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Deals / Success Stories News

• QuickLogic Announces a New $1.5 Million eFPGA Contract (Wednesday Mar. 30, 2022)
  QuickLogic Corporation (NASDAQ: QUIK), a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP (eFPGA), and Endpoint AI solutions, today announced that it has won a new eFPGA contract.
  
  
• Movellus to Provide Intelligent Clock Network IP to BAE Systems (Tuesday Mar. 29, 2022)
  Movellus, Inc, today announced a subcontractor agreement that will result in the BAE Systems’ FAST Labs™ research and development organization having access to Movellus’ Intelligent Clock Network IP.
  
  
• Wacom, STMicroelectronics, and CEVA Collaborate to Enhance the Digital Pen Experience (Tuesday Mar. 29, 2022)
  The combined effort leverages the specialized capabilities of the three companies to create an advanced, sensor-enabled digital pen that can be adopted by OEMs to add value to their smartphone, tablet, notebook, PC, interactive whiteboard or other smart-display products.
  
  
• QuickLogic Announces a New Approximately $1M eFPGA Contract (Thursday Mar. 10, 2022)
  QuickLogic, a developer of ultra-low power multi-core voice-enabled SoCs, embedded FPGA IP (eFPGA), and Endpoint AI solutions, today announced that it has won a new eFPGA contract worth approximately $1 million.
  
  
• Zepp Health signs licence agreement for sureCore's EverOn ultra-low voltage memory IP (Thursday Mar. 10, 2022)
  Zepp Health, a market leader in digital health management, today announced it has licenced sureCore’s revolutionary, ultra-low voltage SRAM memory EverOn™ as part of its ongoing strategy to deliver improved computing efficiency at reduced power for its family of wearable devices.
  
  
• Ubiscale announces new customer for Cobalt, its low-power GNSS IP core (Wednesday Mar. 09, 2022)
  Ubiscale, announces today a new tier-1 customer for Cobalt, a GNSS receiving IP core supporting GPS, Galileo, and BeiDou as well as smart cloud assistance. The IP is optimized for battery powered IoT sensors, asset tracking devices and mass-market mobile products such as wearables, animals and goods trackers.
  
  
• OpenFive and EdgeCortix Collaborate on an AI Accelerator Custom SoC (Monday Mar. 07, 2022)
  EdgeCortix and OpenFive today announced they are collaborating to develop and deliver a highly power-efficient and high-performance custom 12nm FinFET SoC that accelerates artificial intelligence processing for real-time edge applications.
  
  
• Flex Logix and the Air Force Research Laboratory Expand their License to Include any Flex Logix Technology for Research and Chip Prototyping in all Available Processes including Radhard (Monday Mar. 07, 2022)
  Flex Logix® Technologies, Inc., the leading supplier of embedded FPGA (eFPGA) IP, architecture and software, announced today that it has signed a broad license with the Air Force Research Laboratory, Sensors Directorate (AFRL/RY) covering any Flex Logix IP technology for use in all US Government-funded programs for research and prototyping purposes.
  
  
• ZeroPoint Technologies signs Memory Encryption contract (Monday Mar. 07, 2022)
  ZeroPoint Technologies AB today announced that they have won their first Memory Encryption IP licensing contract with a global semiconductor developer.
  
  
• CEVA Announces Milestone of 100 Million CEVA-powered Cellular IoT Chips Shipped (Tuesday Mar. 01, 2022)
  CEVA today announced that more than 100 million CEVA-powered cellular IoT chips have been shipped by CEVA licensees since the beginning of 2020.
  
  
• Expedera Announces First Production Shipments of Its Deep Learning Accelerator IP in a Consumer Device (Tuesday Mar. 01, 2022)
  Expedera Inc, a leading provider of scalable Deep Learning Accelerator (DLA) semiconductor intellectual property (IP), today announced that a global consumer device maker is now in production with its Origin™ DLA solution.
  
  
• Computing-in-Memory Innovator Solves Speech Processing Challenges at the Edge Using Microchip's Analog Embedded SuperFlash Technology (Tuesday Mar. 01, 2022)
  Microchip Technology, via its Silicon Storage Technology (SST) subsidiary, today announced that its SuperFlash® memBrain™ neuromorphic memory solution has solved this problem for the WITINMEM neural processing SoC, the first in volume production that enables sub-mA systems to reduce speech noise and recognize hundreds of command words, in real time and immediately after power-up.
  
  
• CAST and Achronix Expand Partnership to Deliver Secure FPGA Solutions (Tuesday Mar. 01, 2022)
  Semiconductor intellectual property provider CAST and fabless semiconductor firm Achronix Semiconductor Corporation have worked together to integrate CAST’s encryption technology into the Achronix Speedster7t FPGA devices.
  
  
• PCI Express VIP from Avery Design Systems Selected by Fungible for Ensuring Compliance, Connectivity in Hyperscale Data Centers (Monday Feb. 28, 2022)
  Avery Design Systems, a leader in functional verification solutions, today announced its PCI Express Verification IP (VIP) has been selected by Fungible Inc., a data center infrastructure company, to ensure compliance and connectivity of its Fungible Data Processing Unit™ (DPU).
  
  
• ZeroPoint Technologies signs Memory Booster contract (Monday Feb. 28, 2022)
  ZeroPoint Technologies AB today announced that they have won their first Memory Booster IP licensing contract with a global semiconductor developer. ZeroPoint Technologies provides the world’s only available Memory Booster IP block for System on Chips (SoCs), effectively doubling a computer’s main memory capacity and memory bandwidth; providing significantly more performance per watt.
  
  
• LeapMind announces license agreement for AI accelerator "Efficiera" with Maxell Frontier (Tuesday Feb. 22, 2022)
  LeapMind today announced that have concluded a commercial license agreement of LeapMind’s ultra-low power AI inference accelerator IP "Efficiera" with Maxell Frontier Co., Ltd. (Yokohama, Kanagawa; President: Hiroyuki Ota), the group company of Maxell, Ltd.
  
  
• OPENEDGES LPDDR54 PHY IP Licensed by Novachips (Thursday Feb. 10, 2022)
  OPENEDGES is pleased to announce that Novachips, an innovator in flash storage processors and storage modules, has licensed the silicon-proven LPDDR5/4x/4 ORBIT™ PHY IP (LPDDR54 OPHY™) developed by The Six Semiconductor (TSS) in 12nm process technology.
  
  
• Mixel MIPI C-PHY/D-PHY Combo IC Integrated in isMedia Frame Grabber Family of Products for Sensor Applications (Tuesday Feb. 01, 2022)
  Mixel®, a longtime leading provider of mixed-signal intellectual property (IP), announced today that its MIPI C-PHYSM/D-PHYSM IC has been successfully integrated in the isMedia UCI72S frame grabber product, which is now available in volume quantities.
  
  
• Deep Vision Adopts SiFive RISC-V to Add OpenCV-Enabled AI Support (Monday Jan. 17, 2022)
  SiFive, Inc., the founder and leader of RISC-V computing, today announced that Deep Vision will integrate SiFive RISC-V processor IP into its next-generation inference accelerators to enable more comprehensive computer vision and voice in edge devices.
  
  
• Light Leverages Cadence Tensilica Vision Q7 DSP for Enhanced Depth Perception in Next-Generation ADAS Systems (Monday Jan. 17, 2022)
  Light™ and Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Light has deployed the Cadence® Tensilica® Vision Q7 DSP for use in Light’s Clarity™ Depth Perception Platform.
  
  
• Rambus Root of Trust Delivers FIPS 140-2 CMVP Security in Kyocera Multifunction Products (Wednesday Jan. 12, 2022)
  Rambus today announced that Kyocera Evolution Series MFPs offer data security meeting Federal Information Processing Standards (FIPS) 140-2 Cryptographic Module Validation Program (CMVP) standards using the Rambus RT-130 Root of Trust and AES-IP-38 AES Accelerator IP.
  
  
• Kyocera Selects Rambus for IoT Security (Wednesday Jan. 12, 2022)
  Kyocera selected the FIPS 140-2 CMVP-certified Rambus RT-130 Root of Trust, and AES-IP-38 AES Accelerator to secure their multi-function products.
  
  
• Alphawave Collaborates with Microchip on AlphaCore 112Gbps IP for 800G and 1.6T Ethernet Applications (Tuesday Jan. 11, 2022)
  Alphawave IP, a global leader in high-speed connectivity for the world’s technology infrastructure, is pleased to announce that Microchip Technology has selected Alphawave’s AlphaCore100 for its next-generation META-DX2 1.6Tbps Ethernet retimer family.
  
  
• Winner Micro Licenses CEVA's Bluetooth and Wi-Fi IP Platforms for IoT Connectivity SoC (Wednesday Jan. 05, 2022)
  CEVA today announced that Beijing Winner Microelectronics Co. (Winner Micro), a supplier of wireless communications chips for the IoT, has licensed the RivieraWaves BLE5 and Wi-Fi 6 IP platforms
  
  
• ASPEED and CEVA Collaborate to Enable Superior Voice Experience on 2nd Generation Cupola360 SoC for Smart Cameras and Video Conferencing Systems (Monday Jan. 03, 2022)
  CEVA-BX1 DSP powers audio/voice workloads in ASPEED’s AST1230 smart camera SoC; CEVA ClearVox voice front-end software is available to ASPEED’s customers to address most challenging multi-microphone conferencing use cases
  
  
• The European Space Agency (ESA) has awarded a contract to CAES, in the frame of the ARTES Competitiveness & Growth programme, to develop System-on-Chip for space applications (Wednesday Dec. 22, 2021)
  New contract advances CAES Gaisler product portfolio to include a 16-core RISC-V platform that will enable the next generation of space-grade fault- and radiation-tolerant microprocessors.
  
  
• Imagination's Series3NX neural network accelerator helps UNISOC to create 5G smartphone platform (Monday Dec. 20, 2021)
  Imagination Technologies announces that UNISOC, a leading fabless semiconductor company, has used Imagination’s Series3NX neural network accelerator (NNA) IP in its Tanggula T770 and T760 system-on-chips (SoCs), its new smartphone 5G platforms.
  
  
• Hardent VESA DSC IP Cores Licensed by Teledyne LeCroy for DisplayPort Test Solution (Monday Dec. 20, 2021)
  Hardent, Inc., a leading provider of video compression IP cores, today announced that the worldwide leader in protocol test solutions, Teledyne LeCroy, has licensed Hardent’s VESA Display Stream Compression (DSC) IP cores for use in its quantumdata™ M42d DisplayPort 2.0 Video Analyzer/Generator.
  
  
• MediaTek Dimensity 9000 uses Armv9 technology for unparalleled performance (Thursday Dec. 16, 2021)
  MediaTek’s new flagship SoC, the Dimensity 9000, is a key milestone, being the first Total Compute solution available on silicon. The premium Total Compute solution adopts the powerful Arm Cortex-X2 CPU alongside 3x Arm Cortex-A710 CPUs and 4x Arm Cortex-A510 CPUs, as well as a 10-core Arm Mali-G710 GPU, all optimized on TSMC 4nm.
  
  
• AST SpaceMobile Selects EnSilica to Support the Development of its Next Generation Advanced Cellular ASIC Chip (Friday Dec. 10, 2021)
  EnSilica today announced that it has been selected by AST SpaceMobile, Inc. (NASDAQ: ASTS) to develop the next generation ASIC for use in the company’s planned space-based cellular broadband network.