Deals / Success Stories News
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Arteris FlexNoC Interconnect Licensed by Telechips for Use in Advanced Automotive Applications (Tuesday Dec. 06, 2022)
Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today announced its collaboration with Telechips to integrate the Arteris FlexNoC interconnect IP established technology into several SoC products for automotive.
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Novatek Adopts CEVA's Latest Sensor Hub DSP for New Multi-sensor IP Camera SoC (Monday Dec. 05, 2022)
CEVA today announced that Novatek Microelelctonics Corp, a leading fabless chip design company, has licensed and deployed the SP500 DSP from CEVA’s SensPro2 Sensor Hub DSP architecture family in its newest generation NT98530 multi-sensor IP Camera SoC targeting surveillance, retail, smart city, transportation and more.
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CAES Design Win of RISC-V/NOEL-V IP for Idaho Scientific Secure Processor for US Critical Infrastructure (Tuesday Nov. 29, 2022)
CAES, a leader in advanced mission-critical electronics for aerospace and defense, announced that it has won its first commercial U.S.-based license for its RISC-V/NOEL-V processor IP with Idaho Scientific, based in Boise, Idaho.
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eMemory Collaborates with Renesas on the Development of its Pure 5V OTP IP Using 130nm BCD Plus Process for Automotive Applications (Wednesday Nov. 16, 2022)
eMemory Technology Inc. has collaborated with Renesas Electronics Corporation to develop a pure 5V OTP IP fabricated on TSMC’s 130nm BCD Plus process for automotive applications.
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CAES GR712RC Microprocessor Selected by Argotec for Multiple Space Missions (Wednesday Nov. 16, 2022)
CAES is pleased to announce it has been chosen by Argotec, an Italian aerospace engineering company, to provide its radiation hardened GR712RC dual-core LEON3FT SPARC V8 Microprocessor on several key space missions.
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Codasip delivers custom RISC-V processing to SiliconArts ray-tracing GPUs (Wednesday Nov. 02, 2022)
Codasip, the leader in customizable RISC-V processor IP, today announced that SiliconArts has adopted application-specific Codasip 7-series RISC-V processors with Codasip Studio customization tools.
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CEVA and ASR Micro Celebrate Milestone - 100 Million Wireless IoT Chips Shipped (Wednesday Nov. 02, 2022)
CEVA, Inc. (NASDAQ: CEVA), the leading licensor of wireless connectivity and smart sensing technologies and co-creation solutions, and ASR Microelectronics (ASR), a leading wireless semiconductor company, announced today that shipments of ASR wireless IoT chips powered by CEVA’s IPs have surpassed 100 million units.
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Arteris FlexNoC Interconnect Licensed by Microchip Technology for Microcontroller Development (Wednesday Nov. 02, 2022)
Arteris, Inc. (Nasdaq: AIP), a leading provider of system IP which accelerates system-on-chip (SoC) creation, today announced that Microchip Technology Inc. has licensed FlexNoC interconnect IP for its high-performance 32-bit microcontroller (MCU) product line.
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Rambus and Samsung Electronics Extend Comprehensive Agreement (Monday Oct. 31, 2022)
Rambus, a premier chip and silicon IP provider making data faster and safer, today announced it has extended its comprehensive patent license agreement with Samsung Electronics, a world leader in advanced semiconductor technology, for an additional ten years.
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GUC GLink™ Chip Leverages proteanTecs' Die-to-Die Interconnect Monitoring (Thursday Oct. 27, 2022)
Results highlight how deep data performance and reliability monitoring delivers comprehensive visibility into high bandwidth interfaces
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Everspin Signs Contract to Provide MRAM IP, Design and Manufacturing Services for Strategic Radiation Hardened FPGA Technology (Friday Oct. 21, 2022)
Everspin Technologies, the world’s leading developer and manufacturer of Magnetoresistive Random Access Memory (MRAM) persistent memory solutions, has signed a contract to provide MRAM technology, design, and back end of line manufacturing services with QuickLogic Corporation
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Siliconarts signed a Ray-Tracing GPU IP 'Raycore' license agreement with Verisilicon. (Thursday Oct. 13, 2022)
Siliconarts signed a Ray-Tracing GPU IP 'Raycore' license agreement with Verisilicon, the world's No. 7 semiconductor IP company and No. 1 in China.
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QuickLogic Partners with ChipMotion for eFPGA Implementations in SoC Designs (Tuesday Oct. 04, 2022)
QuickLogic today announced that it has signed an agreement with Hefei ChipMotion Microelectronics Company, Ltd., an electronic design services provider located in Hefei, Shanghai and Beijing, to provide turnkey eFPGA design support for SoC designs.
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CAES Wins Contracts for Development of Next-Generation, Octa-Core, user-selectable CPU for Space (Friday Sep. 23, 2022)
CAES announced that it has won multiple contracts with the European Space Agency (ESA) for the development of the GR765 System-on-Chip (SOC), the first user selectable CPU for space. This next-generation, radiation-hardened device will allow users to select between the LEON5 SPARC V8 or NOEL-V RISC-V RV64 processor cores.
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CAES' Quad-Core LEON4FT Processor Selected for European Next-Generation Star Sensors (Tuesday Sep. 20, 2022)
CAES, a leader in advanced mission-critical electronics for aerospace and defense, is pleased to announce that it has signed a multi-year contract with Jena-Optronik to deliver flight grade GR740 quad-core LEON4FT SPARC V8 Microprocessor devices for its next-generation sensor products.
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Veriest supports the development of Mobileye's innovative automotive sensor products (Wednesday Sep. 14, 2022)
Veriest Solutions, a leading international Electronics Design Services house, announced today that its engineers supported Mobileye in the development of a series of state-of-the-art automotive devices, powering autonomous driving solutions.
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Andes Technology Corp. Announces Its RISC-V CPU IP Serves as the Computing Engine in the New Renesas R9A02G020 MCU ASSP (Friday Sep. 09, 2022)
Andes Technology today announced Andes’ Entry-Level RISC-V core serves as the computing engine in the new G020 RISC-V MCU ASSP from Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions.
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SiMa.ai Partners with GUC to Accelerate Time to Market for Industry's First Purpose-Built Machine Learning Platform for the Embedded Edge (Thursday Sep. 08, 2022)
SiMa.ai, the machine learning company enabling effortless deployment and scaling at the embedded edge, today announced it has partnered with GUC (Global Unichip Corporation) to help leverage the company’s turnkey semiconductor services for continued first-time right design of its MLSoC Platform.
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NASA Selects SiFive and Makes RISC-V the Go-to Ecosystem for Future Space Missions (Wednesday Sep. 07, 2022)
SiFive, Inc., the founder and leader of RISC-V computing, today announced it has been selected by NASA to provide the core CPU for NASA’s next generation High-Performance Spaceflight Computing (HPSC) processor.
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Sonical partners with Dolphin Design to build the future of hearables (Monday Sep. 05, 2022)
Together, the companies will propose a game-changing heterogeneous computing platform to design ASIC/SoCs with an innovative operating system that will drastically change the end-user experience with hearables.
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Allegro DVT Partners with SiMa.ai to Optimize Power Efficiency for Embedded Edge Applications (Wednesday Aug. 31, 2022)
Allegro DVT today announced that SiMa.ai™, the machine learning company enabling effortless deployment at the embedded edge, has integrated Allegro’s high performance video Encoding and Decoding IPs into its Machine Learning System on a Chip (MLSoC) Platform.
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SiMa.ai Achieves First Silicon Success with Synopsys Solutions, Launching the Industry's Most Power-Efficient MLSoC Platform for the Embedded Edge (Tuesday Aug. 30, 2022)
The SiMa.ai MLSoC was designed and verified using Synopsys tools and incorporated a broad range of Synopsys IP, including the Synopsys ARC® EV Processor for real-time vision processing.
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Arteris Collaborates with SiMa.ai to Optimize ML Implementation With Efficient Topology Interconnect IP for the Embedded Edge (Tuesday Aug. 30, 2022)
Arteris today announced its collaboration with SiMa.ai integrating the Arteris highly adaptable FlexNoC interconnect IP into the SiMa.ai Machine Learning System-on-Chip (MLSoC).
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Racyics wins new automotive customer for its GF 22FDX Adaptive-Body-Biasing solution (Monday Aug. 29, 2022)
Racyics’ ABX solution for Adaptive-Body-Biasing was selected by Robert Bosch GmbH for its upcoming automotive products in GLOBALFOUNDRIES 22FDX technology.
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Imagination's GPU and AI Accelerator Licensed for the latest AIoT RISC-V-based applications (Thursday Aug. 25, 2022)
Imagination Technologies announces that its IMG B-Series GPU and PowerVR Series3NX NNA cores have been licensed for the latest RISC-V-based SoCs of Alibaba Group’s T-Head Semiconductor for AIoT (Artificial Intelligence of Things) applications.
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Imagination GPU selected by StarFive for next-generation VisionFive 2 single-board computer (Tuesday Aug. 23, 2022)
Imagination Technologies IMG BXE GPU IP has been integrated into StarFive’s latest RISC-V single-board computer (SBC), the VisionFive 2. With a proven track record of delivering high-quality semiconductor IP across industries, Imagination’s GPU was selected for the VisionFive 2 as it offers considerable advantages in power, performance, and area (PPA) for cloud, industrial, networking, consumer and automotive applications.
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MediaTek Adds MPEG-H Audio to its Pentonic Series of Smart TV Chips and Boosts TV 3.0 Access for Brazilian TV Sets (Thursday Aug. 18, 2022)
MediaTek, a leading fabless semiconductor company, and Fraunhofer IIS, primary developer of the MPEG-H 3D Audio standard, have once again collaborated for bringing the most advanced audio experience to consumer homes.
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CEVA Celebrates 15 Billionth CEVA-powered Chip Shipped (Tuesday Aug. 09, 2022)
Milestone underscores CEVA’s central role in the IoT era, enabling wireless connectivity and intelligence in billions of smartphones, consumer electronics, wearables, IoT endpoints and edge AI devices
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Avery Design Systems Verification IP Helps Solid State Storage Controller Startup Validate its Designs and Get to Market Faster (Monday Aug. 01, 2022)
Avery Design Systems, a leader in functional verification solutions, today announced its NVMe®, PCIe® and AXI® Verification IP (VIP) has been adopted by TenaFe, to validate and verify the design of its revolutionary Solid State Storage controllers.
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CAES' Quad Core LEON4FT Processor Selected for Next-Generation On-orbit Servicing Spacecraft (Monday Jul. 25, 2022)
CAES has announced that its radiation hardened microelectronics are on board SpaceLogistics’ Mission Robotic Vehicle (MRV) Spacecraft, and the Mission Extension POD (MEP), which will be deployed to assist in extending the life of aging satellites in space.