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Fabless / IDM News

• Credo Targets Hyperscale Data Centers and 5G Networks with New Optical DSPs (Wednesday Sep. 14, 2022)
  Credo Technology Group Holding Ltd (NASDAQ: CRDO) today introduced two high-performance, low-power optical DSPs ICs; the single channel Seagull 52 and the quad channel Seagull 202.
  
  
• Hisense Selects Synaptics' DBM10L Processor For First AI-Enabled Always-On Voice Remote Control (Monday Sep. 12, 2022)
  Synaptics® Incorporated today announced that Hisense, a global leader in consumer electronics and home appliances, selected the DBM10L with its dedicated neural processing unit (NPU) to implement the first artificial intelligence (AI)-enabled always-on voice (AOV) remote control unit (RCU), the EFR3B86H.
  
  
• Renesas Extends Leading RISC-V Embedded Processing Portfolio with New Motor Control ASSP Solution (Thursday Sep. 08, 2022)
  Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today introduced the industry’s first RISC-V MCU specifically optimized for advanced motor control systems.
  
  
• SiMa.ai Develops the Industry's First Purpose-Built Machine Learning System-on-Chip with TSMC's Power Efficient Technology (Tuesday Aug. 30, 2022)
  SiMa.ai, the machine learning company enabling effortless deployment and scaling at the embedded edge, today announced it has delivered a software-centric MLSoC Platform that enables quick and Effortless ML experiences for the embedded edge, benefiting from TSMC’s power efficient process technology and most comprehensive design ecosystem.
  
  
• Credo Introduces 800Gbps and 400Gbps Optical Digital Signal Processors with Integrated Drivers (Monday Aug. 29, 2022)
  Credo Technology Group Holding Ltd (NASDAQ: CRDO) today introduced its new Dove 800 Digital Signal Processor family of products. The products are targeted at rapidly growing Hyperscale Data Center and AI applications and enable customers to meet increasingly stringent power and bandwidth requirements.
  
  
• Untether Unveils 2-PFLOPS AI Chip, Edge Roadmap (Thursday Aug. 25, 2022)
  At Hot Chips this week, Untether unveiled its second-gen architecture for AI inference, the first chip using this architecture, as well as plans to expand to edge and endpoint accelerators.
  
  
• Nordic Semiconductor announces its first Wi-Fi chip, the dual-band Wi-Fi 6 nRF7002 (Tuesday Aug. 16, 2022)
  Nordic Semiconductor today announces its entry into the Wi-Fi® wireless IoT market with the introduction of the nRF7002, an ultra-low power, dual-band Wi-Fi 6 companion IC.
  
  
• Rambus Expands Portfolio of DDR5 Memory Interface Chips for Data Centers and PCs (Tuesday Jul. 19, 2022)
  Rambus today announced the expansion of its DDR5 memory interface chip portfolio with the addition of the Rambus SPD (Serial Presence Detect) Hub and Temperature Sensor, complementing the industry-leading Rambus Registering Clock Driver (RCD).
  
  
• Socionext Introduces ISO26262 Certified Smart Graphic Display Controllers (Monday Jul. 18, 2022)
  Socionext, a global leader in the design and development of innovative System-on-Chip products, has announced a new series of smart display controllers, 'SC1721/ SC1722/ SC1723 Series', certified with ISO26262 for functional safety. Samples will be available at the end of July 2022.
  
  
• EnSilica chassis control ASIC for premium automotive brand enters mass production (Wednesday Jun. 29, 2022)
  EnSilica (LON: ENSI), a leading chip maker of mixed signal ASICs (Application Specific Integrated Circuits), has announced the development of a custom chassis-control ASIC, which has entered mass production, and will appear in vehicles later this year.
  
  
• Weebit Nano tapes out ReRAM demo chip to SkyWater foundry (Wednesday Jun. 29, 2022)
  Weebit Nano Limited is pleased to announce it has taped-out (released to manufacturing) demonstration chips integrating its embedded Resistive Random-Access Memory (ReRAM) module to SkyWater Technology’s foundry.
  
  
• Renesas Develops Circuit Technologies for 22-nm Embedded STT-MRAM with Faster Read and Write Performance for MCUs in IoT Applications (Thursday Jun. 16, 2022)
  Renesas Electronics today announced that it has developed circuit technologies for an embedded spin-transfer torque magnetoresistive random-access memory (STT-MRAM, hereinafter MRAM) test chip with fast read and write operations fabricated using a 22-nm process.
  
  
• CAES announces Space Grade Qualification of Quad Core LEON4FT Microprocessor (Friday Jun. 10, 2022)
  CAES has announced that its Fault Tolerant GR740 quad core LEON 4FT processor device successfully completed Defense Logistics Agency (DLA) qualification and can continue to meet some of the most demanding processing challenges of future space missions, with the added assurance of QML pedigree.
  
  
• CEVA Expands Sensor Fusion Product Line with New Sensor Hub MCU for High Precision Motion Tracking and Orientation Detection (Thursday Jun. 09, 2022)
  CEV today announced that it has expanded its family of sensor fusion products with the introduction of the FSP201, a high-performance and low-power sensor hub MCU that delivers precise, accurate sensor fusion for motion tracking, heading and orientation detection.
  
  
• First RISC-V-Based System-on-Chip (SoC) FPGA Enters Mass Production (Thursday Jun. 09, 2022)
  As customers continue to adopt PolarFire® SoC FPGAs at a rapid pace, Microchip Technology Inc. (Nasdaq: MCHP) announces the production qualification for the MPFS250T and the previously announced MPFS025T. Microchip also announces that its Mi-V ecosystem continues to streamline RISC-V adoption while enabling a new class of smaller, more power-efficient and less-costly industrial, IoT and other edge-compute products.
  
  
• AP Memory launches brand-new product series of 512Mb Ultra-High-Speed (UHS) and 32Mb Ultra-Low-Swing (ULS) PSRAM (Monday Jun. 06, 2022)
  AP Memory, the global leading design company that provides customized memory solution, has announced today the launch of its new Ultra High Speed (UHS) and Ultra Low Swing (ULS) PSRAM.
  
  
• NEUCHIPS' Purpose-Built Accelerator Designed to Be Industry's Most Efficient Recommendation Inference Engine (Thursday Jun. 02, 2022)
  NEUCHIPS is excited to announce its first ASIC, RecAccelTM N3000 using TSMC 7nm process, and specifically designed for accelerating deep learning recommendation models (DLRM).
  
  
• Renesas Will Demonstrate the First Working Silicon Based on the Recently Debuted Arm Cortex-M85 Processor (Tuesday May. 24, 2022)
  Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced that it will present the first live demonstration of a microcontroller (MCU) based on the recently announced Arm® Cortex®-M85 processor.
  
  
• MediaTek Launches First mmWave Chipset for Seamless 5G Smartphone Connectivity (Monday May. 23, 2022)
  MediaTek today announced the Dimensity 1050 system-on-chip [SoC], its first mmWave 5G chipset that will power the next generation of 5G smartphones with seamless connectivity, displays, gaming and power efficiency.
  
  
• Flex Logix Partners With Roboflow to Enable Specialized AI Models For Computer Vision Applications (Tuesday May. 17, 2022)
  Flex Logix® Technologies today announced that it has partnered with Roboflow, an end-to-end computer vision solution for developers, to produce edge AI vision models built for the Flex Logix InferX™ platform for a wide variety of applications.
  
  
• OMNIVISION and Valens Semiconductor Partner to Offer Automotive OEMs a MIPI A-PHY-Compliant Camera Solution for Advanced Driver-Assistance Systems Applications (Monday May. 09, 2022)
  OMNIVISION and Valens Semiconductor have partnered to bring to market a MIPI A-PHY-compliant camera solution for the automotive industry.
  
  
• Tachyum Integrates IP From World's Leading Vendors for Tape-Out In 2022 (Thursday May. 05, 2022)
  Tachyum™ today announced new IP suppliers who have provided the company with critical IP components needed to bring Prodigy™ to commercial markets in 2022. They include Alphawave and Rambus IP.
  
  
• Edgecortix Announces Sakura AI Co-processor Delivering Industry Leading Low-Latency and Energy-Efficiency (Monday Apr. 25, 2022)
  EdgeCortix unveiled the architecture, performance metrics and delivery timing for its new industry leading, energy-efficient, AI inference co-processor.
  
  
• Esperanto Technologies' Massively Parallel RISC-V AI Inferencing Solution Now in Initial Evaluations (Thursday Apr. 21, 2022)
  Esperanto Technologies™, the leading developer of high performance, energy-efficient artificial intelligence (AI) inference accelerators based on the RISC-V instruction set, today announced that initial evaluations for its ET-SoC-1 AI inference accelerator are underway with lead customers.
  
  
• POLYN Technology Delivers NASP Test Chip for Tiny AI (Wednesday Apr. 13, 2022)
  POLYN Technology announced today that its first Neuromorphic Analog Signal Processor (NASP) chip is packaged and evaluated, demonstrating proof of the technology’s brain-mimicking architecture. It is the first Tiny AI true analog design to be used next to sensors.
  
  
• Weebit Nano demo chips integrating its embedded ReRAM module successfully complete functional testing phase (Thursday Apr. 07, 2022)
  Weebit Nano Limited confirms demonstration (demo) chips integrating its embedded Resistive Random-Access Memory (ReRAM) module have successfully completed their functional testing phase, a key step towards delivering a commercial product.
  
  
• CAES Introduces Family of Radiation Hardened NOR Flash Memories for Space FPGAs (Monday Mar. 21, 2022)
  CAES, a leading provider of mission critical electronics for aerospace and defense, today introduced a line of RadHard NOR Flash Memory devices that uniquely deliver the boot-memory densities required by microprocessors and FPGAs used in space applications.
  
  
• QuantWare releases 25-qubit Contralto QPU (Thursday Mar. 10, 2022)
  Quantum computing startup QuantWare has launched a new QPU (quantum processing unit) that allows any business or organisation to catch up with the state of the art in this rapidly developing field of technology.
  
  
• Credo Expands High Performance Seagull Family With Integrated 50Gbps PAM4 VCSEL and EML Drivers (Friday Mar. 04, 2022)
  These products are based on Credo’s proven, first-generation Seagull platform, with the addition of integrated VCSEL and EML drivers. The new products include the single channel Seagull 51, dual channel Seagull 111, and quad channel Seagull 201 PAM4 DSPs.
  
  
• Renesas Pioneers RISC-V Technology With RZ/Five General-Purpose MPUs Based on 64-Bit RISC-V CPU Core (Tuesday Mar. 01, 2022)
  Renesas Electronics today announced the RZ/Five general-purpose microprocessor units (MPUs) built around a 64-bit RISC-V CPU core. The RZ/Five employs the Andes AX45MP, based on the RISC-V CPU instruction set architecture (ISA).