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Fabless / IDM News

• CSR Debuts First SiRFstarV Chip Optimised for Mobile Devices - Selected by LG Electronics for New Flagship Smartphone (Thursday Aug. 16, 2012)
  CSR today introduced the new SiRFstarV 5t tracker, the first SiRFstarV architecture product optimised to deliver continuous, highly accurate location awareness to the latest generation of smartphones, tablets and other mobile devices.
  
  
• Nitero Demonstrates First Multi-Gigabit Ultra-Low Power 60GHz Wi-Fi Solution for Mobile Devices (Tuesday Aug. 07, 2012)
  Nitero, a fabless semiconductor company developing next-generation 60GHz Wi-Fi solutions for mobile devices, today announced that it has begun demonstrating its multi-gigabit, ultra-low power Wi-Fi solution to select industry partners.
  
  
• Semtech Launches First Sub-GHz Multi-Mode PHY Transceiver (Thursday Jul. 26, 2012)
  Semtech today expanded its RFIC platform with the new SX1257, a low power digital I/Q RF multi-mode PHY transceiver. The SX1257 is the first available solution to support all mandatory and optional IEEE 802.15.4g PHY modes including orthogonal frequency division multiplexing (OFDM).
  
  
• Vitesse's SynchroPHY Family Sets New Standard for Timing Accuracy in Mobile Networks (Wednesday Jul. 25, 2012)
  Vitesse Semiconductor today unveiled its SynchroPHY™ portfolio of 1 Gigabit Ethernet (GE), 10GE and 10GE OTN PHYs.
  
  
• QuickLogic's CSSPs Enable TI's Sitara AM335x ARM Cortex-A8 Processor to Support High-Resolution Cameras (Monday Jul. 23, 2012)
  QuickLogic today announced a complete, ready-to-use solution for the Sitara™ AM335x ARM® Cortex™-A8 processor from Texas Instruments Incorporated (TI). The QuickLogic solution enables TI’s AM335x processor to support high-resolution cameras through a low-power parallel Camera Interface (CAM I/F) port.
  
  
• Genesys Logic USB 3.0 Hub Controller - GL3520 is Certified by Microsoft Windows 8 Hardware Certification Kit (WHCK2.0) (Friday Jul. 20, 2012)
  Genesys Logic today announced its high performance USB 3.0 hub controller, GL3520, has achieved Microsoft Windows 8 Hardware Certification for successfully meeting the performance, quality, and feature criteria of Windows 8 based systems.
  
  
• Atmel Introduces First Reconfigurable Processor That Enables On-the-Fly Adjustment of Space Applications (Tuesday Jul. 17, 2012)
  Atmel today announced the Atmel ATF697FF, the newest member of the Atmel SPARC V8 processor family and the industry’s first radiation-hardened (RAD Hard) high-performance aerospace microprocessor that can be reconfigured on-the-fly.
  
  
• InvenSense Sets a New Industry Benchmark with the World's Smallest Six-axis Integrated MotionTracking Device (Thursday Jul. 12, 2012)
  The MPU-6500, delivered in a 3x3x0.9mm QFN package, is the world's smallest 6-axis MotionTracking device and incorporates the latest InvenSense design innovations for MEMS 3-axis gyroscopes and accelerometers, enabling dramatically reduced chip size and power consumption, while at the same time improving performance and cost.
  
  
• Samsung Samples Industry's First 16-Gigabyte Server Modules Based on DDR4 Memory Technology (Friday Jul. 06, 2012)
  Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun sampling the industry's first 16-gigabyte (GB) double data rate-4 (DDR4), registered dual inline memory modules (RDIMMs), designed for use in enterprise server systems.
  
  
• Sonix Introduces a New series of Extremely Low Power Consumption and High Performance 32 bit MCU powered by ARM Cortex M0 processor (Monday Jul. 02, 2012)
  Sonix Technology, the leading company of MCU, is delighted to announce its step into the 32-bit segment with the launch of a new 32-bit MCU series, SN32F700, based on the ARM Cortex™-M0 core.
  
  
• u-blox Launches GPS SoC Using GLOBALFOUNDRIES 65nm-LPe RF Process Technology (Thursday Jun. 21, 2012)
  u-blox, the Swiss positioning and wireless module and chip company, and GLOBALFOUNDRIES today jointly announced that u-blox has begun shipping its u-blox 7 Global Positioning System System-on-Chip (GPS SoC) based on the foundry’s advanced 65 nanometer (nm) Low Power Enhanced (LPe) RF process technology platform.
  
  
• Tiempo Announces Silicon Validation of TESIC, Tiempo Secured Platform (Wednesday Jun. 20, 2012)
  Tiempo today announced it has proven on silicon its secured transaction platform, TESIC, manufactured on TSMC 130 nm LP process. Tiempo TESIC is a complete secure platform for the design of integrated circuits implementing secured transactions such as smartcard chips for banking and ticketing, chips for ePassports or NFC secure elements.
  
  
• New Freescale 28-nm QorIQ AMP Series Processors Deliver High-End Features and Ultra-Low-Power Operation (Tuesday Jun. 19, 2012)
  Freescale Semiconductor is introducing two new QorIQ AMP series processors designed to deliver an ideal combination of performance, power and integration. The new 28-nm QorIQ AMP T1042 and T2080 devices will bring the same leading edge attributes of the QorIQ AMP series to the entry level and mid range segments, joining the previously announced T4240 product, which is Freescale’s flagship QorIQ AMP series offering for high end systems.
  
  
• ST first to bridge DisplayPort and HDMI for seamless connectivity (Thursday Jun. 14, 2012)
  STMicroelectronics today introduced the “Mystique” family of products, the world’s first high-speed active-protocol bi-directional converters for managing audio and video signals between DisplayPort and HDMI, the two most common digital-display interface technologies used in computer and consumer electronics.
  
  
• Micron Boosts DDR3 Offering With 2Gb and 4Gb, 1GHz/DDR3-2133, Delivering Power Efficiency and Speed for High-Performance Networking and Graphics Segments (Tuesday Jun. 12, 2012)
  Micron today introduced a new class of 1GHz, 2-gigabit (Gb) and 4Gb, 30-nm DDR3 devices, strengthening the company's comprehensive DDR3 portfolio
  
  
• STMicroelectronics Secures Additional Sourcing for its Leading-Edge 28nm and 20nm FD-SOI Technology with GLOBALFOUNDRIES (Monday Jun. 11, 2012)
  STMicroelectronics announces that GLOBALFOUNDRIES has agreed to manufacture devices for ST using ST’s proprietary Fully Depleted Silicon-on-Insulator (FD-SOI) technology in both the 28nm and 20nm nodes.
  
  
• Newport Media Introduces World's Smallest, Lowest Power 802.11n Wi-Fi SoC (Monday Jun. 11, 2012)
  Newport Media today announced its first SoC product to address the wireless connectivity market. The NMC1000 is a Wi-Fi(R) SoC that includes all RF and Baseband circuitry required to provide IEEE 802.11b, g, n-compliant operation including all necessary power amplifiers and switches.
  
  
• Sequans Delivers 150 Mbps Category 4 LTE Throughput (Monday Jun. 11, 2012)
  Sequans Communications has achieved full category 4 LTE downlink throughput of 150 Mbps - the maximum category 4 rate - during interoperability testing with several major eNodeB and test equipment vendors.
  
  
• Mindspeed Announces High-Performance, Multi-Core ARM Cortex-A CPU-Based Communications Processor Family (Monday Jun. 11, 2012)
  
  
  
• Ensphere 10 Gbps Optical Transceiver Silicon Supports New Thunderbolt Active Optical Cables (Monday Jun. 11, 2012)
  Ensphere Solutions is pleased to report the first Thunderbolt™ active optical cables (AOC) are now entering the market using the Ensphere ESI-XVR10100 optical transceiver.
  
  
• Netronome Unveils 200 Gbps Flow Processor (Tuesday Jun. 05, 2012)
  Netronome today disclosed the details of the NFP-6xxx family of processors. The NFP-6xxx product line is the sixth generation of flow processors and is designed for high- performance networking applications that require programmable, line-rate, stateful processing on millions of simultaneous, complex flows
  
  
• Tiempo, Working with STMicroelectronics, Unveils First 32nm Clockless Test Chip (Friday Jun. 01, 2012)
  Tiempo, working closely with STMicroelectronics today announced the first fully clockless circuit in 32nm. The chip was fabricated as firsttime- right silicon, with all chip samples 100% functional.
  
  
• Renesas Electronics and TSMC Collaborate to Construct Ecosystem for Microcontrollers (Monday May. 28, 2012)
  Renesas and TSMC today announced that they have signed an agreement to extend their microcontroller (MCU) technology collaboration to 40 nanometer (nm) embedded flash (eFlash) process technology for manufacturing MCU products used in next-generation automotive and consumer applications such as home appliances.
  
  
• Samsung Now Producing Highest Density Mobile LPDDR2 Memory Using 20nm-class Technology - an Industry First (Monday May. 21, 2012)
  Samsung Electronics Co., Ltd., a global leader in advanced semiconductor technology solutions, announced today that it has begun producing the industry's first four gigabit (Gb), low power double-data-rate 2 (LPDDR2) memory using 20 nanometer (nm) class technology.
  
  
• Entropic Communications Unveils Next-Generation Set-Top Box System-on-a-Chip Solution for Cable and IP-Client Markets (Monday May. 14, 2012)
  Entropic Communications today introduced its latest generation of high-performance set-top box (STB) system-on-a-chip (SoC) solutions, offering cable and IP markets a dual-core ARM® Cortex-A9 processors with integrated NEON™ technology.
  
  
• STMicroelectronics Enters Production with New STM32 F0 Microcontrollers Targeting Budget Applications (Friday May. 11, 2012)
  With a dedicated Discovery Kit also available, and leveraging the extensive STM32 development ecosystem, engineers now have everything they need to use ST’s new microcontrollers featuring the ARM® Cortex™-M0 processor in cost-sensitive consumer and industrial products.
  
  
• MoSys Releases Carrier-Grade Bandwidth Engine IC to Production (Wednesday May. 09, 2012)
  MoSys today announced the production release of its first generation high-speed serial access Bandwidth Engine(R) IC product. The MSR576 device is optimized for high-data rate, high-access rate use in networking, video processing and compute acceleration applications and is supported by leading suppliers of FPGAs and ASICs.
  
  
• Intersil Introduces Next Generation 40nm Thunderbolt Solution (Wednesday May. 09, 2012)
  Intersil Corporation today unveiled its active cable solution specifically designed to support Thunderbolt cables. Intersil's active cable system solution includes the ISL37231 – the industry's first 40nm active cable IC – and the ISL80083 companion power management IC.
  
  
• Micron Announces Its First Fully Functional DDR4 DRAM Module (Tuesday May. 08, 2012)
  Micron today announced development of its first fully functional DDR4 DRAM module. The company has begun sampling and has received feedback from major customers to support quick implementation for applications in 2013.
  
  
• eASIC Enables 3X Increase in Energy Efficiency for Astrophysical Simulation Supercomputer (Wednesday May. 02, 2012)
  eASIC today announced that Tokyo Institute of Technology, in collaboration with Hitotsubashi University, has successfully demonstrated a 3X increase in energy efficiency for a green supercomputer used for performing astronomical simulations.