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Deals / Success Stories News

• Everspin Signs Contract to Provide MRAM IP, Design and Manufacturing Services for Strategic Radiation Hardened FPGA Technology (Friday Oct. 21, 2022)
  Everspin Technologies, the world’s leading developer and manufacturer of Magnetoresistive Random Access Memory (MRAM) persistent memory solutions, has signed a contract to provide MRAM technology, design, and back end of line manufacturing services with QuickLogic Corporation
  
  
• Siliconarts signed a Ray-Tracing GPU IP 'Raycore' license agreement with Verisilicon. (Thursday Oct. 13, 2022)
  Siliconarts signed a Ray-Tracing GPU IP 'Raycore' license agreement with Verisilicon, the world's No. 7 semiconductor IP company and No. 1 in China.
  
  
• QuickLogic Partners with ChipMotion for eFPGA Implementations in SoC Designs (Tuesday Oct. 04, 2022)
  QuickLogic today announced that it has signed an agreement with Hefei ChipMotion Microelectronics Company, Ltd., an electronic design services provider located in Hefei, Shanghai and Beijing, to provide turnkey eFPGA design support for SoC designs.
  
  
• CAES Wins Contracts for Development of Next-Generation, Octa-Core, user-selectable CPU for Space (Friday Sep. 23, 2022)
  CAES announced that it has won multiple contracts with the European Space Agency (ESA) for the development of the GR765 System-on-Chip (SOC), the first user selectable CPU for space. This next-generation, radiation-hardened device will allow users to select between the LEON5 SPARC V8 or NOEL-V RISC-V RV64 processor cores.
  
  
• CAES' Quad-Core LEON4FT Processor Selected for European Next-Generation Star Sensors (Tuesday Sep. 20, 2022)
  CAES, a leader in advanced mission-critical electronics for aerospace and defense, is pleased to announce that it has signed a multi-year contract with Jena-Optronik to deliver flight grade GR740 quad-core LEON4FT SPARC V8 Microprocessor devices for its next-generation sensor products.
  
  
• Veriest supports the development of Mobileye's innovative automotive sensor products (Wednesday Sep. 14, 2022)
  Veriest Solutions, a leading international Electronics Design Services house, announced today that its engineers supported Mobileye in the development of a series of state-of-the-art automotive devices, powering autonomous driving solutions.
  
  
• Andes Technology Corp. Announces Its RISC-V CPU IP Serves as the Computing Engine in the New Renesas R9A02G020 MCU ASSP (Friday Sep. 09, 2022)
  Andes Technology today announced Andes’ Entry-Level RISC-V core serves as the computing engine in the new G020 RISC-V MCU ASSP from Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions.
  
  
• SiMa.ai Partners with GUC to Accelerate Time to Market for Industry's First Purpose-Built Machine Learning Platform for the Embedded Edge (Thursday Sep. 08, 2022)
  SiMa.ai, the machine learning company enabling effortless deployment and scaling at the embedded edge, today announced it has partnered with GUC (Global Unichip Corporation) to help leverage the company’s turnkey semiconductor services for continued first-time right design of its MLSoC Platform.
  
  
• NASA Selects SiFive and Makes RISC-V the Go-to Ecosystem for Future Space Missions (Wednesday Sep. 07, 2022)
  SiFive, Inc., the founder and leader of RISC-V computing, today announced it has been selected by NASA to provide the core CPU for NASA’s next generation High-Performance Spaceflight Computing (HPSC) processor.
  
  
• Sonical partners with Dolphin Design to build the future of hearables (Monday Sep. 05, 2022)
  Together, the companies will propose a game-changing heterogeneous computing platform to design ASIC/SoCs with an innovative operating system that will drastically change the end-user experience with hearables.
  
  
• Allegro DVT Partners with SiMa.ai to Optimize Power Efficiency for Embedded Edge Applications (Wednesday Aug. 31, 2022)
  Allegro DVT today announced that SiMa.ai™, the machine learning company enabling effortless deployment at the embedded edge, has integrated Allegro’s high performance video Encoding and Decoding IPs into its Machine Learning System on a Chip (MLSoC) Platform.
  
  
• SiMa.ai Achieves First Silicon Success with Synopsys Solutions, Launching the Industry's Most Power-Efficient MLSoC Platform for the Embedded Edge (Tuesday Aug. 30, 2022)
  The SiMa.ai MLSoC was designed and verified using Synopsys tools and incorporated a broad range of Synopsys IP, including the Synopsys ARC® EV Processor for real-time vision processing.
  
  
• Arteris Collaborates with SiMa.ai to Optimize ML Implementation With Efficient Topology Interconnect IP for the Embedded Edge (Tuesday Aug. 30, 2022)
  Arteris today announced its collaboration with SiMa.ai integrating the Arteris highly adaptable FlexNoC interconnect IP into the SiMa.ai Machine Learning System-on-Chip (MLSoC).
  
  
• Racyics wins new automotive customer for its GF 22FDX Adaptive-Body-Biasing solution (Monday Aug. 29, 2022)
  Racyics’ ABX solution for Adaptive-Body-Biasing was selected by Robert Bosch GmbH for its upcoming automotive products in GLOBALFOUNDRIES 22FDX technology.
  
  
• Imagination's GPU and AI Accelerator Licensed for the latest AIoT RISC-V-based applications (Thursday Aug. 25, 2022)
  Imagination Technologies announces that its IMG B-Series GPU and PowerVR Series3NX NNA cores have been licensed for the latest RISC-V-based SoCs of Alibaba Group’s T-Head Semiconductor for AIoT (Artificial Intelligence of Things) applications.
  
  
• Imagination GPU selected by StarFive for next-generation VisionFive 2 single-board computer (Tuesday Aug. 23, 2022)
  Imagination Technologies IMG BXE GPU IP has been integrated into StarFive’s latest RISC-V single-board computer (SBC), the VisionFive 2. With a proven track record of delivering high-quality semiconductor IP across industries, Imagination’s GPU was selected for the VisionFive 2 as it offers considerable advantages in power, performance, and area (PPA) for cloud, industrial, networking, consumer and automotive applications.
  
  
• MediaTek Adds MPEG-H Audio to its Pentonic Series of Smart TV Chips and Boosts TV 3.0 Access for Brazilian TV Sets (Thursday Aug. 18, 2022)
  MediaTek, a leading fabless semiconductor company, and Fraunhofer IIS, primary developer of the MPEG-H 3D Audio standard, have once again collaborated for bringing the most advanced audio experience to consumer homes.
  
  
• CEVA Celebrates 15 Billionth CEVA-powered Chip Shipped (Tuesday Aug. 09, 2022)
  Milestone underscores CEVA’s central role in the IoT era, enabling wireless connectivity and intelligence in billions of smartphones, consumer electronics, wearables, IoT endpoints and edge AI devices
  
  
• Avery Design Systems Verification IP Helps Solid State Storage Controller Startup Validate its Designs and Get to Market Faster (Monday Aug. 01, 2022)
  Avery Design Systems, a leader in functional verification solutions, today announced its NVMe®, PCIe® and AXI® Verification IP (VIP) has been adopted by TenaFe, to validate and verify the design of its revolutionary Solid State Storage controllers.
  
  
• CAES' Quad Core LEON4FT Processor Selected for Next-Generation On-orbit Servicing Spacecraft (Monday Jul. 25, 2022)
  CAES has announced that its radiation hardened microelectronics are on board SpaceLogistics’ Mission Robotic Vehicle (MRV) Spacecraft, and the Mission Extension POD (MEP), which will be deployed to assist in extending the life of aging satellites in space.
  
  
• Silicon Labs Selects CoreHW Advanced Bluetooth AoA Switch for Dual Polarized Antenna Array Pro Kit (Monday Jul. 25, 2022)
  CoreHW announces that its CHW1010 16×1 antenna switch, supporting Bluetooth 5.1 Angle-of-Arrival (AoA) and Angle of Departure (AoD) applications, has been selected by Silicon Labs for their latest Antenna Array Pro Kit.
  
  
• iWave unveils the implementation of ARINC 818-2 IP Core in next-generation Combat Aircraft, designed by the Aeronautical Development Agency (ADA), Bangalore, India (Thursday Jul. 21, 2022)
  The Avionics for next-generation Indian Combat Aircraft is been designed and developed by the ADA for the Indian Air Force (IAF) and Indian Navy (IN). ADA approached iWave for ARINC 818 IP RTL development for Avionics cockpit display systems. It is our privilege to announce that iWave’s ARINC 818-2 IP Core is been developed and delivered successfully.
  
  
• Big Fish Semiconductor's U2 5.2 Audio SoC enters mass production with Dolphin Design's Audio IPs (Thursday Jul. 21, 2022)
  Dolphin Design and Big Fish Semiconductor have entered into a close and long-term partnership. Big Fish Semiconductor’s U2 BLE 5.2 Audio AI SoC (TSMC 40nm uLP process ultra-low power audio chip), now in mass fabrication, is the first outcome of this partnership.
  
  
• QuantWare selected to deliver Quantum Processing Units for Israel's first functional quantum computer (Wednesday Jul. 20, 2022)
  QuantWare, the leading provider of large-scale superconducting quantum processors, announced today that it has been selected to deliver Quantum Processing Units for Israel’s first fully functional quantum computer that will be hosted in the, to-be-established, Israel Quantum Computing Center.
  
  
• Arm Neoverse Adopted by Google Cloud (Thursday Jul. 14, 2022)
  Beginning today, Google Cloud customers and developers have access to Tau T2A VMs, using the Ampere Altra CPU, based on the Arm Neoverse N1 core.
  
  
• Inuitive Partners With Arteris IP for the Next Generation of Vision Processing for Edge Devices (Monday Jul. 11, 2022)
  Arteris today announced that Inuitive - fabless semiconductor company and designer of powerful multi-core processor ICs - has deployed the company’s FlexNoC® interconnect IP for its next generation of computer vision platforms based on Inuitive’s Vision-on-Chip processors.
  
  
• Nestwave Announces that Renesas has Adopted its IoT Geolocation Technology for Forthcoming LTE-M/NB-IoT Module (Wednesday Jul. 06, 2022)
  Nestwave, a global leader in low-power geolocation for the IoT, has announced that Renesas will be employing Nestwave technology in a new LTE-M/NB-IoT platform that the semiconductor manufacturer will be launching as a result of its licensing agreements with Sequans Communications, a leading provider of cellular IoT chips and modules.
  
  
• Vayyar Selects proteanTecs to Advance Vehicle Safety with Predictive Analytics (Tuesday Jun. 28, 2022)
  By selecting proteanTecs, Vayyar is empowering their multifunctional chip with an in-demand benefit for automotive OEMs—in-use reliability and performance monitoring.
  
  
• Synaptics Selects Allegro DVT's VVC Compliance Streams (Tuesday Jun. 28, 2022)
  Allegro DVT, the leading provider of video codec compliance test suites and semiconductor video IPs, today announced that Synaptics Incorporated, one of the world’s largest fabless semiconductor companies, has selected Allegro DVT’s VVC test streams to ensure full compliance of Synaptics’ products with the new emerging VVC video compression standard.
  
  
• Avery Design Systems PCI Express VIP Enables eTopus SerDes IP and Next-Generation ASIC and Chiplet applications to Achieve Compliance and High-Speed Connectivity (Tuesday Jun. 21, 2022)
  Avery Design Systems, a leader in functional verification solutions, today announced it has been chosen by eTopus as its verification IP solution partner for eTopus PCIe Gen 1-6 and 800G/400G Ethernet solutions and 112G SerDes IP for next-generation ASIC and Chiplet applications.