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Fabless / IDM News

• Sonix Introduces a New series of Extremely Low Power Consumption and High Performance 32 bit MCU powered by ARM Cortex M0 processor (Monday Jul. 02, 2012)
  Sonix Technology, the leading company of MCU, is delighted to announce its step into the 32-bit segment with the launch of a new 32-bit MCU series, SN32F700, based on the ARM Cortex™-M0 core.
  
  
• u-blox Launches GPS SoC Using GLOBALFOUNDRIES 65nm-LPe RF Process Technology (Thursday Jun. 21, 2012)
  u-blox, the Swiss positioning and wireless module and chip company, and GLOBALFOUNDRIES today jointly announced that u-blox has begun shipping its u-blox 7 Global Positioning System System-on-Chip (GPS SoC) based on the foundry’s advanced 65 nanometer (nm) Low Power Enhanced (LPe) RF process technology platform.
  
  
• Tiempo Announces Silicon Validation of TESIC, Tiempo Secured Platform (Wednesday Jun. 20, 2012)
  Tiempo today announced it has proven on silicon its secured transaction platform, TESIC, manufactured on TSMC 130 nm LP process. Tiempo TESIC is a complete secure platform for the design of integrated circuits implementing secured transactions such as smartcard chips for banking and ticketing, chips for ePassports or NFC secure elements.
  
  
• New Freescale 28-nm QorIQ AMP Series Processors Deliver High-End Features and Ultra-Low-Power Operation (Tuesday Jun. 19, 2012)
  Freescale Semiconductor is introducing two new QorIQ AMP series processors designed to deliver an ideal combination of performance, power and integration. The new 28-nm QorIQ AMP T1042 and T2080 devices will bring the same leading edge attributes of the QorIQ AMP series to the entry level and mid range segments, joining the previously announced T4240 product, which is Freescale’s flagship QorIQ AMP series offering for high end systems.
  
  
• ST first to bridge DisplayPort and HDMI for seamless connectivity (Thursday Jun. 14, 2012)
  STMicroelectronics today introduced the “Mystique” family of products, the world’s first high-speed active-protocol bi-directional converters for managing audio and video signals between DisplayPort and HDMI, the two most common digital-display interface technologies used in computer and consumer electronics.
  
  
• Micron Boosts DDR3 Offering With 2Gb and 4Gb, 1GHz/DDR3-2133, Delivering Power Efficiency and Speed for High-Performance Networking and Graphics Segments (Tuesday Jun. 12, 2012)
  Micron today introduced a new class of 1GHz, 2-gigabit (Gb) and 4Gb, 30-nm DDR3 devices, strengthening the company's comprehensive DDR3 portfolio
  
  
• STMicroelectronics Secures Additional Sourcing for its Leading-Edge 28nm and 20nm FD-SOI Technology with GLOBALFOUNDRIES (Monday Jun. 11, 2012)
  STMicroelectronics announces that GLOBALFOUNDRIES has agreed to manufacture devices for ST using ST’s proprietary Fully Depleted Silicon-on-Insulator (FD-SOI) technology in both the 28nm and 20nm nodes.
  
  
• Newport Media Introduces World's Smallest, Lowest Power 802.11n Wi-Fi SoC (Monday Jun. 11, 2012)
  Newport Media today announced its first SoC product to address the wireless connectivity market. The NMC1000 is a Wi-Fi(R) SoC that includes all RF and Baseband circuitry required to provide IEEE 802.11b, g, n-compliant operation including all necessary power amplifiers and switches.
  
  
• Sequans Delivers 150 Mbps Category 4 LTE Throughput (Monday Jun. 11, 2012)
  Sequans Communications has achieved full category 4 LTE downlink throughput of 150 Mbps - the maximum category 4 rate - during interoperability testing with several major eNodeB and test equipment vendors.
  
  
• Mindspeed Announces High-Performance, Multi-Core ARM Cortex-A CPU-Based Communications Processor Family (Monday Jun. 11, 2012)
  
  
  
• Ensphere 10 Gbps Optical Transceiver Silicon Supports New Thunderbolt Active Optical Cables (Monday Jun. 11, 2012)
  Ensphere Solutions is pleased to report the first Thunderbolt™ active optical cables (AOC) are now entering the market using the Ensphere ESI-XVR10100 optical transceiver.
  
  
• Netronome Unveils 200 Gbps Flow Processor (Tuesday Jun. 05, 2012)
  Netronome today disclosed the details of the NFP-6xxx family of processors. The NFP-6xxx product line is the sixth generation of flow processors and is designed for high- performance networking applications that require programmable, line-rate, stateful processing on millions of simultaneous, complex flows
  
  
• Tiempo, Working with STMicroelectronics, Unveils First 32nm Clockless Test Chip (Friday Jun. 01, 2012)
  Tiempo, working closely with STMicroelectronics today announced the first fully clockless circuit in 32nm. The chip was fabricated as firsttime- right silicon, with all chip samples 100% functional.
  
  
• Renesas Electronics and TSMC Collaborate to Construct Ecosystem for Microcontrollers (Monday May. 28, 2012)
  Renesas and TSMC today announced that they have signed an agreement to extend their microcontroller (MCU) technology collaboration to 40 nanometer (nm) embedded flash (eFlash) process technology for manufacturing MCU products used in next-generation automotive and consumer applications such as home appliances.
  
  
• Samsung Now Producing Highest Density Mobile LPDDR2 Memory Using 20nm-class Technology - an Industry First (Monday May. 21, 2012)
  Samsung Electronics Co., Ltd., a global leader in advanced semiconductor technology solutions, announced today that it has begun producing the industry's first four gigabit (Gb), low power double-data-rate 2 (LPDDR2) memory using 20 nanometer (nm) class technology.
  
  
• Entropic Communications Unveils Next-Generation Set-Top Box System-on-a-Chip Solution for Cable and IP-Client Markets (Monday May. 14, 2012)
  Entropic Communications today introduced its latest generation of high-performance set-top box (STB) system-on-a-chip (SoC) solutions, offering cable and IP markets a dual-core ARM® Cortex-A9 processors with integrated NEON™ technology.
  
  
• STMicroelectronics Enters Production with New STM32 F0 Microcontrollers Targeting Budget Applications (Friday May. 11, 2012)
  With a dedicated Discovery Kit also available, and leveraging the extensive STM32 development ecosystem, engineers now have everything they need to use ST’s new microcontrollers featuring the ARM® Cortex™-M0 processor in cost-sensitive consumer and industrial products.
  
  
• MoSys Releases Carrier-Grade Bandwidth Engine IC to Production (Wednesday May. 09, 2012)
  MoSys today announced the production release of its first generation high-speed serial access Bandwidth Engine(R) IC product. The MSR576 device is optimized for high-data rate, high-access rate use in networking, video processing and compute acceleration applications and is supported by leading suppliers of FPGAs and ASICs.
  
  
• Intersil Introduces Next Generation 40nm Thunderbolt Solution (Wednesday May. 09, 2012)
  Intersil Corporation today unveiled its active cable solution specifically designed to support Thunderbolt cables. Intersil's active cable system solution includes the ISL37231 – the industry's first 40nm active cable IC – and the ISL80083 companion power management IC.
  
  
• Micron Announces Its First Fully Functional DDR4 DRAM Module (Tuesday May. 08, 2012)
  Micron today announced development of its first fully functional DDR4 DRAM module. The company has begun sampling and has received feedback from major customers to support quick implementation for applications in 2013.
  
  
• eASIC Enables 3X Increase in Energy Efficiency for Astrophysical Simulation Supercomputer (Wednesday May. 02, 2012)
  eASIC today announced that Tokyo Institute of Technology, in collaboration with Hitotsubashi University, has successfully demonstrated a 3X increase in energy efficiency for a green supercomputer used for performing astronomical simulations.
  
  
• Quantenna Communications Raises $79 Million Led by RUSNANO and Sequoia Capital (Wednesday Apr. 25, 2012)
  Quantenna Communications announced today that it has closed a $79 million funding round led by new lead investor RUSNANO, with participation by a second new investor Bright Capital. RUSNANO will invest up to $40 million and Sequoia Capital Growth Fund will contribute $20 million.
  
  
• Amlogic Unveils Market Leading Dual-Core ARM Cortex-A9 Processor-Based SoCs for Next-Generation Tablet, Set-Top-Box and Mobile Devices (Tuesday Apr. 10, 2012)
  AML8726-MX Family Combines 1.5 GHz ARM Cortex-A9 MPCore(TM) Processor and Multi-Core Mali(TM)-400 MP GPU to Provide Industry-Leading Performance, Low Power and Reduced System Cost
  
  
• Netronome to Build World's Highest Performance Flow Processors on Intel 22nm Technology (Friday Apr. 06, 2012)
  Netronome today announced an extension of its strategic relationship with Intel Corp. in which Netronome’s next-­‐ generation flow processors will be manufactured on Intel’s leading 22nm process. Netronome will offer the world’s first flow processors based on Intel’s market-­‐defining 3-­‐D Tri-­‐Gate transistor technology and will shatter system benchmarks for flow processor performance, power and cost in network and security applications.
  
  
• MOSAID First to Achieve Single Channel, Full Performance 16-Die NAND Flash Stack (Tuesday Apr. 03, 2012)
  MOSAID Technologies Inc. today announced that it is sampling the industry's first NAND Flash MCP (multi-chip package) with a 16-die NAND stack operating on a single high-performance channel.
  
  
• Dialog Semiconductor and TSMC create a Process Platform to advance BCD power management leadership (Thursday Mar. 29, 2012)
  Dialog Semiconductor today announced it is working closely with TSMC to develop its next generation of bipolar-CMOS-DMOS (BCD) technology specifically tailored to high-performance power management ICs (PMICs) for portable devices.
  
  
• Renesas Electronics Introduces High-Performance and Compact SoC for High-End Hybrid Set-Top Box (Monday Mar. 19, 2012)
  Renesas Electronics today announced the availability of its new SoC for high-end set-top boxes (STBs) the R-Home S1, supporting both worldwide digital TV broadcast reception and Internet content distribution.
  
  
• Novocell Semiconductor Introduces SWIFT2Chip -- the Integrated Circuit Industry's First Full Service, Hassle-Free, Drop-In Non-Volatile Memory Delivery Process (Tuesday Mar. 13, 2012)
  Novocell Semiconductor introduces SWIFT2Chip™, a new full service, end-to-end, NVM deliverable process and technology package that includes the patented and uncontested NovoBlox™ SmartBit™ technology, unparalleled documentation support, and an on-call, dedicated account engineer.
  
  
• Broadcom Announces 40nm EZ-HD Digital Transport Adapter Solution (Monday Mar. 12, 2012)
  Broadcom today announced the industry's most advanced and easy-to-use 40nm EZ-HD DTA cable SoC solution.
  
  
• Dialog Semiconductor Pioneers Integration of ARM Processor in Power Management ICs for Next Generation Smartphones (Wednesday Mar. 07, 2012)
  Dialog Semiconductor today announced that it has licensed the ARM® Cortex™-M0 processor for use in future generations of its power management ICs (PMICs).