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Deals / Success Stories News

• Sonical partners with Dolphin Design to build the future of hearables (Monday Sep. 05, 2022)
  Together, the companies will propose a game-changing heterogeneous computing platform to design ASIC/SoCs with an innovative operating system that will drastically change the end-user experience with hearables.
  
  
• Allegro DVT Partners with SiMa.ai to Optimize Power Efficiency for Embedded Edge Applications (Wednesday Aug. 31, 2022)
  Allegro DVT today announced that SiMa.ai™, the machine learning company enabling effortless deployment at the embedded edge, has integrated Allegro’s high performance video Encoding and Decoding IPs into its Machine Learning System on a Chip (MLSoC) Platform.
  
  
• SiMa.ai Achieves First Silicon Success with Synopsys Solutions, Launching the Industry's Most Power-Efficient MLSoC Platform for the Embedded Edge (Tuesday Aug. 30, 2022)
  The SiMa.ai MLSoC was designed and verified using Synopsys tools and incorporated a broad range of Synopsys IP, including the Synopsys ARC® EV Processor for real-time vision processing.
  
  
• Arteris Collaborates with SiMa.ai to Optimize ML Implementation With Efficient Topology Interconnect IP for the Embedded Edge (Tuesday Aug. 30, 2022)
  Arteris today announced its collaboration with SiMa.ai integrating the Arteris highly adaptable FlexNoC interconnect IP into the SiMa.ai Machine Learning System-on-Chip (MLSoC).
  
  
• Racyics wins new automotive customer for its GF 22FDX Adaptive-Body-Biasing solution (Monday Aug. 29, 2022)
  Racyics’ ABX solution for Adaptive-Body-Biasing was selected by Robert Bosch GmbH for its upcoming automotive products in GLOBALFOUNDRIES 22FDX technology.
  
  
• Imagination's GPU and AI Accelerator Licensed for the latest AIoT RISC-V-based applications (Thursday Aug. 25, 2022)
  Imagination Technologies announces that its IMG B-Series GPU and PowerVR Series3NX NNA cores have been licensed for the latest RISC-V-based SoCs of Alibaba Group’s T-Head Semiconductor for AIoT (Artificial Intelligence of Things) applications.
  
  
• Imagination GPU selected by StarFive for next-generation VisionFive 2 single-board computer (Tuesday Aug. 23, 2022)
  Imagination Technologies IMG BXE GPU IP has been integrated into StarFive’s latest RISC-V single-board computer (SBC), the VisionFive 2. With a proven track record of delivering high-quality semiconductor IP across industries, Imagination’s GPU was selected for the VisionFive 2 as it offers considerable advantages in power, performance, and area (PPA) for cloud, industrial, networking, consumer and automotive applications.
  
  
• MediaTek Adds MPEG-H Audio to its Pentonic Series of Smart TV Chips and Boosts TV 3.0 Access for Brazilian TV Sets (Thursday Aug. 18, 2022)
  MediaTek, a leading fabless semiconductor company, and Fraunhofer IIS, primary developer of the MPEG-H 3D Audio standard, have once again collaborated for bringing the most advanced audio experience to consumer homes.
  
  
• CEVA Celebrates 15 Billionth CEVA-powered Chip Shipped (Tuesday Aug. 09, 2022)
  Milestone underscores CEVA’s central role in the IoT era, enabling wireless connectivity and intelligence in billions of smartphones, consumer electronics, wearables, IoT endpoints and edge AI devices
  
  
• Avery Design Systems Verification IP Helps Solid State Storage Controller Startup Validate its Designs and Get to Market Faster (Monday Aug. 01, 2022)
  Avery Design Systems, a leader in functional verification solutions, today announced its NVMe®, PCIe® and AXI® Verification IP (VIP) has been adopted by TenaFe, to validate and verify the design of its revolutionary Solid State Storage controllers.
  
  
• CAES' Quad Core LEON4FT Processor Selected for Next-Generation On-orbit Servicing Spacecraft (Monday Jul. 25, 2022)
  CAES has announced that its radiation hardened microelectronics are on board SpaceLogistics’ Mission Robotic Vehicle (MRV) Spacecraft, and the Mission Extension POD (MEP), which will be deployed to assist in extending the life of aging satellites in space.
  
  
• Silicon Labs Selects CoreHW Advanced Bluetooth AoA Switch for Dual Polarized Antenna Array Pro Kit (Monday Jul. 25, 2022)
  CoreHW announces that its CHW1010 16×1 antenna switch, supporting Bluetooth 5.1 Angle-of-Arrival (AoA) and Angle of Departure (AoD) applications, has been selected by Silicon Labs for their latest Antenna Array Pro Kit.
  
  
• iWave unveils the implementation of ARINC 818-2 IP Core in next-generation Combat Aircraft, designed by the Aeronautical Development Agency (ADA), Bangalore, India (Thursday Jul. 21, 2022)
  The Avionics for next-generation Indian Combat Aircraft is been designed and developed by the ADA for the Indian Air Force (IAF) and Indian Navy (IN). ADA approached iWave for ARINC 818 IP RTL development for Avionics cockpit display systems. It is our privilege to announce that iWave’s ARINC 818-2 IP Core is been developed and delivered successfully.
  
  
• Big Fish Semiconductor's U2 5.2 Audio SoC enters mass production with Dolphin Design's Audio IPs (Thursday Jul. 21, 2022)
  Dolphin Design and Big Fish Semiconductor have entered into a close and long-term partnership. Big Fish Semiconductor’s U2 BLE 5.2 Audio AI SoC (TSMC 40nm uLP process ultra-low power audio chip), now in mass fabrication, is the first outcome of this partnership.
  
  
• QuantWare selected to deliver Quantum Processing Units for Israel's first functional quantum computer (Wednesday Jul. 20, 2022)
  QuantWare, the leading provider of large-scale superconducting quantum processors, announced today that it has been selected to deliver Quantum Processing Units for Israel’s first fully functional quantum computer that will be hosted in the, to-be-established, Israel Quantum Computing Center.
  
  
• Arm Neoverse Adopted by Google Cloud (Thursday Jul. 14, 2022)
  Beginning today, Google Cloud customers and developers have access to Tau T2A VMs, using the Ampere Altra CPU, based on the Arm Neoverse N1 core.
  
  
• Inuitive Partners With Arteris IP for the Next Generation of Vision Processing for Edge Devices (Monday Jul. 11, 2022)
  Arteris today announced that Inuitive - fabless semiconductor company and designer of powerful multi-core processor ICs - has deployed the company’s FlexNoC® interconnect IP for its next generation of computer vision platforms based on Inuitive’s Vision-on-Chip processors.
  
  
• Nestwave Announces that Renesas has Adopted its IoT Geolocation Technology for Forthcoming LTE-M/NB-IoT Module (Wednesday Jul. 06, 2022)
  Nestwave, a global leader in low-power geolocation for the IoT, has announced that Renesas will be employing Nestwave technology in a new LTE-M/NB-IoT platform that the semiconductor manufacturer will be launching as a result of its licensing agreements with Sequans Communications, a leading provider of cellular IoT chips and modules.
  
  
• Vayyar Selects proteanTecs to Advance Vehicle Safety with Predictive Analytics (Tuesday Jun. 28, 2022)
  By selecting proteanTecs, Vayyar is empowering their multifunctional chip with an in-demand benefit for automotive OEMs—in-use reliability and performance monitoring.
  
  
• Synaptics Selects Allegro DVT's VVC Compliance Streams (Tuesday Jun. 28, 2022)
  Allegro DVT, the leading provider of video codec compliance test suites and semiconductor video IPs, today announced that Synaptics Incorporated, one of the world’s largest fabless semiconductor companies, has selected Allegro DVT’s VVC test streams to ensure full compliance of Synaptics’ products with the new emerging VVC video compression standard.
  
  
• Avery Design Systems PCI Express VIP Enables eTopus SerDes IP and Next-Generation ASIC and Chiplet applications to Achieve Compliance and High-Speed Connectivity (Tuesday Jun. 21, 2022)
  Avery Design Systems, a leader in functional verification solutions, today announced it has been chosen by eTopus as its verification IP solution partner for eTopus PCIe Gen 1-6 and 800G/400G Ethernet solutions and 112G SerDes IP for next-generation ASIC and Chiplet applications.
  
  
• Cadence Design IP portfolio in TSMC's N5 Process Gains Broad Adoption Among Leading Semiconductor and System Companies (Thursday Jun. 16, 2022)
  Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced a wide range of leading semiconductor and system customers have successfully adopted the comprehensive line-up of Cadence® Design IP in TSMC’s industry-leading 5nm process technology.
  
  
• SkyWater Announces Availability of SRAM Memory Compiler for 90 nm Strategic Rad Hard by Process Offering (Monday Jun. 13, 2022)
  SkyWater Technology today announced a new component of its RH90 IP ecosystem to enable 90 nm strategic rad-hard by process solutions for microelectronic devices used in harsh environments. Mobile Semiconductor will provide two static random-access memory (SRAM) compilers for SkyWater customers developing products on its maturing RH90 platform.
  
  
• Toshiba and Japan Semiconductor Develop Highly Reliable Versatile Analog Platform with Floadia's G1 technology for Automotive Applications (Thursday Jun. 09, 2022)
  Toshiba Electronic Devices & Storage Corporation (“Toshiba”) and Japan Semiconductor Corporation (“Japan Semiconductor”) have together developed a highly reliable and versatile analog platform with Floadia’s embedded non-volatile memory, G1, for automotive applications.
  
  
• TEMPO AI chip tapes out with videantis processor platform (Thursday Jun. 09, 2022)
  videantis GmbH, a leading supplier of deep learning, computer vision, image processing, and video coding solutions, today announced the tape-out of a low-power AI chip based on its v-MP6000UDX unified processing platform.
  
  
• Agile Analog signs first Chinese licensee for its analog IP (Wednesday Jun. 08, 2022)
  Agile Analog™, the analog IP innovators, has signed its first licensee in China. The customer will be using a set of Agile Analog IP in its new SSD Controller chip. This includes Bandgap Voltage Reference, Power On Reset, Digital Temperature Sensor and IR-Drop Detector.
  
  
• QuickLogic Awarded New $3.0 Million eFPGA Contract (Wednesday Jun. 01, 2022)
  QuickLogic today announced that it was awarded a new eFPGA contract for a previously announced foundry / process node combination, worth approximately $3.0 million.
  
  
• NSITEXE Selects ImperasDV for Automotive Quality RISC-V Processor Functional Design Verification (Tuesday May. 24, 2022)
  Imperas Software Ltd., the leader in RISC-V simulation solutions, today announced that NSITEXE, Inc., a group company of the DENSO Corporation that develops and sells high-performance semiconductor IP for automotive applications, has selected ImperasDV™ for advanced RISC-V processor hardware design verification.
  
  
• European Processor Initiative will have ZeroPoint IP in their chip (Wednesday May. 04, 2022)
  ZeroPoint Technologies AB today announced that they are a member of the European Processor Initiative (EPI) consortium. ZeroPoint will contribute with their Ziptilion™ IP on the EPAC 2.0 chip.
  
  
• Sondrel Deploys Arteris IP for Next-Generation Multi-Channel Automotive SoC (Tuesday May. 03, 2022)
  Sondrel and Arteris IP (Nasdaq: AIP), a leading provider of system IP consisting of network-on-chip (NoC) interconnect and IP deployment software that accelerate system-on-chip (SoC) creation, today announced that Sondrel is adopting FlexNoC interconnect IP in its next generation of advanced driver-assistance systems (ADAS) architecture.