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Fabless / IDM News

• SEMIFIVE announces commercialization of its 5nm HPC SoC Platform with lead partner Rebellions, AI Chipmaker startup based in Korea (Monday Jun. 26, 2023)
  SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, today announced successful commercialization of its 5nm HPC SoC Platform with its lead partner Rebellions, an AI hardware and software solution startup.
  
  
• AONDevices Introduces Breakthrough Super Low-Power, Low-Latency, Customizable Edge AI Speech Enhancement (Tuesday Jun. 13, 2023)
  AONDevices, a provider of super low-power, high-performance on-device AI processors and full stack solutions, today announced the launch of its groundbreaking AONDenoise™ – a compact, efficient edge AI denoising technology.
  
  
• SynSense releases the Speck™ Demo kit, enabling users to rapidly deploy and validate event-based neuromorphic vision applications (Monday Jun. 12, 2023)
  SynSense has announced the launch of a Speck™ Demo Kit. This compact development module enables users to quickly and easily deploy and validate their event-based neuromorphic vision applications.
  
  
• Cortus Launches ULYSS automotive MCU family (Thursday Jun. 08, 2023)
  Cortus, an innovative French fabless semiconductor manufacturing group today announces the launching of its secure low power RISC-V automotive microcontrollers (MCUs) ULYSS family.
  
  
• Infineon's HYPERRAM™ 3.0 memory and Autotalks' 3rd generation chipset drive next-generation automotive V2X applications (Thursday Jun. 08, 2023)
  Infineon Technologies and Autotalks announced today that the two companies are collaborating to deliver solutions for next-generation V2X (Vehicle-to-Everything communication) applications.
  
  
• Kalray Announces Production Launch of New "Coolidge™2" DPU Processor Optimized for AI and Intensive Data Processing (Wednesday Jun. 07, 2023)
  New version of Coolidge™ processor will deliver up to 10 times better computing performance resulting in an ultra-high-performance processor suited for AI and data-intensive storage workloads
  
  
• Tachyum Testing Applications on Prodigy FPGA (Thursday Jun. 01, 2023)
  Tachyum™ announced today it has achieved another milestone on the road to commercialization of Prodigy, the world’s first Universal Processor, as it begins testing key applications on Prodigy FPGA prototypes.
  
  
• Chiplet Pioneer Eliyan Achieves First Silicon in Record Time with Implementation in TSMC 5nm Process, Confirms Most Efficient Chiplet Interconnect Solution in the Multi-Die Era (Wednesday May. 31, 2023)
  Eliyan's 40Gbps/bump chiplet interconnect silicon demonstrates the capability to achieve beachfront bandwidths up to 3Tbps/mm on standard organic substrate at unprecedented power, area, and latency, eliminating the need for complex Silicon Interposers in most applications.
  
  
• MediaTek Partners With NVIDIA to Provide Full-Scale Product Roadmap to the Automotive Industry (Monday May. 29, 2023)
  Integrating new NVIDIA GPU chiplet into the MediaTek Dimensity Auto platform provides the most advanced AI, connectivity and computing capabilities for next-generation smart cabins
  
  
• Socionext Introduces Ultra-compact, Ultra-low-power 60GHz Radio-frequency Ranging Sensors for Automotive Applications (Monday May. 29, 2023)
  Socionext today introduced the SC1260 Series radio-frequency ranging sensors for automotive applications. This new series utilizes the 60GHz frequency band and time-division multiplexing (TDM-MIMO) operation with multiple transmitting and receiving antennas that can detect the position and movement of passengers in a vehicle with maximum accuracy.
  
  
• PCI-SIG Certifies VectorPath Accelerator Card for PCIe Gen5 x16 @ 32 GT/s (Tuesday May. 23, 2023)
  Achronix today announced that its VectorPath accelerator card featuring a Speedster®7t FPGA has been certified by PCI-SIG for PCIe Gen5 and is the first and only FPGA accelerated CEM add-in card certified for PCIe Gen5 x16 at 32 gigatransfers per second (GT/s) on the PCI-SIG Integrator's list.
  
  
• Sequans Introduces Taurus 5G NR: The World's First Chipset Specifically Optimized for 5G Broadband IoT Devices (Tuesday May. 23, 2023)
  Sequans Communications today introduced Taurus 5G NR, the world’s first chipset platform specifically optimized for 5G broadband IoT devices, providing cost-effective support for applications including fixed wireless access, portable hotspots, mobile computing, video surveillance, and high-end industrial IoT.
  
  
• NVIDIA Grace Drives Wave of New Energy-Efficient Arm Supercomputers (Monday May. 22, 2023)
  NVIDIA today announced a supercomputer built on the NVIDIA Grace™ CPU Superchip, adding to a wave of new energy-efficient supercomputers based on the Arm® Neoverse™ platform.
  
  
• Audio Pioneer xMEMS Announces General Availability of the World's Only All-Silicon, Solid-State Fidelity Micro Speakers (Monday May. 22, 2023)
  Solid-State FidelityTM and DynamicVent technology will revolutionize the true wireless stereo (TWS), in-ear monitor (IEM), and hearing aid markets through vastly superior audio experiences and improved consumer listening comfort.
  
  
• Esperanto Technologies Launches New Cloud Access Program to Broaden Access to its Massively Parallel, Low Power RISC-V Solutions (Thursday Apr. 27, 2023)
  Esperanto Technologies today announced the availability of a new cloud-based program that expands access to the company’s fully configured evaluation servers featuring its industry leading ET-SoC-1 compute accelerators.
  
  
• Marvell Demonstrates Industry's First 3nm Data Infrastructure Silicon (Monday Apr. 24, 2023)
  Marvell Technology has demonstrated high-speed, ultra-high bandwidth silicon interconnects produced on Taiwan Semiconductor Manufacturing Company’s (TSMC) 3-nanometer (3nm) process. Marvell’s industry-first silicon building blocks in this node include 112G XSR SerDes (serializer/de-serializer), Long Reach SerDes, PCIe Gen 6 / CXL 3.0 SerDes, and a 240 Tbps parallel die-to-die interconnect.
  
  
• EdgeCortix Expands Delivery of its Industry Leading SAKURA-I AI Co-processor Devices and MERA Software Suite (Thursday Apr. 20, 2023)
  EdgeCortix announced, it is shipping its industry leading, energy-efficient, turn-key, AI co-processor, branded as the EdgeCortix SAKURA-I, to its global Early Access Program members.
  
  
• Esperanto Technologies Announces RISC-V Industry Milestone Of Generative AI Models Running on ET-SoC-1; Access to be Made Available to the RISC-V Research Community (Thursday Apr. 20, 2023)
  Esperanto Technologies today announced that it has ported and is running a range of Generative AI models on its low power RISC-V hardware.
  
  
• Pine64 launches world's first RISC-V tablet device - PineTab-V for presale (Friday Apr. 14, 2023)
  PineTab-V is designed by the worlding leading hardware manufacturer Pine64. The tablet carries StarFive JH7110 as the primary SoC processor.
  
  
• EnSilica evaluation platform for EN62020 sensor interface ASIC speeds up development of wearable fitness and healthcare sensor devices (Thursday Apr. 13, 2023)
  EnSilica (LON:ENSI), a leading ASIC and mixed signal chip maker, has released an evaluation platform to speed up the development of wearable fitness and healthcare vital-sign monitoring systems.
  
  
• Renesas Samples Its First 22-nm Microcontroller (Tuesday Apr. 11, 2023)
  The first chip produced on the new 22-nm process is an extension to Renesas’ popular RA family of 32-bit Arm® Cortex®-M microcontrollers. This new wireless MCU delivers Bluetooth® 5.3 Low Energy (LE) with the integration of a software-defined radio (SDR).
  
  
• AMD Launches First 5nm ASIC-based Media Accelerator Card to Power New Era of Interactive Media Services at Scale (Thursday Apr. 06, 2023)
  AMD (NASDAQ: AMD) today announced the AMD Alveo™ MA35D media accelerator featuring two 5nm, ASIC-based video processing units (VPUs) supporting the AV1 compression standard and purpose-built to power a new era of live interactive streaming services at scale.
  
  
• SEMIFIVE Achieves Mass Production Milestone of its SoC Platform (Tuesday Apr. 04, 2023)
  SEMIFIVE, a leading design solution provider and pioneer of platform-based custom silicon solutions, announced it has begun mass production of its first SoC Platform-based AI chip product built on Samsung Foundry’s matured 14nm FinFET technology.
  
  
• XMOS announces xcore®-voice: the next generation intelligent solution for smart voice applications (Monday Apr. 03, 2023)
  AI processing specialist XMOS today announces xcore-voice: a complete voice solution built on xcore platform hardware, software and tools. The solution provides voice pipeline example designs using XMOS industry-proven audio front-end, incorporating far-field processing and support for third party ISV voice algorithms.
  
  
• POLYN Introduces VibroSense, Industry-First Application-Specific Vibration Pre-Processing Chip Design (Thursday Mar. 30, 2023)
  POLYN Technology today introduced VibroSense, a Tiny AI chip solution for vibration monitoring sensor nodes. VibroSense greatly reduces the amount of sensor data transmitted to the cloud, saving on power consumption and enabling energy-harvesting designs.
  
  
• Renesas Expands RISC-V Embedded Processing Portfolio with New Voice-Control ASSP Solution (Thursday Mar. 30, 2023)
  The new R9A06G150 32-bit ASSP, developed in collaboration with RISC-V ecosystem partners, provides a complete, cost-effective, production-ready voice-control system solution that eliminates the need for RISC-V tools and upfront software investment.
  
  
• Telechips showcases Arm-based Dolphin5 automotive SoC at embedded world 2023 (Wednesday Mar. 15, 2023)
  Using the Arm Mali™-G78AE graphics processor with functional safety capabilities along with the Arm Cortex®-A76 processor and Arm Ethos™-N78 Neural Processing Unit (NPU), the Dolphin5 is a high-performance, low-power SoC primed to meet the increasing demands of infotainment and ADAS applications in modern vehicles.
  
  
• AmberSemi Announces Successful Tapeout of Silicon Chip for Patented AC Direct DC Power Delivery Technology (Friday Mar. 10, 2023)
  AmberSemi today announced that it completed the first silicon tapeout and entered the manufacturing and integration phase for one of its three core breakthrough, patented technologies – the AC Direct DC Enabler™, a silicon solution that extracts DC directly from AC Mains without the use of transformers, rectifier bridges, or filtering.
  
  
• Renesas to Demonstrate First AI Implementations on the Arm Cortex-M85 Processor Featuring Helium Technology at Embedded World (Thursday Mar. 09, 2023)
  Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced that it will present the first live demonstrations of artificial intelligence (AI) and machine learning (ML) implementations on an MCU based on the Arm® Cortex®-M85 processor.
  
  
• Arctic Semiconductor Ships Its First 5G RF Chipset, IceWings, for the 5G Market (Monday Feb. 20, 2023)
  Arctic Semiconductor, a leader in low-power universal RF chipsets, today announced it has rebranded from SiTune Corporation to Arctic Semiconductor, to emphasize its focus on 5G RF products.