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Fabless / IDM News

• Atmosic Technologies Extends Controlled Energy Harvesting Technology to Harness Photovoltaic Power for IoT Device Connectivity (Wednesday Mar. 27, 2019)
  Atmosic™ Technologies, innovator of ultra-low-power wireless for the Internet of Things (IoT), today announced its photovoltaic-powered connectivity solution that dramatically extends the battery life of IoT devices.
  
  
• Samsung Develops Industry's First 3rd-generation 10nm-Class DRAM for Premium Memory Applications (Thursday Mar. 21, 2019)
  Samsung today announced that it has developed a 3rd-generation 10-nanometer-class (1z-nm) eight-gigabit (Gb) Double Data Rate 4 (DDR4) DRAM for the first time in the industry.
  
  
• Samsung Electronics Starts Commercial Shipment of eMRAM Product Based on 28nm FD-SOI Process (Thursday Mar. 07, 2019)
  Samsung Electronics the world leader in semiconductor technology, today announced that it has commenced mass production of its first commercial embedded magnetic random access memory (eMRAM) product based on the company’s 28-nanometer(nm) fully-depleted silicon-on-insulator (FD-SOI) process technology, called 28FDS.
  
  
• AIStorm Introduces Real-Time AI-in-Sensor Solutions for Driver Assistance, Mobile Handsets, Cameras, and IoT (Tuesday Feb. 26, 2019)
  Due to its unique charge-domain processing architecture, AIStorm can outperform digital GPU-based solutions, delivering edge-ready solutions at 5x to 10x lower cost; available today are market-ready solutions optimized for mobile handsets, IoT, and ADAS
  
  
• Syntiant Brings Speech Interfaces to the Edge With New Ultra-Low-Power Neural Decision Processors (Monday Feb. 25, 2019)
  Syntiant today introduced its Syntiant™ NDP100™ and Syntiant NDP101™ microwatt-power Neural Decision Processors™ (NDPs) for always-on voice and sensor applications at the 2019 Mobile World Congress in Barcelona, Spain.
  
  
• Qualcomm Unveils World's Most Advanced Commercial Multimode 5G Modem to Accelerate Global 5G Rollout (Tuesday Feb. 19, 2019)
  Qualcomm today announced the Snapdragon X55 5G modem, its second-generation 5G New Radio (NR) modem. Snapdragon X55 is a 7-nanometer single-chip integrated 5G to 2G multimode modem that supports 5G NR mmWave and sub-6 GHz spectrum bands with up to 7 gigabits per second (Gbps) download speeds and 3 Gbps upload speeds over 5G, and Category 22 LTE with up to 2.5 Gbps LTE download speeds.
  
  
• Renesas Electronics Develops 28nm MCU with Virtualization-Assisted Functions for Next-Generation Automotive Architectures (Tuesday Feb. 19, 2019)
  Renesas Electronics today announced the development and successful operation verification of an automotive test chip as a technological stepping stone toward the realization of next-generation automotive-control flash Microcontrollers (MCUs) employing a 28 nanometer (nm) low-power process.
  
  
• First Battery-Free Bluetooth Sticker Sensor Tag Demonstrated at NRF (Thursday Jan. 17, 2019)
  Amazon Web Services, Avery Dennison and Samsung join Wiliot’s original investor group for a $30 Million Series B Funding Round, anticipating a future where paper thin battery-free Bluetooth sensors connect people with packaging and products.
  
  
• Everspin Ships the World's First Pre-Production 28 nm 1 Gb STT-MRAM Customer Samples (Wednesday Jan. 09, 2019)
  Everspin Technologies today announces that it commenced shipment of pre-production customer samples of its 28 nm 1-Gigabit (Gb) Spin Torque Transfer Magnetoresistive Random Access Memory (STT-MRAM) product in December 2018.
  
  
• Huawei Unveils Industry's Highest-Performance ARM-based CPU Bringing Global Computing Power to Next Level (Monday Jan. 07, 2019)
  Today, Huawei announced the industry's highest-performance Advanced RISC Machine (ARM)-based CPU. Called Kunpeng 920, the new CPU is designed to boost the development of computing in big data, distributed storage, and ARM-native application scenarios.
  
  
• Toshiba Unveils 130nm FFSA Development Platform Featuring High Performance, Low Power and Low Cost Structured Array (Tuesday Nov. 20, 2018)
  Toshiba Electronic Devices & Storage Corporation (“Toshiba”) today announced a new 130nm manufacturing process node based FFSA™ (Fit Fast Structured Array), an innovative custom SoC development platform featuring high performance, low cost and low power consumption.
  
  
• Micron and Achronix Deliver Next-Generation FPGAs Powered by High-Performance GDDR6 Memory for Machine Learning Applications (Wednesday Nov. 14, 2018)
  Micron Technology, Inc., (Nasdaq:MU) today announced that its GDDR6 memory, Micron's fastest and most powerful graphics memory, will be the high-performance memory of choice supporting Achronix's next-generation stand-alone FPGA products built on TSMC 7nm process technology.
  
  
• AMD Unveils World's First 7nm Datacenter GPUs (Wednesday Nov. 07, 2018)
  AMD Radeon Instinct™ MI60 and MI50 accelerators with supercharged compute performance, high-speed connectivity, fast memory bandwidth and updated ROCm open software platform power the most demanding deep learning, HPC, cloud and rendering applications
  
  
• Kazan Networks Announces NVMe-oF ASIC Production Release (Monday Oct. 29, 2018)
  Kazan Networks today announced the release of its Fuji NVMe-oF™ Bridge ASIC to volume production in December 2018, along with its companion Onyx Bridge Adapter.
  
  
• NovuMind Releases Details of Breakthrough AI Chip (Thursday Oct. 25, 2018)
  NovuMind Inc., a leading innovator in full-stack Artificial Intelligence technologies, today released performance details of its NovuTensor AI chip, with class-leading power efficiency.
  
  
• Atmosic Technologies Introduces Innovative Wireless Platforms to Drive Battery-Free Internet of Things (Thursday Oct. 25, 2018)
  Atmosic™ Technologies, innovator of ultra-low-power wireless for the Internet of Things (IoT), today launched the industry’s lowest power wireless Bluetooth 5 platforms, comprising its inaugural M2 and M3 series, to enable IoT devices to be “Forever Connected, Anywhere.”
  
  
• Cypress Delivers Smart, Fail-Safe Storage Platform Leveraging Arm Processor for Enhanced Safety and Reliability (Wednesday Oct. 24, 2018)
  Cypress today announced that it has embedded compute capabilities into its next-generation memory platform to address the growing demand for trusted intelligence and fail-safe storage in applications such as Advanced Driver Assistance Systems (ADAS) and smart factories.
  
  
• Socionext Develops World's First HDMI 2.1 Compatible Video Processing Chips (Monday Oct. 15, 2018)
  Socionext Inc. has developed its new "HV5 series", a family of the world's first HDMI 2.1 compatible video processing ICs, designed for transmission and reception of 8K video.
  
  
• Innosilicon announces the World Best BTC Miner T2T+32T for shipment, 68W/TH (Monday Sep. 17, 2018)
  Innosilicon, the industry leader of all coin crypto mining ASICs, launches another heavy weight BTC miner, the single tube T2Turbo+32T (can run up to 36T), after successfully delivering the T2T-24T miner since July
  
  
• Nuvoton Launches NuMicro M2351 Series TrustZone Empowered Microcontroller Focusing on IoT Security (Thursday Sep. 13, 2018)
  Since security and power consumption are the key requirements of IoT application, Nuvoton launches the NuMicro M2351 Series, which excels in supporting the proliferation of intelligent connected devices.
  
  
• BrainChip Announces the Akida Architecture, a Neuromorphic System-on-Chip (Monday Sep. 10, 2018)
  BrainChip, the leading neuromorphic computing company, today establishes itself as the first company to bring a production spiking neural network architecture – the Akida Neuromorphic System-on-Chip (NSoC) – to market.
  
  
• Huawei Launches Kirin 980, the World's First Commercial 7nm SoC (Tuesday Sep. 04, 2018)
  As the world’s first commercial SoC manufactured with TaiwanSemiconductor Manufacturer Company’s (TSMC) 7nm process, Kirin 980 combines best-in-class performance, efficiency, connectivity features,and Dual NPU AI processing power.
  
  
• Microsemi Announces Sampling of Industry's Highest Performing Enterprise Gen 4 PCIe Controller (Thursday Aug. 02, 2018)
  Microsemi Corporation, a wholly owned subsidiary of Microchip Technology Inc. (Nasdaq: MCHP), today announced its new Flashtec™ NVMe 3016 Gen 4 PCIe controller is now sampling to early adopter customers.
  
  
• Innosilicon's Bitcoin ASIC powered by Samsung's Low Power FinFET technology to achieve record breaking performance (Tuesday Jul. 31, 2018)
  Innosilicon, designer of the industry leading crypto currency mining ASIC products, today announced that it has achieved a industry record breaking performance in its Terminator Sha256 Bitcoin mining ASIC series, utilizing Samsung Foundry’s advanced low-power FinFET technology.
  
  
• Optimum Semiconductor Unveils New Image Recognition SoC (Tuesday Jun. 26, 2018)
  Optimum Semiconductor Technologies, Inc., a fabless semiconductor company providing highly-integrated Systems on Chips (SoCs) for China's thriving electronics markets, announced the GP8300 SoC.
  
  
• Socionext Develops AI Accelerator Engine Optimized for Edge Computing (Monday May. 14, 2018)
  Socionext Inc., a leading provider of SoC-based solutions, has developed a new Neural Network Accelerator (NNA) engine, optimized for AI processing on edge computing devices. The compact, low power engine has been designed specifically for deep learning inference processing.
  
  
• QuickLogic Launches Comprehensive QuickAI Platform for Endpoint AI Applications (Monday May. 07, 2018)
  QuickLogic today announced the launch of its QuickAI™ platform for endpoint Artificial Intelligence (AI) applications. The new QuickAI platform provides an all-inclusive low power solution and development environment to economically incorporate the benefits of AI in endpoint applications.
  
  
• Spin Transfer Technologies Announces Breakthrough MRAM Technology for SRAM and DRAM Applications (Monday Apr. 30, 2018)
  Spin Transfer Technologies today announced results of its unique Precessional Spin Current (PSC™) structure. The results from advanced testing of the PSC structure confirm that it will increase the spin-torque efficiency of any MRAM device by 40-70 percent — enabling dramatically higher data retention while consuming less power.
  
  
• Omnitek adds AV over IP and video warp Chipsets (Monday Mar. 26, 2018)
  Omnitek will be adding AV over IP and video warp Chipset solutions to its Design Services and FPGA IP-cores at the National Association of Broadcasters’ April 2018 show in Las Vegas NV, giving equipment manufacturers more access to the company’s expertise in 4K and higher resolution video designs.
  
  
• GreenWaves Technologies Unveils GAP8, the Industry's Lowest Power IoT Application Processor, Enabling Groundbreaking Embedded Artificial Intelligence at the Very Edge (Wednesday Feb. 28, 2018)
  GreenWaves Technologies today announced its GAP8 IoT application processor and the availability of the GAP8 Software Development Kit.