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Fabless / IDM News

• Accent Slashes Smart Meter Development Time With Its ASMgrid2 Kits And Standard Product Offering (Tuesday Mar. 06, 2012)
  
  
  
• LSI Sampling Industry's First 28nm System-on-a-Chip to Accelerate Delivery of Higher-Capacity Hard Disk Drives (Wednesday Feb. 29, 2012)
  LSI today announced it is sampling the industry's first 28nm SoC for the desktop and mobile HDD market segments. A critical piece of intelligence integrated into the new 28nm SoC is the LSI TrueStore RC5100, a 28nm read channel featuring third-generation LSI low-density parity check (LDPC) iterative decoding architecture.
  
  
• Silicon Labs Launches Industry's Most Flexible and Developer-Friendly 32-Bit Mixed-Signal MCUs (Wednesday Feb. 29, 2012)
  Silicon Laboratories today introduced the Precision32™ microcontroller (MCU) family. Based on the ARM® Cortex™-M3 processor, the new Precision32 family includes 32 SiM3U1xx and SiM3C1xx MCU products with footprint-compatible USB and non-USB options.
  
  
• Silicon Image GameChanger 60 GHz WirelessHD Reference Designs for Mobile Products Now Available (Monday Feb. 27, 2012)
  Silicon Image today announced the availability of the Silicon Image GameChanger™ 60 GHz WirelessHD™ low power reference designs for notebooks PCs, tablet computers, and smartphone accessories.
  
  
• Infineon's New ORIGA 2 Authentication Chip with MIPI BIF Standard Interface Protects Mobile Device Users Better Against Counterfeit Components (Monday Feb. 27, 2012)
  Infineon Technologies has added a product to the ORIGA™ family of authentication solutions: The new ORIGA™2 chip integrates a communication interface supporting the MIPI BIF standard defined by the MIPI Alliance. MIPI BIF (Battery Interface) is the first standardized single-wire interface for communication between the mobile device and battery pack.
  
  
• eASIC Surpasses 3 Million Chips Shipped and is set to Double This in 2012 (Monday Feb. 27, 2012)
  eASIC today announced that it has shipped in excess of three million chips and achieving this shipment milestone firmly solidifies eASIC’s position as a high volume supplier of custom integrated circuits. eASIC expects to be at more than double that number of shipments by the end of 2012.
  
  
• Renesas Mobile Partners with NVIDIA to Deliver Next-Generation LTE Ultraphones (Friday Feb. 24, 2012)
  Renesas Mobile today announced a strategic relationship with NVIDIA to jointly develop a platform reference solution based on Renesas Mobile's world-leading SP2531 triple mode LTE modem and the NVIDIA® Tegra® 3 processor, the world's first quad-core mobile processor.
  
  
• K-micro to Sample IEEE 1901 Compliant, Single Chip HD-PLC for 240Mbps High-Speed Power Line Communications (Wednesday Feb. 22, 2012)
  K-micro announced that it will be sampling the lowest power single chip HD-PLC next month. Fully compliant with the IEEE 1901 standard, the chip will give customers high performance in a very small form factor, enabling easy integration into communications adapters and a variety of other network devices such as multimedia equipment and cameras.
  
  
• Tabula Confirms Move to Intel's 22nm Process Featuring 3-D Tri-Gate Transistors (Tuesday Feb. 21, 2012)
  Tabula today confirmed previous speculation that it is implementing a family of 3PLD products manufactured by Intel using its advanced 22nm manufacturing process featuring 3-D Tri-Gate transistors and co-optimized packaging technology.
  
  
• Renesas Mobile Introduces First Integrated LTE Triple-Mode Platform Optimised for Full-Featured, High Volume Smartphones (Wednesday Feb. 15, 2012)
  Renesas Mobile today announced the availability of the MP5232, the first single-chip, high-performance, scalable smartphone platform optimised to address the US$150-300 range device market.
  
  
• Nethra Imaging Introduces Ultra-Low-Power High Definition 1080p60 Visual and Computing Platform System-on-Chip (Friday Feb. 03, 2012)
  Fully hardware accelerated visual and computing platform SoC delivers High Definition 1080p60 video and multi-Mega-Pixel image capture and streaming with near-zero latency. High Definition H.264 CODEC enables new form-factor visual solutions while setting a new bar for cost and power.
  
  
• Triad Semi Introduces Three New Via Configurable ASIC Arrays (Thursday Feb. 02, 2012)
  Three new via configurable arrays extend the solution space for mixed signal designers looking to integrate a wide range of analog circuits, digital logic, ADCs, and DACs onto a single chip with the industry’s lowest development cost. Customers can implement sophisticated new designs on these configurable arrays in three to six months.
  
  
• Tilera Leaps Forward with the Breakthrough TILE-Gx Family, Design Wins and Welcomes Back Co-Founder as CEO (Monday Jan. 30, 2012)
  Tilera today announced several significant steps for the company including the immediate general availability of two of its highly anticipated, low-power, high-performance 64-bit processors – TILE-Gx36™ and TILE-Gx16™ – as well as companion evaluation systems.
  
  
• Startup proposes processor on DRAM process (Thursday Jan. 26, 2012)
  Venray Technology Ltd. (Dallas, Texas) has proposed building a small microprocessor on a DRAM process to save power.
  
  
• Elpida Memory Develops Resistance RAM Prototype (Thursday Jan. 26, 2012)
  Elpida today announced the development of its first-ever high-speed non-volatile resistance memory (ReRAM) prototype. As the ReRAM prototype was made using a 50-nm process technology it has a memory cell array operation of 64 megabits, one of the highest densities possible for ReRAM.
  
  
• Samsung Mass Producing Highly Efficient Embedded Multi-Chip Memory for Entry-level Smartphones (Friday Jan. 20, 2012)
  Samsung announced today that it started producing embedded multi-chip package (eMCP) memory for use in the rapidly expanding market segment for entry- to mid-level smartphones. Samsung's new eMCP solutions come in a wide range of densities, utilizing LPDDR2 DRAM made with 30-nm process technology and NAND flash memory using 20-nm technology.
  
  
• BiTMICRO and Global Unichip Fabricate Revolutionary Solid State Drive Controller (Tuesday Jan. 17, 2012)
  BiTMICRO Networks, a manufacturer of high-end enterprise Solid State Drive (SSD) technologies and Global Unichip Corporation (GUC), the Flexible ASIC Leader, have successfully taped out a third generation SSD controller. Dubbed as TALINO™-DE (Translation and Linking of I/O Nodes -Device Edition), this multi-core SSD controller provides high-speed data transfer between host and storage device.
  
  
• Scaleo chip and ARM Address the Need for Cleaner, More Energy-efficient Automotive Solutions (Monday Jan. 16, 2012)
  Scaleo chip today announced that the company has entered into an agreement with ARM to combine the ARM® Cortex™-R5 MPCore™ processor with Scaleo chip technologies into OLEA, Scaleo chip's new family of microcontrollers optimized for powertrain systems.
  
  
• Toshiba Introduces Super Speed USB 3.0-Compliant USB Flash Memory (Monday Jan. 09, 2012)
  This week at CES 2012, Toshiba TAEC, will be demonstrating the latest additions to its lineup of flash memory offerings - the TransMemory-EX™ series of USB flash memory products. The new drives are compliant with the new USB 3.0 standards - known as Super Speed USB . Initial storage capacities include a 32GB model and a 64GB model.
  
  
• Cypress Announces USB-IF Certification of SuperSpeed USB 3.0 Controllers (Friday Jan. 06, 2012)
  Cypress Semiconductor today announced USB-IF certification of its two SuperSpeed USB Peripheral Controllers: EZ-USB® FX3 (CYUSB3014) and West Bridge® Benicia (CYWB0263BB). Both of these peripheral controllers are in full production now.
  
  
• Toshiba NAND Solutions Address Growing Demand for Error Correction (Thursday Jan. 05, 2012)
  Toshiba TAEC today announced the development of a versatile, multi-application single level cell (SLC) NAND flash memory with embedded error correction code (ECC).
  
  
• ASIX Releases the World's First Single-Chip USB 3.0 to Gigabit Ethernet Controller (Monday Jan. 02, 2012)
  ASIX Electronics Corp., a fabless semiconductor company for embedded networking/bridging solutions, announced today the AX88179, the world’s first USB 3.0 to Gigabit Ethernet controller which integrates USB 3.0 PHY and 10/100/1000Mbps Gigabit Ethernet MAC/PHY in a single chip.
  
  
• Genesys Logic Announced the World's First USB 3.0 Webcam Controller GL3620 (Tuesday Dec. 27, 2011)
  Genesys Logic today announced its world first USB3.0 Isochronous webcam controller chip GL3620. The availability of GL3620 answers the requests for 5.0Gbps USB 3.0 Isochronous applications.
  
  
• LSI Announces Industry's First 28nm Read Channel for Hard Disk Drive Manufacturers (Thursday Dec. 22, 2011)
  LSI Corporation today announced that it is demonstrating to OEM customers the TrueStore® RC5100 read channel for hard disk drives (HDD).
  
  
• Onkyo and Silicon Image Announce the World's First A/V Receivers Featuring InstaPrevue and MHL Technologies (Thursday Dec. 22, 2011)
  Silicon Image and Onkyo today announced the world's first line of Audio/Video Receivers (AVRs) featuring Silicon Image's InstaPrevue™ technology and MHL™ (Mobile High-Definition Link) technology.
  
  
• Broadcom Announces Industry's First CMOS 40G PHY for Long Haul Optical Transport (Wednesday Dec. 21, 2011)
  Broadcom today announced its next generation 40G physical layer transceiver (PHY) chipset, designed to address the need for higher bandwidth and lower power in Optical Transport Networks (OTN).
  
  
• K-micro samples new Frame Rate Converter LCD Timing Controller for large-size LCD TV market (Wednesday Dec. 14, 2011)
  Kawasaki Microelectronics has released samples of its new Frame Rate Converter LCD Timing Controller product (FRC T-Con), dubbed VFRC-A1, for the large-size LCD TV market. Mass production will begin in Q2, 2012.
  
  
• e2v and SP Devices working together to deliver the ultimate in high-performance ADC solutions (Tuesday Dec. 13, 2011)
  e2v and SP Devices today announced their collaboration in the provision of high-performance Analogue-to-Digital (ADC) solutions.
  
  
• Triad Semiconductor Introduces the World's Smallest High Voltage Via Configurable Array (Thursday Dec. 08, 2011)
  Triad’s newest via configurable array, VCA-12, packs 3,900 mixed-signal resources into a die that can easily fit into small SOIC and QFN packages for size and price sensitive applications
  
  
• Intel, Micron Extend NAND Flash Technology Leadership With Introduction of World's First 128Gb NAND Device and Mass Production of 64Gb 20nm NAND (Wednesday Dec. 07, 2011)
  The new 20nm 128Gb MLC NAND device doubles the storage capacity and performance of the companies' existing 20nm 64Gb NAND device.