  
• CEVA and ASR Micro Celebrate Milestone - 100 Million Wireless IoT Chips Shipped (Wednesday Nov. 02, 2022)
  CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies and co-creation solutions, and ASR Microelectronics (ASR), a leading wireless semiconductor company, announced today that shipments of ASR wireless IoT chips powered by CEVA’s IPs have surpassed 100 million units.
  
  
• Arteris FlexNoC Interconnect Licensed by Microchip Technology for Microcontroller Development (Wednesday Nov. 02, 2022)
  Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today announced that Microchip Technology Inc. has licensed FlexNoC interconnect IP for its high-performance 32-bit microcontroller (MCU) product line.
  
  
• Rambus and Samsung Electronics Extend Comprehensive Agreement (Monday Oct. 31, 2022)
  Rambus, a premier chip and silicon IP provider making data faster and safer, today announced it has extended its comprehensive patent license agreement with Samsung Electronics, a world leader in advanced semiconductor technology, for an additional ten years.
  
  
• GUC GLink™ Chip Leverages proteanTecs' Die-to-Die Interconnect Monitoring (Thursday Oct. 27, 2022)
  Results highlight how deep data performance and reliability monitoring delivers comprehensive visibility into high bandwidth interfaces
  
  
• Everspin Signs Contract to Provide MRAM IP, Design and Manufacturing Services for Strategic Radiation Hardened FPGA Technology (Friday Oct. 21, 2022)
  Everspin Technologies, the world’s leading developer and manufacturer of Magnetoresistive Random Access Memory (MRAM) persistent memory solutions, has signed a contract to provide MRAM technology, design, and back end of line manufacturing services with QuickLogic Corporation
  
  
• Siliconarts signed a Ray-Tracing GPU IP 'Raycore' license agreement with Verisilicon. (Thursday Oct. 13, 2022)
  Siliconarts signed a Ray-Tracing GPU IP 'Raycore' license agreement with Verisilicon, the world's No. 7 semiconductor IP company and No. 1 in China.
  
  
• QuickLogic Partners with ChipMotion for eFPGA Implementations in SoC Designs (Tuesday Oct. 04, 2022)
  QuickLogic today announced that it has signed an agreement with Hefei ChipMotion Microelectronics Company, Ltd., an electronic design services provider located in Hefei, Shanghai and Beijing, to provide turnkey eFPGA design support for SoC designs.
  
  
• CAES Wins Contracts for Development of Next-Generation, Octa-Core, user-selectable CPU for Space (Friday Sep. 23, 2022)
  CAES announced that it has won multiple contracts with the European Space Agency (ESA) for the development of the GR765 System-on-Chip (SOC), the first user selectable CPU for space. This next-generation, radiation-hardened device will allow users to select between the LEON5 SPARC V8 or NOEL-V RISC-V RV64 processor cores.
  
  
• CAES' Quad-Core LEON4FT Processor Selected for European Next-Generation Star Sensors (Tuesday Sep. 20, 2022)
  CAES, a leader in advanced mission-critical electronics for aerospace and defense, is pleased to announce that it has signed a multi-year contract with Jena-Optronik to deliver flight grade GR740 quad-core LEON4FT SPARC V8 Microprocessor devices for its next-generation sensor products.
  
  
• Veriest supports the development of Mobileye's innovative automotive sensor products (Wednesday Sep. 14, 2022)
  Veriest Solutions, a leading international Electronics Design Services house, announced today that its engineers supported Mobileye in the development of a series of state-of-the-art automotive devices, powering autonomous driving solutions.
  
  
• Andes Technology Corp. Announces Its RISC-V CPU IP Serves as the Computing Engine in the New Renesas R9A02G020 MCU ASSP (Friday Sep. 09, 2022)
  Andes Technology today announced Andes’ Entry-Level RISC-V core serves as the computing engine in the new G020 RISC-V MCU ASSP from Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions.
  
  
• SiMa.ai Partners with GUC to Accelerate Time to Market for Industry's First Purpose-Built Machine Learning Platform for the Embedded Edge (Thursday Sep. 08, 2022)
  SiMa.ai, the machine learning company enabling effortless deployment and scaling at the embedded edge, today announced it has partnered with GUC (Global Unichip Corporation) to help leverage the company’s turnkey semiconductor services for continued first-time right design of its MLSoC Platform.
  
  
• NASA Selects SiFive and Makes RISC-V the Go-to Ecosystem for Future Space Missions (Wednesday Sep. 07, 2022)
  SiFive, Inc., the founder and leader of RISC-V computing, today announced it has been selected by NASA to provide the core CPU for NASA’s next generation High-Performance Spaceflight Computing (HPSC) processor.