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Fabless / IDM News

• OmniVision Reduces Automotive Camera Design Complexity with the New, High-Performance OAX4000 ASIC Image Signal Processor (Wednesday May. 05, 2021)
  At AutoSens Detroit 2021, OmniVision Will Demonstrate the New OAX4000 Next-Generation ASIC Designed to Support the Multifunctional Requirements of Surround-View, e-Mirror, Interior and Autonomous Driving Cameras
  
  
• Valens Announces Successful Tapeout of First MIPI A-PHY Compliant Chipsets for Long-Reach, Ultra-High-Speed Automotive Connectivity (Wednesday Apr. 28, 2021)
  Valens, the semiconductor company that is pushing the boundaries of connectivity, today announced that it has completed a successful tape-out of its VA70XX chipsets – the first on the market to comply with the MIPI A-PHY℠ standard for long-reach, ultra-high-speed automotive video connectivity.
  
  
• Allwinner launches the first RISC-V application processor (Thursday Apr. 15, 2021)
  Allwinner Technology today announced the launch of 「D1」 processor, which is the world’s first mass-produced application processor equipped with T-Head Xuantie 906 based on RISC-V, providing an exciting new smart chipset for immediate use in today’s developing Artificial Intelligence of Things (AIoT) market.
  
  
• BrainChip Begins Volume Production of Akida AI Processor (Wednesday Apr. 14, 2021)
  BrainChip Holdings Ltd. (ASX: BRN), a leading provider of ultra-low power, high-performance AI technology, announced today that it has begun volume manufacturing of its Akida™ AKD1000 neuromorphic processor chip for edge AI devices.
  
  
• Intel Launches Its Most Advanced Performance Data Center Platform (Wednesday Apr. 07, 2021)
  New 3rd Gen Intel Xeon Scalable processors (code-named “Ice Lake”) are the foundation of Intel’s data center platform, enabling customers to capitalize on some of the most significant business opportunities today by leveraging the power of AI.
  
  
• Intel CEO Pat Gelsinger Announces "IDM 2.0" Strategy for Manufacturing, Innovation and Product Leadership (Thursday Mar. 25, 2021)
  Gelsinger announced significant manufacturing expansion plans, starting with an estimated $20 billion investment to build two new factories (or “fabs”) in Arizona. He also announced Intel’s plans to become a major provider of foundry capacity in the U.S. and Europe to serve customers globally.
  
  
• Sondrel designs its first Radiation-Hard chip (Thursday Mar. 18, 2021)
  Sondrel is designing its first radiation-hard (Rad-Hard) chip for a customer which is due to tape out shortly. The satellite modem will be used in communication satellites and therefore has to be able to withstand the challenges of the high levels of ionising radiation found in orbit that can cause glitches.
  
  
• Socionext's latest generation of smart display controllers uses APIX3 technology from Inova Semiconductors (Tuesday Mar. 16, 2021)
  Socionext Inc. has licensed APIX3 technology from Inova Semiconductors for its next generation of smart display controllers. This opens another chapter in a long-standing success story that began in 2007.
  
  
• Socionext Adopts TSMC's 5-nanometer Technology for Custom SoCs Targeting Next-Generation Automotive Applications (Thursday Feb. 04, 2021)
  Socionext Inc., a world-leading provider of custom System-on-Chip (SoC) solutions, today announced that it will adopt TSMC’s latest 5-nanometer process technology (N5P) for Socionext’s high-performance SoC development for next-generation automotive applications.
  
  
• SiTune Introduces World's First 5G Infrastructure Transceiver Solutions (Thursday Feb. 04, 2021)
  SiTune today announced two new products for 5G O-RAN infrastructure hardware solutions including Radio Units (RU) and Distributed Radio Units (dRU) for macro and micro deployments.
  
  
• Palma Ceia SemiDesign Announces PCS1100 Wi-Fi 6E 4x4:4 Transceiver (Thursday Jan. 28, 2021)
  Palma Ceia SemiDesign, a fabless semiconductor company specializing in wireless connectivity solutions, today announced the PCS1100, a Wi-Fi 6E 4×4 transceiver.
  
  
• MediaTek Launches 6nm Dimensity 1200 Flagship 5G SoC with Unrivaled AI and Multimedia for Powerful 5G Experiences (Thursday Jan. 21, 2021)
  MediaTek today unveiled its new Dimensity 1200 and Dimensity 1100 5G smartphone chipsets with unrivaled AI, camera and multimedia features for powerful 5G experiences.
  
  
• Renesas Launches New General-Purpose 64-Bit RZ/G2L Group of MPUs with Latest Arm Cortex-A55 for Improved AI Processing (Tuesday Jan. 19, 2021)
  Renesas Electronics Corporation (TSE:6723), a premier supplier of advanced semiconductor solutions, today announced the expansion of its RZ/G2 general-purpose 64-bit microprocessors (MPUs), delivering improved AI processing for a wide range of applications.
  
  
• Syntiant Surpasses Milestone of 10 Million Processors Shipped (Wednesday Jan. 13, 2021)
  Syntiant Corp., a deep learning chip technology company advancing AI pervasiveness in edge devices, today announced that it has shipped more than 10 million of its Syntiant® NDP100™ and Syntiant® NDP101™ Neural Decision Processors™ (NDPs) to customers across the globe.
  
  
• Ambarella introduces CV5 high performance AI vision processor for single 8K and multi-imager AI cameras (Monday Jan. 11, 2021)
  Ambarella, Inc. (Nasdaq: AMBA), an AI vision silicon company, today unveiled CV5, an artificial intelligence (AI) vision processor capable of recording 8K video or four 4K video streams.
  
  
• DSP Group Unveils DBM10 Low-Power Edge AI/ML SoC with Dedicated Neural Network Inference Processor (Thursday Jan. 07, 2021)
  DSP Group today announced the DBM10, a low-power, cost-effective artificial intelligence (AI) and machine learning (ML) system on chip (SoC).
  
  
• Syntiant Introduces Second Generation NDP120 Deep Learning Processor for Audio and Sensor Apps (Thursday Jan. 07, 2021)
  Syntiant Corp., a deep learning chip technology company advancing AI pervasiveness in edge devices, today announced the availability of its Syntiant® NDP120™ Neural Decision Processor™ (NDP), the latest generation of special purpose chips for audio and sensor processing for always-on applications in battery-powered devices.
  
  
• Sequans Introduces Calliope 2: A New Generation of LTE Cat 1 Technology for IoT Applications Requiring Higher Than LTE-M Speed (Wednesday Jan. 06, 2021)
  Sequans Communications S.A. (NYSE: SQNS) today announced that its second-generation LTE Cat 1 chip platform, Calliope 2, will soon be sampling.
  
  
• OmniVision Announces World's First Dedicated Driver Monitoring System ASIC With Integrated AI Neural Processing Unit, Image Signal Processor and DDR3 Memory (Monday Jan. 04, 2021)
  OmniVision Technologies today announced the OAX8000 AI-enabled, automotive application-specific integrated circuit (ASIC), which is optimized for entry-level, stand-alone driver monitoring systems (DMS).
  
  
• Mass production of CoreHW RF Switch has started (Monday Dec. 14, 2020)
  CoreHW RF Switch has passed qualification according to JEDEC JESD22-A108 standard. The mass production of the RF Switch has started and CoreHW is already receiving POs for 2021.
  
  
• Renesas Extends Arm Cortex-Based MCU Family with RA4M3 MCU Group for Industrial and IoT Applications (Wednesday Dec. 09, 2020)
  Renesas Electronics today expanded its RA4 Series microcontrollers (MCUs) with the new 32-bit RA4M3 Group of MCUs.
  
  
• Esperanto Technologies to Reveal Chip with 1000+ Cores at RISC-V Summit (Thursday Dec. 03, 2020)
  Esperanto Technologies has developed a ground-breaking accelerator chip for large-scale machine learning applications employing over 1000 RISC-V cores.
  
  
• Broadcom Debuts Industry's First 5nm ASIC for Data Center and Cloud Infrastructure (Monday Nov. 30, 2020)
  Built on TSMC’s N5 process and measuring 625 mm2, this device incorporates PCIe Gen5 protocol, 112-Gbps SerDes, HBM2e memory operating at 3.6 Gbps, and 3.6-Tbps Die2Die PHY IP utilizing TSMC CoWoS® interposer technology.
  
  
• Mythic launches industry-first AI analog matrix processor (Monday Nov. 23, 2020)
  Mythic, the pioneering analog AI processor company with breakthrough, patented analog compute-in-memory technology, today announced the industry’s first Analog Matrix Processor (Mythic AMP™).
  
  
• AI Startup Deep Vision Powers AI Innovation at the Edge (Thursday Nov. 19, 2020)
  Deep Vision exits stealth mode and launches its ARA-1 inference processor to enable the creation of new world AI vision applications at the edge.
  
  
• First Intel Structured ASIC for 5G, AI, Cloud and Edge Announced (Wednesday Nov. 18, 2020)
  Intel announced a new, customizable solution to help accelerate application performance across 5G, artificial intelligence, cloud and edge workloads. The new Intel® eASIC N5X is the first structured eASIC family with an Intel® FPGA compatible hard processor system.
  
  
• SimpleMachines, Inc. Debuts First-of-its-Kind High Performance Chip (Monday Nov. 16, 2020)
  As traditional chip makers struggle to embrace the challenges presented by the rapidly evolving AI software landscape, a San Jose startup has announced it has working silicon and a whole new future-proof chip paradigm to address these issues.
  
  
• Xilinx and Samsung Deliver Industry's First Adaptable Computational Storage Drives (Thursday Nov. 12, 2020)
  Xilinx, Inc. (NASDAQ: XLNX) and Samsung Electronics Co., Ltd. today announced the availability of the Samsung SmartSSD® Computational Storage Drive (CSD). Powered by Xilinx® FPGAs, the SmartSSD CSD is the industry’s first adaptable computational storage platform providing the performance, customization, and scalability required by data-intensive applications.
  
  
• Xilinx Introduces Breakthrough Zynq RFSoC DFE for Mass 5G Radio Deployments (Wednesday Oct. 28, 2020)
  Xilinx, Inc., (NASDAQ: XLNX) today introduced Zynq® RFSoC DFE, a breakthrough class of adaptive radio platforms designed to meet the evolving standards of 5G NR wireless applications.
  
  
• Flex Logix Announces Working Silicon Of Fastest And Most Efficient AI Edge Inference Chip (Tuesday Oct. 20, 2020)
  Flex Logix Technologies, Inc. today announced availability of its InferX™ X1, the industry’s fastest AI inference chip for edge systems.