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Fabless / IDM News

• Renesas Develops Bluetooth Low Energy RF Transceiver Technologies that Simplify Board Design, Reduce Circuit Size and Increase Power Efficiency (Thursday Feb. 24, 2022)
  Renesas Electronics, a premier supplier of advanced semiconductor solutions, today announced the development of two 2.4 GHz RF transceiver technologies that support the Bluetooth® Low Energy (LE) low-power, near-field communication standard.
  
  
• Imec, KU Leuven and PragmatIC Semiconductor demonstrate fastest 8-bit flexible microprocessor for low-power applications (Tuesday Feb. 22, 2022)
  Imec, KU Leuven, and PragmatIC Semiconductor present the fastest 8-bit microprocessor in 0.8µm metal-oxide flexible technology capable of running real-time complex assembly code at the 2022 International Solid-State Circuits Conference.
  
  
• Orca Systems Announces World's First Fully Integrated SoC Solution for Direct-to-Satellite IoT Connectivity (Thursday Feb. 17, 2022)
  Orca Systems, a fabless semiconductor company delivering groundbreaking digital RF technology, today announced its first wireless system-on-chip (SoC) solution for the satellite Internet of Things (IoT).
  
  
• AlphaICs Begins Global Sampling of "Gluon - Deep Learning Co-Processor" (Monday Feb. 14, 2022)
  AlphaICs, a leading AI fabless semiconductor company that develops edge inference and edge learning technologies, has announced the availability of engineering samples of ‘Gluon’ – an 8 TOPS Edge AI inference co-processor to customers in surveillance, industrial, retail, auto, and Industrial IoT verticals which carries best-in-class FPS/Watt performance.
  
  
• Synaptics Launches Industry's First Matter-Compliant Triple Combo SoC with Integrated Wi-Fi 6/6E, Bluetooth 5.2, and 802.15.4/Thread for Seamless IoT Connectivity (Thursday Feb. 03, 2022)
  Synaptics® Incorporated (Nasdaq: SYNA) today announced the SYN4381 Triple Combo system on chip (SoC), the first to combine Wi-Fi 6/6E (802.11ax with extended 6 GHz operation), Bluetooth® 5.2 (BT 5.2) with BLE Audio and High Accuracy Distance Measurement (HADM), and IEEE 802.15.4 with built-in support for the Thread protocol and Matter application layer.
  
  
• MediaTek Shows The World's First Live Demos of Wi-Fi 7 Technology to Customers and Industry Leaders (Wednesday Jan. 19, 2022)
  MediaTek today announced the world’s first live demo of Wi-Fi 7 technology, highlighting the capabilities of its forthcoming Wi-Fi 7 Filogic connectivity portfolio. MediaTek is currently showcasing two Wi-Fi 7 demos to key customers and industry collaborators to demonstrate the technology’s super-fast speeds and low latency transmission.
  
  
• BrainChip Achieves Full Commercialization of its AKD1000 AIoT Chip with availability of Mini PCIe Boards in high volume (Tuesday Jan. 18, 2022)
  BrainChip today announced that it has begun taking orders for the first commercially available Mini PCIe board leveraging its Akida™ advanced neural networking processor, rounding out its suite of AKD1000 offerings.
  
  
• VSORA Introduces Tyr Chip Family Enabling L2-L5 Autonomous Driving (Wednesday Jan. 12, 2022)
  VSORA today unveiled a family of PetaFLOPS computational companion chips to accelerate Level 3 (L3) through Level 5 (L5) autonomous vehicle designs.
  
  
• Syntiant Announces Voice-Enabled Ultra-Low-Power Reference Design for TWS Earbud Applications (Monday Jan. 10, 2022)
  Syntiant Corp., a provider of deep learning solutions making edge AI a reality for always-on applications, today announced a new reference design that will enable ODMs and OEMs to easily and quickly deploy ultra-low-power, edge AI voice processing applications in true wireless earbuds.
  
  
• Nestwave and Samea Unveil Ultra-Low-Power Super-Thin, Re-Usable GPS Tracker (Thursday Jan. 06, 2022)
  Nestwave, a global technology leader in low-power geolocation for the IoT, has worked with IoT connectivity specialist Samea Innovation to develop a super-thin, re-usable logistics tracker with multi-year battery life.
  
  
• Weebit Nano receives first silicon demonstration wafers integrating its embedded ReRAM module (Wednesday Dec. 22, 2021)
  Weebit Nano Limited (ASX:WBT; Weebit or the Company), a leading developer of next-generation memory technologies for the global semiconductor industry, is pleased to announce that it has received from manufacturing the first silicon wafers that integrate its embedded Resistive Random-Access Memory (ReRAM) module inside complete subsystem demonstration (demo) chips.
  
  
• Kandou Delivers USB-C Multiprotocol Retimer Product Family for USB4 Support (Tuesday Dec. 14, 2021)
  Kandou, an innovative leader in high-speed, energy-efficient chip-to-chip link solutions to improve the way the world connects and communicates, today announced volume production of its Matterhorn™ family of USB-C® multiprotocol retimer solutions with USB4™ support.
  
  
• SynSense and Prophesee partner to combine neuromorphic engineering expertise for developing one-chip event-based smart sensing solution for ultra-low power edge-AI (Thursday Nov. 25, 2021)
  SynSense and Prophesee, two leading neuromorphic technology companies, today announced a partnership that will see the two companies leverage their respective expertise in sensing and processing to develop ultra-low-power solutions for implementing intelligence on the edge for event-based vision applications.
  
  
• BrainChip Completes Testing Production Version of the Akida Chip (Tuesday Nov. 09, 2021)
  BrainChip today confirmed that functionality and performance testing of the AKD1000 production chips has been completed, which showed better performance than the original engineering samples.
  
  
• Morse Micro Unveils Wi-Fi CERTIFIED HaLow Platform and Industry's First 8MHz Reference Design (Tuesday Nov. 02, 2021)
  Morse Micro, a fabless semiconductor company reinventing Wi-Fi® for the Internet of Things (IoT), today announced one of the industry’s first Wi-Fi CERTIFIED™ HaLow™ solutions and industry’s first 8 MHz reference design, highlighting the company’s technology leadership.
  
  
• Achronix and MoSys Partner to Target 5G Wireless and Broadband Networking Acceleration (Wednesday Oct. 27, 2021)
  Achronix Semiconductor and MoSys today announced a collaboration to deliver a new class of high-speed, programmable, FPGA-based infrastructure solutions tailored for the 5G wireless core and edge, data center, and broadband wired networks.
  
  
• Alibaba Cloud Unveils New Server Chips to Optimize Cloud Computing Services (Tuesday Oct. 19, 2021)
  Alibaba Cloud, the digital technology and intelligence backbone of Alibaba Group, today unveiled a new in-house processor design for use in its data centers. The server chips, named Yitian 710, are custom-built by Alibaba Group's chip development business, T-Head.
  
  
• Rambus Advances Server Memory Performance with the Industry's First 5600 MT/s DDR5 Registering Clock Driver (Wednesday Oct. 13, 2021)
  Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced it is now sampling its 5600 MT/s 2nd-generation RCD chip to the major DDR5 memory module (RDIMM) suppliers.
  
  
• Syntiant Unveils NDP200 Neural Decision Processor for Always-On Vision Edge AI Applications (Thursday Sep. 23, 2021)
  Syntiant Corp., a provider of deep learning solutions making edge AI a reality for always-on applications in battery-powered devices, today introduced its Syntiant® NDP200 Neural Decision Processor™ (NDP), the company’s first chip designed for vision processing that can provide highly accurate inference at under 1mW.
  
  
• NEWRACOM Introduces First Wi-Fi HaLow Sensor Solution (Wednesday Sep. 22, 2021)
  NEWRACOM, a fabless semiconductor company and supplier of IoT-enabled Wi-Fi SoCs, today announced the world's first demonstration of Wi-Fi HaLow-enabled sensor networking
  
  
• Espressif Systems Announces an IEEE 802.15.4 + Bluetooth 5 (LE) RISC-V SoC (Thursday Aug. 26, 2021)
  Espressif Systems (Shanghai) Co., Ltd. (SSE: 688018.SH), announces today the upcoming release of ESP32-H2 with IEEE 802.15.4 and Bluetooth 5 (LE) connectivity, operable in the 2.4 GHz band.
  
  
• Esperanto Technologies Unveils Energy-Efficient RISC-V-Based Machine Learning Accelerator Chip (Wednesday Aug. 25, 2021)
  Featuring over a thousand RISC-V custom processor cores, Esperanto’s ML inference accelerator is designed to be the highest performance commercial RISC-V chip.
  
  
• PragmatIC Semiconductor re-invents the iconic processor that changed the world (Tuesday Aug. 24, 2021)
  PragmatIC Semiconductor, a world leader in flexible electronics, is proud to announce that it has manufactured a flexible version of the 6502 processor, the iconic design that kick-started the personal computer revolution.
  
  
• Samsung Introduces the Industry's First 5nm Processor Powering the Next Generation of Wearables (Tuesday Aug. 10, 2021)
  The Exynos W920 offers high performance, efficiency and LTE connectivity packed in the industry’s smallest form factor
  
  
• Winbond's Successful Interoperability of OctalNAND Flash with Synopsys DesignWare AMBA IP Delivers Complete High-Density NAND Flash Memory Solution (Thursday Jul. 22, 2021)
  Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the successful interoperability of Synopsys’ DesignWare Synchronous Serial Interface (SSI) IP and Winbond’s OctalNAND Flash Memory.
  
  
• Quantware Launches the World's First Commercially Available Superconducting Quantum Processors, Accelerating the Advent of the Quantum Computer. (Thursday Jul. 15, 2021)
  Today Dutch startup QuantWare has launched the world’s first commercially available superconducting processor for quantum computers (QPU).
  
  
• Xilinx Versal HBM Series with Integrated High Bandwidth Memory Tackles Big Data Compute Challenges in the Network and Cloud (Thursday Jul. 15, 2021)
  Latest in Versal ACAP series delivers unmatched convergence of fast memory, secure connectivity, and adaptable compute in a single platform for data center and network operators
  
  
• Marvell Extends OCTEON Leadership with Industry's First 5nm DPUs (Tuesday Jun. 29, 2021)
  Marvell (NASDAQ: MRVL) today introduced its new OCTEON® 10 DPU designed to accelerate and process a broad spectrum of security, networking, and storage workloads required by demanding 5G, cloud, carrier and enterprise datacenter applications.
  
  
• Mythic Expands Product Lineup with New Scalable, Power-Efficient Analog Matrix Processor for Edge AI Applications (Tuesday Jun. 08, 2021)
  Mythic, the pioneering analog AI processor company with breakthrough analog compute-in-memory technology, today introduced its new M1076 Analog Matrix Processor (Mythic AMP™) which delivers best-in-class performance, scalability, and power efficiency.
  
  
• Palma Ceia SemiDesign Announces New Wi-Fi HaLow Chips, PCS2100 and PCS2500 - Ideal for Industry 4.0 (Monday Jun. 07, 2021)
  Palma Ceia SemiDesign, a fabless semiconductor company specializing in wireless connectivity solutions, announced it has taped out two chips supporting the Wi-Fi HaLowTM connectivity protocol.