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Fabless / IDM News

• Socionext's latest generation of smart display controllers uses APIX3 technology from Inova Semiconductors (Tuesday Mar. 16, 2021)
  Socionext Inc. has licensed APIX3 technology from Inova Semiconductors for its next generation of smart display controllers. This opens another chapter in a long-standing success story that began in 2007.
  
  
• Socionext Adopts TSMC's 5-nanometer Technology for Custom SoCs Targeting Next-Generation Automotive Applications (Thursday Feb. 04, 2021)
  Socionext Inc., a world-leading provider of custom System-on-Chip (SoC) solutions, today announced that it will adopt TSMC’s latest 5-nanometer process technology (N5P) for Socionext’s high-performance SoC development for next-generation automotive applications.
  
  
• SiTune Introduces World's First 5G Infrastructure Transceiver Solutions (Thursday Feb. 04, 2021)
  SiTune today announced two new products for 5G O-RAN infrastructure hardware solutions including Radio Units (RU) and Distributed Radio Units (dRU) for macro and micro deployments.
  
  
• Palma Ceia SemiDesign Announces PCS1100 Wi-Fi 6E 4x4:4 Transceiver (Thursday Jan. 28, 2021)
  Palma Ceia SemiDesign, a fabless semiconductor company specializing in wireless connectivity solutions, today announced the PCS1100, a Wi-Fi 6E 4×4 transceiver.
  
  
• MediaTek Launches 6nm Dimensity 1200 Flagship 5G SoC with Unrivaled AI and Multimedia for Powerful 5G Experiences (Thursday Jan. 21, 2021)
  MediaTek today unveiled its new Dimensity 1200 and Dimensity 1100 5G smartphone chipsets with unrivaled AI, camera and multimedia features for powerful 5G experiences.
  
  
• Renesas Launches New General-Purpose 64-Bit RZ/G2L Group of MPUs with Latest Arm Cortex-A55 for Improved AI Processing (Tuesday Jan. 19, 2021)
  Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the expansion of its RZ/G2 general-purpose 64-bit microprocessors (MPUs), delivering improved AI processing for a wide range of applications.
  
  
• Syntiant Surpasses Milestone of 10 Million Processors Shipped (Wednesday Jan. 13, 2021)
  Syntiant Corp., a deep learning chip technology company advancing AI pervasiveness in edge devices, today announced that it has shipped more than 10 million of its Syntiant® NDP100™ and Syntiant® NDP101™ Neural Decision Processors™ (NDPs) to customers across the globe.
  
  
• Ambarella introduces CV5 high performance AI vision processor for single 8K and multi-imager AI cameras (Monday Jan. 11, 2021)
  Ambarella, Inc. (Nasdaq: AMBA), an AI vision silicon company, today unveiled CV5, an artificial intelligence (AI) vision processor capable of recording 8K video or four 4K video streams.
  
  
• DSP Group Unveils DBM10 Low-Power Edge AI/ML SoC with Dedicated Neural Network Inference Processor (Thursday Jan. 07, 2021)
  DSP Group today announced the DBM10, a low-power, cost-effective artificial intelligence (AI) and machine learning (ML) system on chip (SoC).
  
  
• Syntiant Introduces Second Generation NDP120 Deep Learning Processor for Audio and Sensor Apps (Thursday Jan. 07, 2021)
  Syntiant Corp., a deep learning chip technology company advancing AI pervasiveness in edge devices, today announced the availability of its Syntiant® NDP120™ Neural Decision Processor™ (NDP), the latest generation of special purpose chips for audio and sensor processing for always-on applications in battery-powered devices.
  
  
• Sequans Introduces Calliope 2: A New Generation of LTE Cat 1 Technology for IoT Applications Requiring Higher Than LTE-M Speed (Wednesday Jan. 06, 2021)
  Sequans Communications S.A. (NYSE: SQNS) today announced that its second-generation LTE Cat 1 chip platform, Calliope 2, will soon be sampling.
  
  
• OmniVision Announces World's First Dedicated Driver Monitoring System ASIC With Integrated AI Neural Processing Unit, Image Signal Processor and DDR3 Memory (Monday Jan. 04, 2021)
  OmniVision Technologies today announced the OAX8000 AI-enabled, automotive application-specific integrated circuit (ASIC), which is optimized for entry-level, stand-alone driver monitoring systems (DMS).
  
  
• Mass production of CoreHW RF Switch has started (Monday Dec. 14, 2020)
  CoreHW RF Switch has passed qualification according to JEDEC JESD22-A108 standard. The mass production of the RF Switch has started and CoreHW is already receiving POs for 2021.
  
  
• Renesas Extends Arm Cortex-Based MCU Family with RA4M3 MCU Group for Industrial and IoT Applications (Wednesday Dec. 09, 2020)
  Renesas Electronics today expanded its RA4 Series microcontrollers (MCUs) with the new 32-bit RA4M3 Group of MCUs.
  
  
• Esperanto Technologies to Reveal Chip with 1000+ Cores at RISC-V Summit (Thursday Dec. 03, 2020)
  Esperanto Technologies has developed a ground-breaking accelerator chip for large-scale machine learning applications employing over 1000 RISC-V cores.
  
  
• Broadcom Debuts Industry's First 5nm ASIC for Data Center and Cloud Infrastructure (Monday Nov. 30, 2020)
  Built on TSMC’s N5 process and measuring 625 mm2, this device incorporates PCIe Gen5 protocol, 112-Gbps SerDes, HBM2e memory operating at 3.6 Gbps, and 3.6-Tbps Die2Die PHY IP utilizing TSMC CoWoS® interposer technology.
  
  
• Mythic launches industry-first AI analog matrix processor (Monday Nov. 23, 2020)
  Mythic, the pioneering analog AI processor company with breakthrough, patented analog compute-in-memory technology, today announced the industry’s first Analog Matrix Processor (Mythic AMP™).
  
  
• AI Startup Deep Vision Powers AI Innovation at the Edge (Thursday Nov. 19, 2020)
  Deep Vision exits stealth mode and launches its ARA-1 inference processor to enable the creation of new world AI vision applications at the edge.
  
  
• First Intel Structured ASIC for 5G, AI, Cloud and Edge Announced (Wednesday Nov. 18, 2020)
  Intel announced a new, customizable solution to help accelerate application performance across 5G, artificial intelligence, cloud and edge workloads. The new Intel® eASIC N5X is the first structured eASIC family with an Intel® FPGA compatible hard processor system.
  
  
• SimpleMachines, Inc. Debuts First-of-its-Kind High Performance Chip (Monday Nov. 16, 2020)
  As traditional chip makers struggle to embrace the challenges presented by the rapidly evolving AI software landscape, a San Jose startup has announced it has working silicon and a whole new future-proof chip paradigm to address these issues.
  
  
• Xilinx and Samsung Deliver Industry's First Adaptable Computational Storage Drives (Thursday Nov. 12, 2020)
  Xilinx, Inc. (NASDAQ: XLNX) and Samsung Electronics Co., Ltd. today announced the availability of the Samsung SmartSSD® Computational Storage Drive (CSD). Powered by Xilinx® FPGAs, the SmartSSD CSD is the industry’s first adaptable computational storage platform providing the performance, customization, and scalability required by data-intensive applications.
  
  
• Xilinx Introduces Breakthrough Zynq RFSoC DFE for Mass 5G Radio Deployments (Wednesday Oct. 28, 2020)
  Xilinx, Inc., (NASDAQ: XLNX) today introduced Zynq® RFSoC DFE, a breakthrough class of adaptive radio platforms designed to meet the evolving standards of 5G NR wireless applications.
  
  
• Flex Logix Announces Working Silicon Of Fastest And Most Efficient AI Edge Inference Chip (Tuesday Oct. 20, 2020)
  Flex Logix Technologies, Inc. today announced availability of its InferX™ X1, the industry’s fastest AI inference chip for edge systems.
  
  
• GreenWaves Technologies Announces Next Generation GAP9 Hearables Platform Using GLOBALFOUNDRIES 22FDX Solution (Thursday Oct. 15, 2020)
  GreenWaves Technologies today announced a next-generation hearables platform based on its GAP9 IoT application processor using GLOBALFOUNDRIES® (GF®) 22FDX® solution. The announcement was made at GF’s annual Global Technology Conference (GTC).
  
  
• Renesas Launches Arm Cortex-M33-based RA6M4 MCU Group with Superior Performance and Advanced Security for IoT Applications (Tuesday Oct. 06, 2020)
  These 32-bit MCUs boost operating performance up to 200 MHz using the Arm® Cortex®-M33 core based on Armv8-M architecture with Arm TrustZone® technology.
  
  
• Tetrivis tapes out prototype Transmit and Receive Phased-Array Silicon Chipsets for Low-Cost Terminals for Emerging Low-Earth Orbit Satellite (LEOSAT) Market (Wednesday Sep. 30, 2020)
  Tetrivis LTD, a provider of specialist Analogue, Mixed-Signal, RF and mm-Wave Intellectual Property, has today taped out the TRV003 (Rx) and TRV004 (Tx) RF/mm- Wave Integrated Circuits for fabrication, the first chipsets in the KuKa™ family of Phased Array ASICs.
  
  
• Credo Introduces Seagull 50 PAM4 DSP to Drive Front- and Mid-Haul 5G Wireless Networks (Tuesday Sep. 08, 2020)
  Credo, a global innovation leader in high performance, low power serial connectivity solutions, today announced Seagull 50, which enables optical modules for 5G front- and mid-haul wireless networks.
  
  
• GigaDevice launches the New GD32E5 Series of MCU's, marking a new milestone for high-performance computing based on the Arm Cortex-M33 core. (Tuesday Aug. 25, 2020)
  GigaDevice, an industry leading semiconductor supplier (stock number 603986), officially released the brand new GD32E5 series of high-performance microcontrollers based on the new Arm® Cortex®-M33 core.
  
  
• IBM Reveals Next-Generation IBM POWER10 Processor (Monday Aug. 17, 2020)
  Designed to offer a platform to meet the unique needs of enterprise hybrid cloud computing, the IBM POWER10 processor uses a design focused on energy efficiency and performance in a 7nm form factor with an expected improvement of up to 3x greater processor energy efficiency, workload capacity, and container density than the IBM POWER9 processor.
  
  
• Blaize Delivers Breakthrough for AI Edge Computing (Friday Aug. 14, 2020)
  Blaize now sampling embedded and accelerator platforms built on the Blaize GSP architecture with up to 60x greater systems efficiency, 10x lower latency, 50x less memory bandwidth, 16TOPS performance at 7W, and 100% programmable.