D&R Headline News | Most Popular | SoC News Alerts | |

Fabless / IDM News

• OmniVision Announces Its First 64 Megapixel, 0.8 Micron Image Sensor (Tuesday Feb. 18, 2020)
  OmniVision Technologies today announced the OV64C, its first 64 megapixel (MP) image sensor featuring a 0.8 micron pixel size to enable high resolution smartphone cameras in a 1/1.7" optical format.
  
  
• Eta Compute Announces Production Silicon of the World's Most Energy-efficient Edge AI Processor (Thursday Feb. 13, 2020)
  Eta Compute Inc., a company dedicated to delivering machine learning to mobile and edge devices using its revolutionary new platform, announces the first shipment of production silicon for its ECM3532, the world’s first AI multicore processor for embedded sensor applications.
  
  
• XMOS announces world's lowest cost, most flexible AI processor (Thursday Feb. 13, 2020)
  XMOS today announces xcore.ai — its new, disruptive crossover processor for the AIoT market, which delivers high-performance AI, DSP, control and IO in a single device with prices from $1.
  
  
• EnSilica to Develop Next-Generation Ka Band Satellite Transceivers for the European Space Agency (Monday Feb. 10, 2020)
  EnSilica, a leading provider of custom ASIC design and supply services has announced it is developing a single-chip Ka band transceiver IC for the European Space Agency. The mmWave IC will form a key component of next-generation, low-cost hybrid automotive communication terminals – enabling vehicles to always be connected.
  
  
• Xilinx Adds Advanced Machine Learning Capabilities for Pro AV and Broadcast Platforms (Monday Feb. 10, 2020)
  Xilinx today announced a range of new and advanced machine learning (ML) capabilities for Xilinx devices targeted at the professional audio/video (Pro AV) and broadcast markets
  
  
• GigaDevice Launches the New GD32E232 Series of MCU's Featuring the Arm Cortex-M23 core for Embedded Systems (Wednesday Feb. 05, 2020)
  GigaDevice, an industry-leading semiconductor supplier (SSE code: 603986), officially released the GD32E232 microcontroller series based on the Arm® Cortex®-M23 core. The series is presently sampling and will officially move to mass production in February.
  
  
• Qualcomm Accelerates Autonomous Driving with New Platform - Qualcomm Snapdragon Ride (Wednesday Jan. 08, 2020)
  Snapdragon Ride aims to address the complexity of autonomous driving and ADAS by leveraging its high-performance, power-efficient hardware, industry-leading artificial intelligence (AI) technologies and pioneering autonomous driving stack to deliver a comprehensive, cost and energy efficient systems solution.
  
  
• OmniVision Announces 4K Video Processor with Industry's Lowest Power Consumption and HEVC Compression Capability for Battery-Powered Security and Surveillance Applications (Thursday Jan. 02, 2020)
  OmniVision Technologies today announced in advance of CES the OA805, a video processor that supports high-efficiency video coding (HEVC) compression with the lowest power consumption in the industry.
  
  
• GreenWaves Unveils Groundbreaking Ultra-Low Power GAP9 IoT Application Processor for the Next Wave of Intelligence at the Very Edge (Thursday Dec. 19, 2019)
  GAP9 combines architectural enhancements and an industry-leading Global Foundries 22nm FDX semiconductor process to deliver a peak cluster memory bandwidth of 41.6 GB/sec and up to 50 GOPS combined compute power at an overall power consumption of 50mW.
  
  
• MediaTek Announces Dimensity, World's Most Advanced 5G Chipset Family, & Dimensity 1000 5G SoC (Tuesday Nov. 26, 2019)
  MediaTek today unveiled Dimensity, MediaTek’s family of powerful 5G system-on-chips (SoCs) offering an unrivaled combination of connectivity, multimedia, AI and imaging innovations for premium and flagship smartphones.
  
  
• MediaTek and Intel Partner to Bring 5G Connectivity to the Next Generation of PCs (Monday Nov. 25, 2019)
  MediaTek today announced it is partnering with Intel to bring MediaTek’s new 5G modem to PCs. Through this partnership, Intel has been working with MediaTek on the 5G solution for deployment in key consumer and commercial laptop segments.
  
  
• Gyrfalcon's New Chip Raises Bar (12.6 TOPS/W) on High Performance Edge AI with Lower Power Use (Friday Nov. 15, 2019)
  Gyrfalcon Technology Inc.’s introduces its AI Accelerator Chip, the Lightspeeur® 5801, which raises the bar for high performance Edge AI with low energy use.
  
  
• Nordic Semiconductor unveils world's first dual Arm Cortex-M33 processor wireless SoC for the most demanding low power IoT applications (Thursday Nov. 14, 2019)
  The nRF5340 combines a high performance application processor with a fully programmable, ultra low power network processor, plus advanced root-of-trust and trusted execution security features, into a low power multiprotocol SoC ready for professional lighting, industrial automation, advanced wearables, and other complex IoT applications
  
  
• FlexIC Foundry enables custom flexible integrated circuit design (Thursday Nov. 14, 2019)
  PragmatIC has developed a unique, patented semiconductor device platform that provides the opportunity to invent entirely new applications for electronics: as well as being ultra-low cost, it is also ultra-thin and flexible, and can be easily combined with other thin film electronic components to create novel solutions.
  
  
• Gyrfalcon Technology and Sensory Deliver Enhanced AI Biometric Access on Edge Devices (Thursday Nov. 14, 2019)
  AI accelerator chip and technology provider Gyrfalcon Technology Inc. today announced a partnership with AI solution provider Sensory to deliver low latency, high reliability embedded, machine learning capabilities on edge devices.
  
  
• Renesas Electronics Unveils RA Family of 32-Bit Arm Cortex-M Microcontrollers with Superior Performance and Advanced Security for Intelligent IoT Applications (Wednesday Oct. 09, 2019)
  Renesas Electronics today unveiled the Renesas Advanced (RA) Family of 32-bit Arm® Cortex®-M microcontrollers (MCUs). RA MCUs deliver the ultimate combination of optimized performance, security, connectivity, peripheral IP, and easy-to-use Flexible Software Package (FSP) to address the next generation of embedded solutions.
  
  
• NXP Launches the GHz Microcontroller Era (Thursday Oct. 03, 2019)
  NXP Semiconductors N.V. today announced the i.MX RT1170 family of crossover MCUs that combines unprecedented performance, reliability, and high levels of integration to propel industrial, IoT and automotive applications.
  
  
• Adesto Reaches Shipment Milestone of One Billion Non-Volatile Memory Devices (Thursday Sep. 26, 2019)
  Adesto Technologies Corporation (NASDAQ: IOTS), a leading provider of innovative application-specific semiconductors and systems for the IoT, announced it has now shipped more than one billion units of its non-volatile memory (NVM) products.
  
  
• Kandou Announces Development of USB4 Retimer (Monday Sep. 09, 2019)
  Kandou, a global leader in ultra-low power SerDes technology, has announced development is underway for the industry’s first USB-C® multi-protocol retimer solution with USB4™ support.
  
  
• GigaDevice unveils the GD32V series with RISC-V core, in a brand new 32bit general purpose microcontroller (Tuesday Aug. 27, 2019)
  GigaDevice Semiconductor launches the world’s first open source RISC-V based GD32V series 32-bit general-purpose MCU products. GigaDevice provides a complete tool chain support from MCU chips to software libraries and development boards; therefore, creating a strong RISC-V development ecosystem.
  
  
• Adesto's FT 6050 Smart Transceiver Now Natively Supports both LonWorks and BACnet Protocols (Monday Aug. 12, 2019)
  Adesto Technologies announced that its FT 6050 Smart Transceiver system-on-chip (SoC) now natively supports LON®, LON/IP, BACnet/IP and BACnet MS/TP protocol stacks
  
  
• Kalray announces the Tape-Out of Coolidge on TSMC 16NM process technology (Thursday Aug. 01, 2019)
  Kalray today announced the tape-out of MPPA3 aka Coolidge™, its third generation of unique and patented MPPA® («Massively Parallel Processor Array») processor family, on TSMC 16nm FinFET process technology.
  
  
• Samsung Begins Mass Production of Industry's First 12Gb LPDDR5 Mobile DRAM for Premium Smartphones (Tuesday Jul. 23, 2019)
  Samsung Electronics Co., Ltd., the world leader in advanced memory technology, today announced that it has begun mass producing the industry’s first 12-gigabit (Gb) LPDDR5 mobile DRAM, which has been optimized for enabling 5G and AI features in future smartphones.
  
  
• Aspinity Enables 10x Less Power for Always-on Sensing (Wednesday Jun. 26, 2019)
  Aspinity today announced its Reconfigurable Analog Modular Processor (RAMP) platform, an ultra-low power, analog processing platform that overcomes the power and data handling challenges in battery-operated, always-on sensing devices for consumer, smart home, Internet of Things (IoT), industrial and other markets.
  
  
• Xilinx Hits Milestone with First Customer Shipments of Versal ACAP (Tuesday Jun. 18, 2019)
  Versal is the industry's first adaptive compute acceleration platform (ACAP), a revolutionary new category of heterogeneous compute devices with capabilities that far exceed those of conventional CPUs, GPUs, and FPGAs.
  
  
• Everspin Enters Pilot Production Phase for the World's First 28 nm 1 Gb STT-MRAM Component (Wednesday Jun. 12, 2019)
  Everspin Technologies today announced it has completed development activity and entered the pilot production phase of its 28 nm 1-Gigabit (Gb) Spin Torque Transfer Magnetoresistive Random Access Memory (STT-MRAM) product.
  
  
• MediaTek Unveils Groundbreaking New 5G SoC for First Wave of 5G Flagship Devices (Wednesday May. 29, 2019)
  The integrated 5G chipset, with the MediaTek Helio M70 5G modem built in, packs world-leading technology into its compact design. It includes Arm’s newest Cortex-A77 CPU, Mali-G77 GPU and MediaTek’s most advanced AI processing unit (APU) to meet the power and performance demands of 5G to deliver super fast connectivity and extreme user experiences.
  
  
• AI Chipmaker Hailo Releases Industry-Leading Deep Learning Processor (Wednesday May. 15, 2019)
  Hailo released today the Hailo-8, the world’s top performing deep learning processor. Hailo is now sampling its breakthrough chip with select partners across multiple industries, with a focus on automotive.
  
  
• ZTE Selects Intel's eASIC Devices for 5G Wireless Deployment (Wednesday May. 01, 2019)
  Intel today announced that ZTE*, a multinational telecommunications equipment and systems company, selected Intel® eASIC™ devices for its 5G wireless products*. ZTE selected Intel eASIC devices to meet the critical cost and power requirements demanded by large-scale 5G deployments.
  
  
• DynapCNN - the World's First 1M Neuron, Event-Driven Neuromorphic AI Processor for Vision Processing (Friday Apr. 12, 2019)
  Today aiCTX AG is announcing its new fully-asynchronous event-driven neuromorphic AI processor for ultra-low power, always-on, real-time applications. DynapCNN opens brand-new possibilities for dynamic vision processing, bringing event-based vision applications to power-constrained devices for the first time