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Fabless / IDM News

• Rambus Expands Portfolio of DDR5 Memory Interface Chips for Data Centers and PCs (Tuesday Jul. 19, 2022)
  Rambus today announced the expansion of its DDR5 memory interface chip portfolio with the addition of the Rambus SPD (Serial Presence Detect) Hub and Temperature Sensor, complementing the industry-leading Rambus Registering Clock Driver (RCD).
  
  
• Socionext Introduces ISO26262 Certified Smart Graphic Display Controllers (Monday Jul. 18, 2022)
  Socionext, a global leader in the design and development of innovative System-on-Chip products, has announced a new series of smart display controllers, 'SC1721/ SC1722/ SC1723 Series', certified with ISO26262 for functional safety. Samples will be available at the end of July 2022.
  
  
• EnSilica chassis control ASIC for premium automotive brand enters mass production (Wednesday Jun. 29, 2022)
  EnSilica (LON: ENSI), a leading chip maker of mixed signal ASICs (Application Specific Integrated Circuits), has announced the development of a custom chassis-control ASIC, which has entered mass production, and will appear in vehicles later this year.
  
  
• Weebit Nano tapes out ReRAM demo chip to SkyWater foundry (Wednesday Jun. 29, 2022)
  Weebit Nano Limited is pleased to announce it has taped-out (released to manufacturing) demonstration chips integrating its embedded Resistive Random-Access Memory (ReRAM) module to SkyWater Technology’s foundry.
  
  
• Renesas Develops Circuit Technologies for 22-nm Embedded STT-MRAM with Faster Read and Write Performance for MCUs in IoT Applications (Thursday Jun. 16, 2022)
  Renesas Electronics today announced that it has developed circuit technologies for an embedded spin-transfer torque magnetoresistive random-access memory (STT-MRAM, hereinafter MRAM) test chip with fast read and write operations fabricated using a 22-nm process.
  
  
• CAES announces Space Grade Qualification of Quad Core LEON4FT Microprocessor (Friday Jun. 10, 2022)
  CAES has announced that its Fault Tolerant GR740 quad core LEON 4FT processor device successfully completed Defense Logistics Agency (DLA) qualification and can continue to meet some of the most demanding processing challenges of future space missions, with the added assurance of QML pedigree.
  
  
• CEVA Expands Sensor Fusion Product Line with New Sensor Hub MCU for High Precision Motion Tracking and Orientation Detection (Thursday Jun. 09, 2022)
  CEV today announced that it has expanded its family of sensor fusion products with the introduction of the FSP201, a high-performance and low-power sensor hub MCU that delivers precise, accurate sensor fusion for motion tracking, heading and orientation detection.
  
  
• First RISC-V-Based System-on-Chip (SoC) FPGA Enters Mass Production (Thursday Jun. 09, 2022)
  As customers continue to adopt PolarFire® SoC FPGAs at a rapid pace, Microchip Technology Inc. (Nasdaq: MCHP) announces the production qualification for the MPFS250T and the previously announced MPFS025T. Microchip also announces that its Mi-V ecosystem continues to streamline RISC-V adoption while enabling a new class of smaller, more power-efficient and less-costly industrial, IoT and other edge-compute products.
  
  
• AP Memory launches brand-new product series of 512Mb Ultra-High-Speed (UHS) and 32Mb Ultra-Low-Swing (ULS) PSRAM (Monday Jun. 06, 2022)
  AP Memory, the global leading design company that provides customized memory solution, has announced today the launch of its new Ultra High Speed (UHS) and Ultra Low Swing (ULS) PSRAM.
  
  
• NEUCHIPS' Purpose-Built Accelerator Designed to Be Industry's Most Efficient Recommendation Inference Engine (Thursday Jun. 02, 2022)
  NEUCHIPS is excited to announce its first ASIC, RecAccelTM N3000 using TSMC 7nm process, and specifically designed for accelerating deep learning recommendation models (DLRM).
  
  
• Renesas Will Demonstrate the First Working Silicon Based on the Recently Debuted Arm Cortex-M85 Processor (Tuesday May. 24, 2022)
  Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced that it will present the first live demonstration of a microcontroller (MCU) based on the recently announced Arm® Cortex®-M85 processor.
  
  
• MediaTek Launches First mmWave Chipset for Seamless 5G Smartphone Connectivity (Monday May. 23, 2022)
  MediaTek today announced the Dimensity 1050 system-on-chip [SoC], its first mmWave 5G chipset that will power the next generation of 5G smartphones with seamless connectivity, displays, gaming and power efficiency.
  
  
• Flex Logix Partners With Roboflow to Enable Specialized AI Models For Computer Vision Applications (Tuesday May. 17, 2022)
  Flex Logix® Technologies today announced that it has partnered with Roboflow, an end-to-end computer vision solution for developers, to produce edge AI vision models built for the Flex Logix InferX™ platform for a wide variety of applications.
  
  
• OMNIVISION and Valens Semiconductor Partner to Offer Automotive OEMs a MIPI A-PHY-Compliant Camera Solution for Advanced Driver-Assistance Systems Applications (Monday May. 09, 2022)
  OMNIVISION and Valens Semiconductor have partnered to bring to market a MIPI A-PHY-compliant camera solution for the automotive industry.
  
  
• Tachyum Integrates IP From World's Leading Vendors for Tape-Out In 2022 (Thursday May. 05, 2022)
  Tachyum™ today announced new IP suppliers who have provided the company with critical IP components needed to bring Prodigy™ to commercial markets in 2022. They include Alphawave and Rambus IP.
  
  
• Edgecortix Announces Sakura AI Co-processor Delivering Industry Leading Low-Latency and Energy-Efficiency (Monday Apr. 25, 2022)
  EdgeCortix unveiled the architecture, performance metrics and delivery timing for its new industry leading, energy-efficient, AI inference co-processor.
  
  
• Esperanto Technologies' Massively Parallel RISC-V AI Inferencing Solution Now in Initial Evaluations (Thursday Apr. 21, 2022)
  Esperanto Technologies™, the leading developer of high performance, energy-efficient artificial intelligence (AI) inference accelerators based on the RISC-V instruction set, today announced that initial evaluations for its ET-SoC-1 AI inference accelerator are underway with lead customers.
  
  
• POLYN Technology Delivers NASP Test Chip for Tiny AI (Wednesday Apr. 13, 2022)
  POLYN Technology announced today that its first Neuromorphic Analog Signal Processor (NASP) chip is packaged and evaluated, demonstrating proof of the technology’s brain-mimicking architecture. It is the first Tiny AI true analog design to be used next to sensors.
  
  
• Weebit Nano demo chips integrating its embedded ReRAM module successfully complete functional testing phase (Thursday Apr. 07, 2022)
  Weebit Nano Limited confirms demonstration (demo) chips integrating its embedded Resistive Random-Access Memory (ReRAM) module have successfully completed their functional testing phase, a key step towards delivering a commercial product.
  
  
• CAES Introduces Family of Radiation Hardened NOR Flash Memories for Space FPGAs (Monday Mar. 21, 2022)
  CAES, a leading provider of mission critical electronics for aerospace and defense, today introduced a line of RadHard NOR Flash Memory devices that uniquely deliver the boot-memory densities required by microprocessors and FPGAs used in space applications.
  
  
• QuantWare releases 25-qubit Contralto QPU (Thursday Mar. 10, 2022)
  Quantum computing startup QuantWare has launched a new QPU (quantum processing unit) that allows any business or organisation to catch up with the state of the art in this rapidly developing field of technology.
  
  
• Credo Expands High Performance Seagull Family With Integrated 50Gbps PAM4 VCSEL and EML Drivers (Friday Mar. 04, 2022)
  These products are based on Credo’s proven, first-generation Seagull platform, with the addition of integrated VCSEL and EML drivers. The new products include the single channel Seagull 51, dual channel Seagull 111, and quad channel Seagull 201 PAM4 DSPs.
  
  
• Renesas Pioneers RISC-V Technology With RZ/Five General-Purpose MPUs Based on 64-Bit RISC-V CPU Core (Tuesday Mar. 01, 2022)
  Renesas Electronics today announced the RZ/Five general-purpose microprocessor units (MPUs) built around a 64-bit RISC-V CPU core. The RZ/Five employs the Andes AX45MP, based on the RISC-V CPU instruction set architecture (ISA).
  
  
• Renesas Develops Bluetooth Low Energy RF Transceiver Technologies that Simplify Board Design, Reduce Circuit Size and Increase Power Efficiency (Thursday Feb. 24, 2022)
  Renesas Electronics, a premier supplier of advanced semiconductor solutions, today announced the development of two 2.4 GHz RF transceiver technologies that support the Bluetooth® Low Energy (LE) low-power, near-field communication standard.
  
  
• Imec, KU Leuven and PragmatIC Semiconductor demonstrate fastest 8-bit flexible microprocessor for low-power applications (Tuesday Feb. 22, 2022)
  Imec, KU Leuven, and PragmatIC Semiconductor present the fastest 8-bit microprocessor in 0.8µm metal-oxide flexible technology capable of running real-time complex assembly code at the 2022 International Solid-State Circuits Conference.
  
  
• Orca Systems Announces World's First Fully Integrated SoC Solution for Direct-to-Satellite IoT Connectivity (Thursday Feb. 17, 2022)
  Orca Systems, a fabless semiconductor company delivering groundbreaking digital RF technology, today announced its first wireless system-on-chip (SoC) solution for the satellite Internet of Things (IoT).
  
  
• AlphaICs Begins Global Sampling of "Gluon - Deep Learning Co-Processor" (Monday Feb. 14, 2022)
  AlphaICs, a leading AI fabless semiconductor company that develops edge inference and edge learning technologies, has announced the availability of engineering samples of ‘Gluon’ – an 8 TOPS Edge AI inference co-processor to customers in surveillance, industrial, retail, auto, and Industrial IoT verticals which carries best-in-class FPS/Watt performance.
  
  
• Synaptics Launches Industry's First Matter-Compliant Triple Combo SoC with Integrated Wi-Fi 6/6E, Bluetooth 5.2, and 802.15.4/Thread for Seamless IoT Connectivity (Thursday Feb. 03, 2022)
  Synaptics® Incorporated (Nasdaq: SYNA) today announced the SYN4381 Triple Combo system on chip (SoC), the first to combine Wi-Fi 6/6E (802.11ax with extended 6 GHz operation), Bluetooth® 5.2 (BT 5.2) with BLE Audio and High Accuracy Distance Measurement (HADM), and IEEE 802.15.4 with built-in support for the Thread protocol and Matter application layer.
  
  
• MediaTek Shows The World's First Live Demos of Wi-Fi 7 Technology to Customers and Industry Leaders (Wednesday Jan. 19, 2022)
  MediaTek today announced the world’s first live demo of Wi-Fi 7 technology, highlighting the capabilities of its forthcoming Wi-Fi 7 Filogic connectivity portfolio. MediaTek is currently showcasing two Wi-Fi 7 demos to key customers and industry collaborators to demonstrate the technology’s super-fast speeds and low latency transmission.
  
  
• BrainChip Achieves Full Commercialization of its AKD1000 AIoT Chip with availability of Mini PCIe Boards in high volume (Tuesday Jan. 18, 2022)
  BrainChip today announced that it has begun taking orders for the first commercially available Mini PCIe board leveraging its Akida™ advanced neural networking processor, rounding out its suite of AKD1000 offerings.