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Fabless / IDM News

• Rambus Delivers 6400 MT/s DDR5 Registering Clock Driver to Advance Server Memory Performance (Thursday Feb. 02, 2023)
  Rambus today announced the availability of its new 6400 MT/s DDR5 Registering Clock Driver (RCD) and sampling to the major DDR5 memory module (RDIMM) manufacturers.
  
  
• Tachyum Successfully Runs UEFI on Prodigy FPGA (Tuesday Jan. 31, 2023)
  Tachyum™ today announced that it has successfully demonstrated Unified Extensible Firmware Interface (UEFI) running on the Prodigy Field-Programmable Gate Array (FPGA) hardware emulation system, representing a critical piece of the company’s test strategy and ensuring that Tachyum’s Prodigy hardware is maturing on pace for production later this year.
  
  
• RISC-V SBC VisionFive 2 Officially Shipped (Tuesday Jan. 10, 2023)
  Recently, StarFive Technology has completed production and testing of the first batch of VisionFive 2 SBCs, which has started shipment and will be delivered to customers in succession.
  
  
• Tachyum Closes DDR5 Timing at over 6400MT/s Providing Massive Bandwidth for Prodigy Chip (Tuesday Jan. 10, 2023)
  Tachyum™ today announced that the IP components –DDR5 RAM controller and high-performance, low-power DSP-based PHY – incorporated into the Prodigy Universal Processor have allowed it to achieve speeds of 6400 MT/s at nominal voltage for Prodigy chip which provides headroom for expected speeds of up to or even over 7200 MT/s.
  
  
• Syntiant Unveils NDP115 Neural Decision Processor at CES 2023 (Thursday Jan. 05, 2023)
  Syntiant Corp., a provider of deep learning solutions for edge AI applications, today introduced the Syntiant NDP115 Neural Decision Processor™, the newest addition to its family of special purpose silicon, built using the company’s Syntiant Core 2™ inference engine than can run multiple neural network loads at under 1mW.
  
  
• SpacemiT makes important breakthroughs in RISC-V High-Performance Cores (Thursday Jan. 05, 2023)
  We’re excited to share some recent progress in the development of our first-generation RISC-V fusion computing processor core – the X100. X100 has already made significant leaps with its general-purpose computing and application-oriented fusion computing capabilities.
  
  
• Axelera AI Announces Metis AI Platform (Thursday Dec. 22, 2022)
  European artificial intelligence (AI) startup Axelera AI announced today its Metis AI Platform, encompassing the Metis AI Processing Unit (AIPU) chip and the Voyager SDK software stack – available as cards, boards, and vision systems – to accelerate computer vision processing at the edge.
  
  
• Ventana Introduces Veyron, World's First Data Center Class RISC-V CPU Product Family (Thursday Dec. 15, 2022)
  Ventana Micro Systems Inc. today announced its Veyron family of high performance RISC-V processors. The Veyron V1 is the first member of the family, and the highest performance RISC-V processor available today.
  
  
• Siquance: an avant-garde startup dedicated to quantum calculations (Thursday Dec. 08, 2022)
  As a fabless startup, Siquance aims to become a global leader in quantum technology by developing a quantum computer that is based on the same technological building blocks as standard silicon integrated circuits. To enable this revolution, a disruptive technology solution was essential to transform a classical transistor so that it could handle quantum bits known as qubits (the quantum equivalent of classical bits).
  
  
• Innovative ASIC CPU Drives Record-Setting Server Performance (Monday Dec. 05, 2022)
  In a paper presented at the TSMC North America Open Innovation Platform Forum, Alchip Technologies and Synopsys showed how collaborative design expertise, EDA tools, and high-quality IP had created a record-setting, high-performance artificial intelligence enabled data center system-on-a chip (SoC).
  
  
• Tachyum Successfully Runs LINPACK on FPGA With IEEE 754-2019 Compliant FPU (Tuesday Nov. 29, 2022)
  Tachyum™ continues to advance towards production-ready status of its universal processor after reaching its latest milestone of running LINPACK benchmarks using Prodigy’s Floating-Point Unit (FPU) on a Field Programmable Gate Array (FPGA). This was achieved by running applications under Linux on the integer part of the processor and uses IEEE compliant Floating-Point Unit (FPU) to analyze and solve linear equations and linear least-square problems.
  
  
• Cortus announces the launch of LOTUS family with two new RISC-V microcontrollers (MCUs) (Monday Nov. 28, 2022)
  Cortus, an innovative French fabless semiconductor manufacturing group today announces two new RISC-V microcontrollers (MCUs). They are designed for ease of use, and to simplify migration from existing MCUs with maximal software reuse to minimize development cost.
  
  
• EASii IC announces first silicon for its DVB-S2X satellite Modem ASIC (Tuesday Nov. 15, 2022)
  EASii IC announces its satellite modem ASIC, EZID211 also known as Oxford-2. The Oxford-2 is compliant with the DVB-S2 standard ETSI EN 302 307-2 and implements the latest S2X, adaptive coding and modulation (ACM), Very Low Signal to Noise Ratio (VLSNR) and super frame functionality.
  
  
• Marvell Announces Innovative CXL Development Platform for Multi-Host Memory Pooling (Monday Nov. 14, 2022)
  Marvell Technology today announced a Compute Express Link™ Development Platform for cloud data center operators and server OEMs
  
  
• Weebit Nano receives from SkyWater Technology the first silicon wafers it manufactured with embedded Weebit ReRAM (Tuesday Nov. 08, 2022)
  Weebit Nano Limited (ASX:WBT), a leading developer of next-generation memory technologies for the global semiconductor industry, and SkyWater Technology (NASDAQ: SKYT), the trusted technology realisation partner, announce the first silicon wafers integrating Weebit’s embedded Resistive Random-Access Memory (ReRAM) module have been delivered to Weebit from SkyWater’s U.S. production fab.
  
  
• POLYN Technology, Edge Impulse Join Forces to Advance Tiny AI Products (Tuesday Nov. 08, 2022)
  POLYN Technology, a fabless semiconductor company providing Neuromorphic Analog Signal Processing (NASP) Tiny AI chips, and Edge Impulse, the leading embedded machine-learning (ML) development platform, have partnered to address ultra-low-power on-sensor solutions for wearables, hearables, and Industrial Internet of Things (IIoT).
  
  
• Marvell Announces Industry's Most Comprehensive 3nm Data Infrastructure IP Portfolio (Thursday Oct. 20, 2022)
  The new 3nm Marvell silicon, which is now in fabrication with Taiwan Semiconductor Manufacturing Company (TSMC) on its 3nm shuttle, is available for new product designs and includes foundational IP building blocks such as long reach SerDes, PCIe Gen6 PHY, and several standards-based die-to-die interconnect technologies for managing data flow across the data infrastructure.
  
  
• POLYN Introduces Voice Processing Tiny AI Chip Delivering Industry-First Voice Extraction (Tuesday Oct. 11, 2022)
  POLYN Technology, the innovative provider of unique NASP technology and a producer of Tiny AI chips and their associated IP, today announced the availability of NeuroVoice, a solution for on-chip voice extraction from any noisy background.
  
  
• Credo Introduces Screaming Eagle 112G Retimer DSP with Industry Leading 1.6 Terabit Capacity (Wednesday Oct. 05, 2022)
  Credo (NASDAQ: CRDO) today announced the Screaming Eagle 112G LR (Long Reach) DSP device with 1.6 Terabits per second (Tbps) of retiming capacity. By supporting port speeds of 1.6T, 800G, 400G, 100G and down to 10G – Screaming Eagle can satisfy the massive data transit requirements of hyperscalers, enterprises, 5G carriers and service provider customers.
  
  
• Renesas Expands RZ/V Series with Built-in Vision AI Accelerator for Accurate Image Recognition and Multi-Camera Image Support (Thursday Sep. 29, 2022)
  Equipped with two 64-bit Arm® Cortex®-A53 cores, the new device is capable of delivering high computing performance with a maximum operating frequency of 1GHz. The RZ/V2MA features a proprietary low power DRP-AI (Dynamically Reconfigurable Processor) accelerator which can process vision AI at 1 TOPS/W (tera operations per second, per watt) class performance.
  
  
• Inuitive launches NU4100, expanding its Edge-AI Vision-on-Chip IC portfolio (Thursday Sep. 22, 2022)
  Based on Inuitive’s unique architecture and advanced 12nm process technology, the new NU4100 IC supports integrated dual-channel 4K ISP, enhanced AI processing, and depth sensing in a single-chip, low-power design, setting the new industry standard for Edge-AI performance.
  
  
• IntelliProp First to Market with Memory Fabric Based on CXL; Driving Most Disruptive Technology to Hit Data Centers in Decades (Wednesday Sep. 21, 2022)
  IntelliProp, a leading innovator of composable data center transformation technology, today announced its intent to deliver its disruptive Omega Memory Fabric chips. The chips incorporate the Compute Express Link™ (CXL) Standard, along with IntelliProp’s innovative Fabric Management Software and Network Attached Memory (NAM) system.
  
  
• Ubilite Introduces a Wi-Fi Chip With Less-Than-Bluetooth Power Consumption (Thursday Sep. 15, 2022)
  Ubilite Inc. (“Ubilite”) today announced the immediate availability of its UBI206 platform based on the UBI206 SoC, targeted specifically for ultra-low power wireless applications. The UBI206 is a highly integrated single device that enables a vast number of IoT products with a minimal number of external components.
  
  
• Credo Targets Hyperscale Data Centers and 5G Networks with New Optical DSPs (Wednesday Sep. 14, 2022)
  Credo Technology Group Holding Ltd (NASDAQ: CRDO) today introduced two high-performance, low-power optical DSPs ICs; the single channel Seagull 52 and the quad channel Seagull 202.
  
  
• Hisense Selects Synaptics' DBM10L Processor For First AI-Enabled Always-On Voice Remote Control (Monday Sep. 12, 2022)
  Synaptics® Incorporated today announced that Hisense, a global leader in consumer electronics and home appliances, selected the DBM10L with its dedicated neural processing unit (NPU) to implement the first artificial intelligence (AI)-enabled always-on voice (AOV) remote control unit (RCU), the EFR3B86H.
  
  
• Renesas Extends Leading RISC-V Embedded Processing Portfolio with New Motor Control ASSP Solution (Thursday Sep. 08, 2022)
  Renesas Electronics Corporation (TSE: 6723), a premier supplier of advanced semiconductor solutions, today introduced the industry’s first RISC-V MCU specifically optimized for advanced motor control systems.
  
  
• SiMa.ai Develops the Industry's First Purpose-Built Machine Learning System-on-Chip with TSMC's Power Efficient Technology (Tuesday Aug. 30, 2022)
  SiMa.ai, the machine learning company enabling effortless deployment and scaling at the embedded edge, today announced it has delivered a software-centric MLSoC Platform that enables quick and Effortless ML experiences for the embedded edge, benefiting from TSMC’s power efficient process technology and most comprehensive design ecosystem.
  
  
• Credo Introduces 800Gbps and 400Gbps Optical Digital Signal Processors with Integrated Drivers (Monday Aug. 29, 2022)
  Credo Technology Group Holding Ltd (NASDAQ: CRDO) today introduced its new Dove 800 Digital Signal Processor family of products. The products are targeted at rapidly growing Hyperscale Data Center and AI applications and enable customers to meet increasingly stringent power and bandwidth requirements.
  
  
• Untether Unveils 2-PFLOPS AI Chip, Edge Roadmap (Thursday Aug. 25, 2022)
  At Hot Chips this week, Untether unveiled its second-gen architecture for AI inference, the first chip using this architecture, as well as plans to expand to edge and endpoint accelerators.
  
  
• Nordic Semiconductor announces its first Wi-Fi chip, the dual-band Wi-Fi 6 nRF7002 (Tuesday Aug. 16, 2022)
  Nordic Semiconductor today announces its entry into the Wi-Fi® wireless IoT market with the introduction of the nRF7002, an ultra-low power, dual-band Wi-Fi 6 companion IC.