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Fabless / IDM News

• POLYN Introduces VibroSense, Industry-First Application-Specific Vibration Pre-Processing Chip Design (Thursday Mar. 30, 2023)
  POLYN Technology today introduced VibroSense, a Tiny AI chip solution for vibration monitoring sensor nodes. VibroSense greatly reduces the amount of sensor data transmitted to the cloud, saving on power consumption and enabling energy-harvesting designs.
  
  
• Renesas Expands RISC-V Embedded Processing Portfolio with New Voice-Control ASSP Solution (Thursday Mar. 30, 2023)
  The new R9A06G150 32-bit ASSP, developed in collaboration with RISC-V ecosystem partners, provides a complete, cost-effective, production-ready voice-control system solution that eliminates the need for RISC-V tools and upfront software investment.
  
  
• Telechips showcases Arm-based Dolphin5 automotive SoC at embedded world 2023 (Wednesday Mar. 15, 2023)
  Using the Arm Mali™-G78AE graphics processor with functional safety capabilities along with the Arm Cortex®-A76 processor and Arm Ethos™-N78 Neural Processing Unit (NPU), the Dolphin5 is a high-performance, low-power SoC primed to meet the increasing demands of infotainment and ADAS applications in modern vehicles.
  
  
• AmberSemi Announces Successful Tapeout of Silicon Chip for Patented AC Direct DC Power Delivery Technology (Friday Mar. 10, 2023)
  AmberSemi today announced that it completed the first silicon tapeout and entered the manufacturing and integration phase for one of its three core breakthrough, patented technologies – the AC Direct DC Enabler™, a silicon solution that extracts DC directly from AC Mains without the use of transformers, rectifier bridges, or filtering.
  
  
• Renesas to Demonstrate First AI Implementations on the Arm Cortex-M85 Processor Featuring Helium Technology at Embedded World (Thursday Mar. 09, 2023)
  Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced that it will present the first live demonstrations of artificial intelligence (AI) and machine learning (ML) implementations on an MCU based on the Arm® Cortex®-M85 processor.
  
  
• Arctic Semiconductor Ships Its First 5G RF Chipset, IceWings, for the 5G Market (Monday Feb. 20, 2023)
  Arctic Semiconductor, a leader in low-power universal RF chipsets, today announced it has rebranded from SiTune Corporation to Arctic Semiconductor, to emphasize its focus on 5G RF products.
  
  
• Tachyum Validates Prodigy Universal Processor with Kubernetes for High-Performance, High-Density Computing for Containers (Thursday Feb. 16, 2023)
  Tachyum™ today announced it has completed testing and validation of its Prodigy Universal Processor with Kubernetes for hyperscale, high-performance container management. The success of Kubernetes on Prodigy assures Tachyum customers and partners of quick, easy, out-of-the-box testing and evaluation in containerized environments.
  
  
• Rambus Delivers 6400 MT/s DDR5 Registering Clock Driver to Advance Server Memory Performance (Thursday Feb. 02, 2023)
  Rambus today announced the availability of its new 6400 MT/s DDR5 Registering Clock Driver (RCD) and sampling to the major DDR5 memory module (RDIMM) manufacturers.
  
  
• Tachyum Successfully Runs UEFI on Prodigy FPGA (Tuesday Jan. 31, 2023)
  Tachyum™ today announced that it has successfully demonstrated Unified Extensible Firmware Interface (UEFI) running on the Prodigy Field-Programmable Gate Array (FPGA) hardware emulation system, representing a critical piece of the company’s test strategy and ensuring that Tachyum’s Prodigy hardware is maturing on pace for production later this year.
  
  
• RISC-V SBC VisionFive 2 Officially Shipped (Tuesday Jan. 10, 2023)
  Recently, StarFive Technology has completed production and testing of the first batch of VisionFive 2 SBCs, which has started shipment and will be delivered to customers in succession.
  
  
• Tachyum Closes DDR5 Timing at over 6400MT/s Providing Massive Bandwidth for Prodigy Chip (Tuesday Jan. 10, 2023)
  Tachyum™ today announced that the IP components –DDR5 RAM controller and high-performance, low-power DSP-based PHY – incorporated into the Prodigy Universal Processor have allowed it to achieve speeds of 6400 MT/s at nominal voltage for Prodigy chip which provides headroom for expected speeds of up to or even over 7200 MT/s.
  
  
• Syntiant Unveils NDP115 Neural Decision Processor at CES 2023 (Thursday Jan. 05, 2023)
  Syntiant Corp., a provider of deep learning solutions for edge AI applications, today introduced the Syntiant NDP115 Neural Decision Processor™, the newest addition to its family of special purpose silicon, built using the company’s Syntiant Core 2™ inference engine than can run multiple neural network loads at under 1mW.
  
  
• SpacemiT makes important breakthroughs in RISC-V High-Performance Cores (Thursday Jan. 05, 2023)
  We’re excited to share some recent progress in the development of our first-generation RISC-V fusion computing processor core – the X100. X100 has already made significant leaps with its general-purpose computing and application-oriented fusion computing capabilities.
  
  
• Axelera AI Announces Metis AI Platform (Thursday Dec. 22, 2022)
  European artificial intelligence (AI) startup Axelera AI announced today its Metis AI Platform, encompassing the Metis AI Processing Unit (AIPU) chip and the Voyager SDK software stack – available as cards, boards, and vision systems – to accelerate computer vision processing at the edge.
  
  
• Ventana Introduces Veyron, World's First Data Center Class RISC-V CPU Product Family (Thursday Dec. 15, 2022)
  Ventana Micro Systems Inc. today announced its Veyron family of high performance RISC-V processors. The Veyron V1 is the first member of the family, and the highest performance RISC-V processor available today.
  
  
• Siquance: an avant-garde startup dedicated to quantum calculations (Thursday Dec. 08, 2022)
  As a fabless startup, Siquance aims to become a global leader in quantum technology by developing a quantum computer that is based on the same technological building blocks as standard silicon integrated circuits. To enable this revolution, a disruptive technology solution was essential to transform a classical transistor so that it could handle quantum bits known as qubits (the quantum equivalent of classical bits).
  
  
• Innovative ASIC CPU Drives Record-Setting Server Performance (Monday Dec. 05, 2022)
  In a paper presented at the TSMC North America Open Innovation Platform Forum, Alchip Technologies and Synopsys showed how collaborative design expertise, EDA tools, and high-quality IP had created a record-setting, high-performance artificial intelligence enabled data center system-on-a chip (SoC).
  
  
• Tachyum Successfully Runs LINPACK on FPGA With IEEE 754-2019 Compliant FPU (Tuesday Nov. 29, 2022)
  Tachyum™ continues to advance towards production-ready status of its universal processor after reaching its latest milestone of running LINPACK benchmarks using Prodigy’s Floating-Point Unit (FPU) on a Field Programmable Gate Array (FPGA). This was achieved by running applications under Linux on the integer part of the processor and uses IEEE compliant Floating-Point Unit (FPU) to analyze and solve linear equations and linear least-square problems.
  
  
• Cortus announces the launch of LOTUS family with two new RISC-V microcontrollers (MCUs) (Monday Nov. 28, 2022)
  Cortus, an innovative French fabless semiconductor manufacturing group today announces two new RISC-V microcontrollers (MCUs). They are designed for ease of use, and to simplify migration from existing MCUs with maximal software reuse to minimize development cost.
  
  
• EASii IC announces first silicon for its DVB-S2X satellite Modem ASIC (Tuesday Nov. 15, 2022)
  EASii IC announces its satellite modem ASIC, EZID211 also known as Oxford-2. The Oxford-2 is compliant with the DVB-S2 standard ETSI EN 302 307-2 and implements the latest S2X, adaptive coding and modulation (ACM), Very Low Signal to Noise Ratio (VLSNR) and super frame functionality.
  
  
• Marvell Announces Innovative CXL Development Platform for Multi-Host Memory Pooling (Monday Nov. 14, 2022)
  Marvell Technology today announced a Compute Express Link™ Development Platform for cloud data center operators and server OEMs
  
  
• Weebit Nano receives from SkyWater Technology the first silicon wafers it manufactured with embedded Weebit ReRAM (Tuesday Nov. 08, 2022)
  Weebit Nano Limited (ASX:WBT), a leading developer of next-generation memory technologies for the global semiconductor industry, and SkyWater Technology (NASDAQ: SKYT), the trusted technology realisation partner, announce the first silicon wafers integrating Weebit’s embedded Resistive Random-Access Memory (ReRAM) module have been delivered to Weebit from SkyWater’s U.S. production fab.
  
  
• POLYN Technology, Edge Impulse Join Forces to Advance Tiny AI Products (Tuesday Nov. 08, 2022)
  POLYN Technology, a fabless semiconductor company providing Neuromorphic Analog Signal Processing (NASP) Tiny AI chips, and Edge Impulse, the leading embedded machine-learning (ML) development platform, have partnered to address ultra-low-power on-sensor solutions for wearables, hearables, and Industrial Internet of Things (IIoT).
  
  
• Marvell Announces Industry's Most Comprehensive 3nm Data Infrastructure IP Portfolio (Thursday Oct. 20, 2022)
  The new 3nm Marvell silicon, which is now in fabrication with Taiwan Semiconductor Manufacturing Company (TSMC) on its 3nm shuttle, is available for new product designs and includes foundational IP building blocks such as long reach SerDes, PCIe Gen6 PHY, and several standards-based die-to-die interconnect technologies for managing data flow across the data infrastructure.
  
  
• POLYN Introduces Voice Processing Tiny AI Chip Delivering Industry-First Voice Extraction (Tuesday Oct. 11, 2022)
  POLYN Technology, the innovative provider of unique NASP technology and a producer of Tiny AI chips and their associated IP, today announced the availability of NeuroVoice, a solution for on-chip voice extraction from any noisy background.
  
  
• Credo Introduces Screaming Eagle 112G Retimer DSP with Industry Leading 1.6 Terabit Capacity (Wednesday Oct. 05, 2022)
  Credo (NASDAQ: CRDO) today announced the Screaming Eagle 112G LR (Long Reach) DSP device with 1.6 Terabits per second (Tbps) of retiming capacity. By supporting port speeds of 1.6T, 800G, 400G, 100G and down to 10G – Screaming Eagle can satisfy the massive data transit requirements of hyperscalers, enterprises, 5G carriers and service provider customers.
  
  
• Renesas Expands RZ/V Series with Built-in Vision AI Accelerator for Accurate Image Recognition and Multi-Camera Image Support (Thursday Sep. 29, 2022)
  Equipped with two 64-bit Arm® Cortex®-A53 cores, the new device is capable of delivering high computing performance with a maximum operating frequency of 1GHz. The RZ/V2MA features a proprietary low power DRP-AI (Dynamically Reconfigurable Processor) accelerator which can process vision AI at 1 TOPS/W (tera operations per second, per watt) class performance.
  
  
• Inuitive launches NU4100, expanding its Edge-AI Vision-on-Chip IC portfolio (Thursday Sep. 22, 2022)
  Based on Inuitive’s unique architecture and advanced 12nm process technology, the new NU4100 IC supports integrated dual-channel 4K ISP, enhanced AI processing, and depth sensing in a single-chip, low-power design, setting the new industry standard for Edge-AI performance.
  
  
• IntelliProp First to Market with Memory Fabric Based on CXL; Driving Most Disruptive Technology to Hit Data Centers in Decades (Wednesday Sep. 21, 2022)
  IntelliProp, a leading innovator of composable data center transformation technology, today announced its intent to deliver its disruptive Omega Memory Fabric chips. The chips incorporate the Compute Express Link™ (CXL) Standard, along with IntelliProp’s innovative Fabric Management Software and Network Attached Memory (NAM) system.
  
  
• Ubilite Introduces a Wi-Fi Chip With Less-Than-Bluetooth Power Consumption (Thursday Sep. 15, 2022)
  Ubilite Inc. (“Ubilite”) today announced the immediate availability of its UBI206 platform based on the UBI206 SoC, targeted specifically for ultra-low power wireless applications. The UBI206 is a highly integrated single device that enables a vast number of IoT products with a minimal number of external components.