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Fabless / IDM News

• VSORA Introduces Tyr Chip Family Enabling L2-L5 Autonomous Driving (Wednesday Jan. 12, 2022)
  VSORA today unveiled a family of PetaFLOPS computational companion chips to accelerate Level 3 (L3) through Level 5 (L5) autonomous vehicle designs.
  
  
• Syntiant Announces Voice-Enabled Ultra-Low-Power Reference Design for TWS Earbud Applications (Monday Jan. 10, 2022)
  Syntiant Corp., a provider of deep learning solutions making edge AI a reality for always-on applications, today announced a new reference design that will enable ODMs and OEMs to easily and quickly deploy ultra-low-power, edge AI voice processing applications in true wireless earbuds.
  
  
• Nestwave and Samea Unveil Ultra-Low-Power Super-Thin, Re-Usable GPS Tracker (Thursday Jan. 06, 2022)
  Nestwave, a global technology leader in low-power geolocation for the IoT, has worked with IoT connectivity specialist Samea Innovation to develop a super-thin, re-usable logistics tracker with multi-year battery life.
  
  
• Weebit Nano receives first silicon demonstration wafers integrating its embedded ReRAM module (Wednesday Dec. 22, 2021)
  Weebit Nano Limited (ASX:WBT; Weebit or the Company), a leading developer of next-generation memory technologies for the global semiconductor industry, is pleased to announce that it has received from manufacturing the first silicon wafers that integrate its embedded Resistive Random-Access Memory (ReRAM) module inside complete subsystem demonstration (demo) chips.
  
  
• Kandou Delivers USB-C Multiprotocol Retimer Product Family for USB4 Support (Tuesday Dec. 14, 2021)
  Kandou, an innovative leader in high-speed, energy-efficient chip-to-chip link solutions to improve the way the world connects and communicates, today announced volume production of its Matterhorn™ family of USB-C® multiprotocol retimer solutions with USB4™ support.
  
  
• SynSense and Prophesee partner to combine neuromorphic engineering expertise for developing one-chip event-based smart sensing solution for ultra-low power edge-AI (Thursday Nov. 25, 2021)
  SynSense and Prophesee, two leading neuromorphic technology companies, today announced a partnership that will see the two companies leverage their respective expertise in sensing and processing to develop ultra-low-power solutions for implementing intelligence on the edge for event-based vision applications.
  
  
• BrainChip Completes Testing Production Version of the Akida Chip (Tuesday Nov. 09, 2021)
  BrainChip today confirmed that functionality and performance testing of the AKD1000 production chips has been completed, which showed better performance than the original engineering samples.
  
  
• Morse Micro Unveils Wi-Fi CERTIFIED HaLow Platform and Industry's First 8MHz Reference Design (Tuesday Nov. 02, 2021)
  Morse Micro, a fabless semiconductor company reinventing Wi-Fi® for the Internet of Things (IoT), today announced one of the industry’s first Wi-Fi CERTIFIED™ HaLow™ solutions and industry’s first 8 MHz reference design, highlighting the company’s technology leadership.
  
  
• Achronix and MoSys Partner to Target 5G Wireless and Broadband Networking Acceleration (Wednesday Oct. 27, 2021)
  Achronix Semiconductor and MoSys today announced a collaboration to deliver a new class of high-speed, programmable, FPGA-based infrastructure solutions tailored for the 5G wireless core and edge, data center, and broadband wired networks.
  
  
• Alibaba Cloud Unveils New Server Chips to Optimize Cloud Computing Services (Tuesday Oct. 19, 2021)
  Alibaba Cloud, the digital technology and intelligence backbone of Alibaba Group, today unveiled a new in-house processor design for use in its data centers. The server chips, named Yitian 710, are custom-built by Alibaba Group's chip development business, T-Head.
  
  
• Rambus Advances Server Memory Performance with the Industry's First 5600 MT/s DDR5 Registering Clock Driver (Wednesday Oct. 13, 2021)
  Rambus Inc. (NASDAQ: RMBS), a premier chip and silicon IP provider making data faster and safer, today announced it is now sampling its 5600 MT/s 2nd-generation RCD chip to the major DDR5 memory module (RDIMM) suppliers.
  
  
• Syntiant Unveils NDP200 Neural Decision Processor for Always-On Vision Edge AI Applications (Thursday Sep. 23, 2021)
  Syntiant Corp., a provider of deep learning solutions making edge AI a reality for always-on applications in battery-powered devices, today introduced its Syntiant® NDP200 Neural Decision Processor™ (NDP), the company’s first chip designed for vision processing that can provide highly accurate inference at under 1mW.
  
  
• NEWRACOM Introduces First Wi-Fi HaLow Sensor Solution (Wednesday Sep. 22, 2021)
  NEWRACOM, a fabless semiconductor company and supplier of IoT-enabled Wi-Fi SoCs, today announced the world's first demonstration of Wi-Fi HaLow-enabled sensor networking
  
  
• Espressif Systems Announces an IEEE 802.15.4 + Bluetooth 5 (LE) RISC-V SoC (Thursday Aug. 26, 2021)
  Espressif Systems (Shanghai) Co., Ltd. (SSE: 688018.SH), announces today the upcoming release of ESP32-H2 with IEEE 802.15.4 and Bluetooth 5 (LE) connectivity, operable in the 2.4 GHz band.
  
  
• Esperanto Technologies Unveils Energy-Efficient RISC-V-Based Machine Learning Accelerator Chip (Wednesday Aug. 25, 2021)
  Featuring over a thousand RISC-V custom processor cores, Esperanto’s ML inference accelerator is designed to be the highest performance commercial RISC-V chip.
  
  
• PragmatIC Semiconductor re-invents the iconic processor that changed the world (Tuesday Aug. 24, 2021)
  PragmatIC Semiconductor, a world leader in flexible electronics, is proud to announce that it has manufactured a flexible version of the 6502 processor, the iconic design that kick-started the personal computer revolution.
  
  
• Samsung Introduces the Industry's First 5nm Processor Powering the Next Generation of Wearables (Tuesday Aug. 10, 2021)
  The Exynos W920 offers high performance, efficiency and LTE connectivity packed in the industry’s smallest form factor
  
  
• Winbond's Successful Interoperability of OctalNAND Flash with Synopsys DesignWare AMBA IP Delivers Complete High-Density NAND Flash Memory Solution (Thursday Jul. 22, 2021)
  Winbond Electronics Corporation, a leading global supplier of semiconductor memory solutions, today announced the successful interoperability of Synopsys’ DesignWare Synchronous Serial Interface (SSI) IP and Winbond’s OctalNAND Flash Memory.
  
  
• Quantware Launches the World's First Commercially Available Superconducting Quantum Processors, Accelerating the Advent of the Quantum Computer. (Thursday Jul. 15, 2021)
  Today Dutch startup QuantWare has launched the world’s first commercially available superconducting processor for quantum computers (QPU).
  
  
• Xilinx Versal HBM Series with Integrated High Bandwidth Memory Tackles Big Data Compute Challenges in the Network and Cloud (Thursday Jul. 15, 2021)
  Latest in Versal ACAP series delivers unmatched convergence of fast memory, secure connectivity, and adaptable compute in a single platform for data center and network operators
  
  
• Marvell Extends OCTEON Leadership with Industry's First 5nm DPUs (Tuesday Jun. 29, 2021)
  Marvell (NASDAQ: MRVL) today introduced its new OCTEON® 10 DPU designed to accelerate and process a broad spectrum of security, networking, and storage workloads required by demanding 5G, cloud, carrier and enterprise datacenter applications.
  
  
• Mythic Expands Product Lineup with New Scalable, Power-Efficient Analog Matrix Processor for Edge AI Applications (Tuesday Jun. 08, 2021)
  Mythic, the pioneering analog AI processor company with breakthrough analog compute-in-memory technology, today introduced its new M1076 Analog Matrix Processor (Mythic AMP™) which delivers best-in-class performance, scalability, and power efficiency.
  
  
• Palma Ceia SemiDesign Announces New Wi-Fi HaLow Chips, PCS2100 and PCS2500 - Ideal for Industry 4.0 (Monday Jun. 07, 2021)
  Palma Ceia SemiDesign, a fabless semiconductor company specializing in wireless connectivity solutions, announced it has taped out two chips supporting the Wi-Fi HaLowTM connectivity protocol.
  
  
• OmniVision Reduces Automotive Camera Design Complexity with the New, High-Performance OAX4000 ASIC Image Signal Processor (Wednesday May. 05, 2021)
  At AutoSens Detroit 2021, OmniVision Will Demonstrate the New OAX4000 Next-Generation ASIC Designed to Support the Multifunctional Requirements of Surround-View, e-Mirror, Interior and Autonomous Driving Cameras
  
  
• Valens Announces Successful Tapeout of First MIPI A-PHY Compliant Chipsets for Long-Reach, Ultra-High-Speed Automotive Connectivity (Wednesday Apr. 28, 2021)
  Valens, the semiconductor company that is pushing the boundaries of connectivity, today announced that it has completed a successful tape-out of its VA70XX chipsets – the first on the market to comply with the MIPI A-PHY℠ standard for long-reach, ultra-high-speed automotive video connectivity.
  
  
• Allwinner launches the first RISC-V application processor (Thursday Apr. 15, 2021)
  Allwinner Technology today announced the launch of 「D1」 processor, which is the world’s first mass-produced application processor equipped with T-Head Xuantie 906 based on RISC-V, providing an exciting new smart chipset for immediate use in today’s developing Artificial Intelligence of Things (AIoT) market.
  
  
• BrainChip Begins Volume Production of Akida AI Processor (Wednesday Apr. 14, 2021)
  BrainChip Holdings Ltd. (ASX: BRN), a leading provider of ultra-low power, high-performance AI technology, announced today that it has begun volume manufacturing of its Akida™ AKD1000 neuromorphic processor chip for edge AI devices.
  
  
• Intel Launches Its Most Advanced Performance Data Center Platform (Wednesday Apr. 07, 2021)
  New 3rd Gen Intel Xeon Scalable processors (code-named “Ice Lake”) are the foundation of Intel’s data center platform, enabling customers to capitalize on some of the most significant business opportunities today by leveraging the power of AI.
  
  
• Intel CEO Pat Gelsinger Announces "IDM 2.0" Strategy for Manufacturing, Innovation and Product Leadership (Thursday Mar. 25, 2021)
  Gelsinger announced significant manufacturing expansion plans, starting with an estimated $20 billion investment to build two new factories (or “fabs”) in Arizona. He also announced Intel’s plans to become a major provider of foundry capacity in the U.S. and Europe to serve customers globally.
  
  
• Sondrel designs its first Radiation-Hard chip (Thursday Mar. 18, 2021)
  Sondrel is designing its first radiation-hard (Rad-Hard) chip for a customer which is due to tape out shortly. The satellite modem will be used in communication satellites and therefore has to be able to withstand the challenges of the high levels of ionising radiation found in orbit that can cause glitches.