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Deals / Success Stories News

• ASPEED and CEVA Collaborate to Enable Superior Voice Experience on 2nd Generation Cupola360 SoC for Smart Cameras and Video Conferencing Systems (Monday Jan. 03, 2022)
  CEVA-BX1 DSP powers audio/voice workloads in ASPEED’s AST1230 smart camera SoC; CEVA ClearVox voice front-end software is available to ASPEED’s customers to address most challenging multi-microphone conferencing use cases
  
  
• The European Space Agency (ESA) has awarded a contract to CAES, in the frame of the ARTES Competitiveness & Growth programme, to develop System-on-Chip for space applications (Wednesday Dec. 22, 2021)
  New contract advances CAES Gaisler product portfolio to include a 16-core RISC-V platform that will enable the next generation of space-grade fault- and radiation-tolerant microprocessors.
  
  
• Imagination's Series3NX neural network accelerator helps UNISOC to create 5G smartphone platform (Monday Dec. 20, 2021)
  Imagination Technologies announces that UNISOC, a leading fabless semiconductor company, has used Imagination’s Series3NX neural network accelerator (NNA) IP in its Tanggula T770 and T760 system-on-chips (SoCs), its new smartphone 5G platforms.
  
  
• Hardent VESA DSC IP Cores Licensed by Teledyne LeCroy for DisplayPort Test Solution (Monday Dec. 20, 2021)
  Hardent, Inc., a leading provider of video compression IP cores, today announced that the worldwide leader in protocol test solutions, Teledyne LeCroy, has licensed Hardent’s VESA Display Stream Compression (DSC) IP cores for use in its quantumdata™ M42d DisplayPort 2.0 Video Analyzer/Generator.
  
  
• MediaTek Dimensity 9000 uses Armv9 technology for unparalleled performance (Thursday Dec. 16, 2021)
  MediaTek’s new flagship SoC, the Dimensity 9000, is a key milestone, being the first Total Compute solution available on silicon. The premium Total Compute solution adopts the powerful Arm Cortex-X2 CPU alongside 3x Arm Cortex-A710 CPUs and 4x Arm Cortex-A510 CPUs, as well as a 10-core Arm Mali-G710 GPU, all optimized on TSMC 4nm.
  
  
• AST SpaceMobile Selects EnSilica to Support the Development of its Next Generation Advanced Cellular ASIC Chip (Friday Dec. 10, 2021)
  EnSilica today announced that it has been selected by AST SpaceMobile, Inc. (NASDAQ: ASTS) to develop the next generation ASIC for use in the company’s planned space-based cellular broadband network.
  
  
• NextChip Selects Rambus Security IP to Secure Apache6 Automotive Processor (Wednesday Dec. 08, 2021)
  Rambus today announced that NextChip has selected the Rambus RT-640 Root of Trust and MACsec-IP-160 Protocol Engine to provide hardware-level security for their next-generation Apache6 automotive processor.
  
  
• intoPIX TicoRAW technology added with High-Efficiency RAW recording of Nikon Z 9 flagship mirrorless camera (Tuesday Dec. 07, 2021)
  intoPIX is pleased to announce today the successful integration of the TicoRAW technology into the new generation of Nikon cameras, including the latest flagship Z 9 mirrorless camera.
  
  
• Imagination announces GPU licensing deal with YADRO (Monday Dec. 06, 2021)
  Imagination Technologies announces that its ultra-efficient BXM-4-64 GPU has been licensed by YADRO Microprocessors, a fabless IC design house, subsidiary of YADRO, a leader in enterprise server and storage solutions in the Russian market.
  
  
• Imagination B-Series GPU IP selected for Innosilicon graphics card (Friday Dec. 03, 2021)
  Imagination Technologies reports that Innosilicon is using Imagination’s B-Series GPU technology in its latest PCI-E form-factor graphics card, Fantasy One.
  
  
• HPMicro Semiconductor Announces the Release of the HPM6000 Series of Microcontrollers with AndesCore Dual D45 Cores (Thursday Dec. 02, 2021)
  HPMicro Semiconductor, a leading manufacturer of high-performance embedded solutions, and Andes Technology, a leading supplier of 32/64-bit RISC-V embedded processors (TWSE: 6533; SIN: US03420C2089; ISIN: US03420C1099), today jointly released the HPM6000 series, the real-time RISC-V microcontrollers with the world’s strongest performance.
  
  
• BrainChip Partners with MegaChips to Develop Next-Generation Edge-Based AI Solutions (Monday Nov. 22, 2021)
  BrainChip today announced that MegaChips, a pioneer in the ASIC industry, has licensed BrainChip Akida™ IP to enhance and grow its technology positioning for next-generation, Edge-based AI solutions.
  
  
• Elmos adopts Arm Cortex-M IP for its next-generation automotive MCU based product family (Friday Nov. 19, 2021)
  Elmos Semiconductor SE (FSE: ELG) today announced a long-term partnership with semiconductor IP leader Arm, whose energy-efficient processor designs have enabled advanced computing in more than 200 billion chips to date.
  
  
• sureCore designs special high performance multi-port memory for Semidynamics AI chip (Thursday Nov. 18, 2021)
  sureCore, the embedded memory specialist, has designed a power and area efficient, high performance, multi-port, embedded memory solution for Semidynamics’ new RISC-V-based, tensor processing chip.
  
  
• BBright UHD Media Gateway integrates intoPIX JPEG XS technology (Tuesday Nov. 16, 2021)
  intoPIX is excited to announce that BBright has integrated the intoPIX accelerated JPEG XS software in their UHD-Decode platform.
  
  
• VeriSilicon's Neural Network Processor IP Embedded in Over 100 AI Chips (Friday Nov. 12, 2021)
  VeriSilicon (688521.SH), a leading Silicon Platform as a Service (SiPaaS®) company, today announced its neural network processor (the Vivante1 NPU) IP designed for artificial intelligence (AI) applications now features in more than 100 AI chips supplied by 50 licensees.
  
  
• NSITEXE DR1000C, a RISC-V based parallel processor IP with vector extension (DFP: Data Flow Processor) has been licensed for Renesas' new RH850/U2B Automotive MCUs (Tuesday Nov. 09, 2021)
  NSITEXE, Inc. announced that the DR1000C, a RISC-V based parallel processor IP with vector extension (DFP: Data Flow Processor), has been licensed to Renesas for adoption in RH850/U2B microcontrollers (MCUs), a powerful new group of automotive MCUs.
  
  
• Kneron Edge AI SoC Powered by Andes RISC-V Processor Core D25F (Thursday Nov. 04, 2021)
  Kneron together with Andes Technology today announced formal mass production of Kneron’s next-generation Edge AI SoC KL530, powered by Andes’ D25F processor in consideration of its efficient pipeline architecture, powerful Packed-SIMD DSP extension instructions, and IEEE754-compliant high-performance single/double precision floating RVFD extensions.
  
  
• Nextchip licenses aiMotive's aiWare4 for their Apache6 automotive domain processor (Wednesday Nov. 03, 2021)
  Nextchip have licensed aiMotive’s latest aiWare4™ NPU hardware IP for their next-generation ASIL-B compliant SoC for AVP and other challenging automotive applications
  
  
• MegaChips Deploys Omni Design's Silicon-Validated Data Converters (Tuesday Oct. 19, 2021)
  Omni Design Technologie today announced that MegaChips Corporation is deploying the 12-bit 6 Gsps analog-to-digital (ADC) and 12-bit 7 Gsps digital-to-analog (DAC) converters in its next-generation automotive SoCs.
  
  
• Arteris IP FlexNoC Interconnect Licensed by Eyenix for AI-Enabled Imaging/Digital Camera SoC (Tuesday Oct. 19, 2021)
  Arteris IP today announced that imaging SoC leader Eyenix has licensed FlexNoC interconnect IP for its next-generation image processing system-on-chip (SoC).
  
  
• Next generation intelligent wearables enabled by sureCore's ultra-low power memory (Tuesday Oct. 05, 2021)
  As the market for wearable electronics and earbuds grows dramatically, architects are adding more features or ‘smarts’ to create product differentiation. The additional intelligence means that designers are required to add more embedded memory to the chip resulting in increased power demands.
  
  
• WiLAN Signs Wireless License with Motorola (Friday Oct. 01, 2021)
  Wi-LAN Inc. ("WiLAN"), a Quarterhill Inc. ("Quarterhill") company (TSX: QTRH) (OTCQX: QTRHF), today announced that WiLAN has entered into a license agreement with Motorola Mobility LLC. The licensed patents relate to wireless technology.
  
  
• Arteris IP Announces 4D LiDAR Pioneer Aeva as its 200th Customer (Wednesday Sep. 29, 2021)
  Arteris IP, a leading provider of network-on-chip (NoC) interconnect and other intellectual property (IP) technology that manages the on-chip communications in digital system-on-chip (SoC) semiconductor devices, today announced that 4D LiDAR innovator Aeva Technologies, Inc., has licensed FlexNoC interconnect IP for its next-generation digital processing system-on-chip (SoC).
  
  
• Faraday Announces the Success of Its ARM-based SoCs in Wide Ranging Applications (Tuesday Sep. 28, 2021)
  Faraday Technology Corporation (TWSE: 3035), a leading ASIC design service and IP provider, today announced that total shipments of ARM based SoC designs have exceeded 550 million units.
  
  
• Rambus and Kioxia Renew Patent License Agreement (Thursday Sep. 23, 2021)
  Rambus Inc. (NASDAQ: RMBS), a provider of industry-leading chips and silicon IP making data faster and safer, today announced that it has extended its patent license agreement with Kioxia Corporation, a world leader in memory solutions.
  
  
• Amphenol ICC Develops 112Gb/s Interconnect Technology with eTopus Products for High Speed IP Solutions (Wednesday Sep. 15, 2021)
  Amphenol ICC, the global leader in connector technology, design and manufacturing, and eTopus Technology, a pioneer of ultra-high-speed ADC/DSP-based SerDes for wireline applications including data center, cloud, edge, and 5G base stations, today announced the development of a 112Gb/s interconnect technology built on their products.
  
  
• Weebit and SkyWater Announce Agreement to take ReRAM Technology to Volume Production (Thursday Sep. 09, 2021)
  SkyWater licenses Weebit’s ReRAM technology for a range of customer designs to enable higher performance and lower power memory solutions in IoT, automotive, AI, and other applications
  
  
• Attopsemi's I-fuse OTP IP Embedded into NJR's Products (Thursday Sep. 09, 2021)
  Attopsemi™ Technology, innovator of the revolutionary I-fuse™ OTP IP, together with New Japan Radio (“NJR”), one of the leading electronic device manufacturers in the world, announced jointly that I-fuse™ OTP IP was successfully embedded into NJR’s products.
  
  
• Omni Design and LeddarTech Collaborate to Accelerate Mass Market Deployment of LiDAR for ADAS and Autonomous Vehicles (Tuesday Sep. 07, 2021)
  LeddarTech’s LiDAR SoC integrates analog-to-digital converters (ADC) and a multi-channel analog front-end (AFE) from Omni Design.