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Fabless / IDM News

• Single-Chip Custom Solutions for the IoT Edge (Tuesday Feb. 27, 2018)
  S3 Semiconductors, announced today the introduction of its SmartEdgeTM Platform, giving its customers access to cost-optimized, custom single-chip solutions that put performance right at the edge of the IoT.
  
  
• Dream Chip Technologies Demonstrates Superior Power Efficiency with Automotive Driver Assistance SoC on GLOBALFOUNDRIES 22FDX Technology (Monday Feb. 26, 2018)
  Dream Chip Technologies announced today record power efficiency of its ADAS System-on-Chip (SoC) for automotive computer vision applications, fabricated on GLOBALFOUNDRIES 22FDX® semiconductor process at the foundry’s Fab 1 facility in Dresden, Germany.
  
  
• Sequans Introduces New NB-IoT Only Platform: Monarch N (Monday Feb. 26, 2018)
  Sequans Communications today introduced Monarch N, an NB-IoT platform designed and optimized for pure NB-IoT operation to enable massive IoT deployment. Monarch N is a single-chip LTE Cat NB1/NB2 platform, compliant with 3GPP release 14/15 of the LTE Advanced Pro standard.
  
  
• Everspin Begins 40nm STT-MRAM Volume Production (Wednesday Jan. 17, 2018)
  Everspin today announced the Company recorded revenue for its first 40nm 256Mb STT-MRAM products in the fourth quarter of 2017 and is in the process of ramping its volume production in 2018.
  
  
• BaySand expands its "Programmable-In-ASIC" initiative with Efinix Quantum programmable accelerator technology (Tuesday Jan. 09, 2018)
  BaySand Inc., the leader in configurable Standard Cell ASIC solutions, today announced a partnership with Efinix to deliver Efinix’s Quantum programmable accelerator technology in BaySand’s ASIC/SoC platform, with optional design service.
  
  
• Broadcom Ships Tomahawk 3, Industry's Highest Bandwidth Ethernet Switch Chip at 12.8 Terabits per Second (Tuesday Dec. 19, 2017)
  Broadcom today announced that it has delivered the StrataXGS® Tomahawk® 3 switch series, demonstrating an unprecedented 12.8 Terabits/sec of Ethernet switching performance in a single device -- double the bandwidth of any other switch silicon available in the market today.
  
  
• Esperanto Technologies Plans Energy-Efficient Chips for Artificial Intelligence and Machine Learning, based on the open RISC-V standard (Wednesday Nov. 29, 2017)
  Esperanto Technologies president and CEO Dave Ditzel today made the first public disclosure of Esperanto’s development of energy-efficient computing solutions for Artificial Intelligence (AI) and Machine Learning applications based on the open-standard RISC-V Instruction Set Architecture (ISA).
  
  
• Socionext Starts Offering Graphics IP "SEERIS" (Tuesday Nov. 14, 2017)
  Socionext today announced that the company has integrated an IP from its highperformance graphics engine. The "SEERIS® graphics engine IP”, which has been proven on its SoC products, is now being offered to its ASIC customers, as well as customers who develop their own SoCs.
  
  
• SiTune Offers Production Samples of Industry's First Tuner Supporting Japan's 8K TV Satellite Standard (Tuesday Nov. 14, 2017)
  SiTune Offers Production Samples of Industry's First Tuner Supporting Japan's 8K TV Satellite Standard
  
  
• MegaChips Unveils Breakthrough 16nm Analog ASIC for 5G and Other High-Speed Applications (Tuesday Nov. 07, 2017)
  MegaChips today announced a new 16nm FinFET analog ASIC with integrated Gigabit-class data converters designed to meet the cost and performance demands of 5G networks and other high-volume applications.
  
  
• asicNorth announces immediate availability of its IoT Endpoint ASIC Platform (Wednesday Oct. 25, 2017)
  asicNorth is pleased to announce immediate availability of its silicon proven platform to rapidly deploy IoT Endpoint ASICs – IoTa. Samples are available for prototype development.
  
  
• Bitmain Introduces Its First Hardware for Accelerating Artificial Intelligence (AI) Applications (Wednesday Oct. 25, 2017)
  Today, Bitmain announced its first products for accelerating artificial intelligence (AI) applications, applying its industry-leading expertise in Bitcoin mining hardware and system design
  
  
• Gridbee Launches First FSK & OFDM Sub-GHz System-On-Chip compliant IEEE 802.15.4g/u/v for Smart Grid, Smart Cities and Industrial IoT Applications (Thursday Sep. 28, 2017)
  Gridbee Communications S.A.S. specialist in wireless communication IC development is pleased to announce the release of its GDB1000 SoC for Sub-GHz wireless communication solution and compliant with IEEE 802.15.4g/u/v.
  
  
• UPMEM Announces the First Processing In-Memory Chip Accelerating Big Data Applications (Monday Sep. 11, 2017)
  UPMEM, a fabless semiconductor startup company, announces UPMEM Processing In-Memory (PIM), the next generation hardware solution for data intensive applications in the datacenter, solving server-level efficiency and performance bottlenecks. UPMEM's programmer friendly acceleration technology is much awaited for by big data players as Moore's law is fading away.
  
  
• NFC Semicon sets a new standard for NFC Sensor Chip Solutions (Monday Sep. 04, 2017)
  NFC Semicon™ announce its 3rd generation NFC System-On-Chip Platform that comes with more interfaces and use possibilities than any other existing NFC transponder Chip.
  
  
• Socionext Partners with Advantech to Offer High-Density, Low-Cost Media Cloud Server Solutions (Thursday Aug. 31, 2017)
  Socionext Inc., a world leader in hardware HEVC encoding, and Advantech, creator of innovative video acceleration solutions, today announced a strategic partnership to provide live hardware transcoding solutions for the data center supporting MPEG2, AVC (H.264), and HEVC (H.265).
  
  
• New MediaTek Helio Chipsets Deliver Rich Features to Booming Mid-Range Market (Tuesday Aug. 29, 2017)
  MediaTek Inc. today introduced the newest members of the Helio chipset family, the Helio P23 and Helio P30 system-on-chips (SoCs). The new chipsets, designed to deliver performance and power efficiency, dual camera photography, dual SIM and dual 4G VoLTE capabilities, support the explosion of innovation in the mid market.
  
  
• Uniquify Announces Silicon Success for Latest Timing Controller (T-CON) for DTV (Wednesday Aug. 16, 2017)
  Uniquify, a fabless manufacturer of next generation SoCs for ultra resolution displays today announced silicon success for its latest Timing Controller SoC (T-CON) for ultra-high definition television.
  
  
• IntelliProp Announces Gen-Z Persistent Memory Controller Combining DRAM and NAND (Wednesday Aug. 09, 2017)
  IntelliProp announced today the IPA-PM185-CT, Gen-Z Persistent Memory Controller, code named "Cobra." This controller combines DRAM and NAND and sits on the Gen-Z fabric, not the memory bus.
  
  
• Everspin Announces Sampling of the World's First 1-Gigabit MRAM Product (Monday Aug. 07, 2017)
  Everspin Technologies, Inc. (NASDAQ: MRAM), has begun sampling its new 1-Gigabit Spin Torque Magnetoresistive Random Access Memory (ST-MRAM) with lead customers. This breakthrough product delivers a high-endurance, persistent memory with a DDR4- compatible interface.
  
  
• Rambus Launches JEDEC-Standard DDR4 NVRCD for Emerging NVDIMM Applications (Monday Jun. 19, 2017)
  Rambus Inc. (NASDAQ:RMBS) today announced the industry’s first production release of a JEDEC-standard persistent memory register clock driver (NVRCD) for use with DDR4 non-volatile dual in-line memory modules (NVDIMM).
  
  
• Kalray Announces the Release of its Third-Generation MPPA Processor "Coolidge" (Friday May. 26, 2017)
  Kalray, an industry leader in manycore technology, is proud to announce that it will launch the third-generation of its high performance MPPA® processor: the MPPA®3 Coolidge.
  
  
• eASIC and Comcores Announce Support for CPRI V7.0 (Monday May. 01, 2017)
  eASIC® Corporation, a fabless semiconductor company that delivers a custom integrated circuit (IC) platform (eASIC Platform), and Denmark Headquartered Comcores ApS, a specialized supplier of silicon intellectual property (SIP), today announced the support of CPRI V7.0 (CPRI Specification CPRI_v_7_0 v2015-10-09) for eASIC’s Nextreme-3S family.
  
  
• asicNorth enhances IoT Design EcoSystem with IoT Endpoint ASIC Platform (Friday Apr. 28, 2017)
  Building on the momentum of their IoT Design EcoSystem, asicNorth announced today the debut of an IoT Endpoint ASIC Platform to further accelerate the deployment of custom IoT endpoint devices for their customers.
  
  
• Toshiba Expands Line-up of ARM Cortex-M-Based Microcontrollers (Thursday Apr. 13, 2017)
  Toshiba Corporation's (TOKYO: 6502) Storage & Electronic Devices Solutions Company today announced the launch of “M3H group (2),” as the third product group in the TXZ™ Family of low-power, high-speed microcontrollers based on the ARM Cortex-M core. Sample shipments of the 24 products in the group will start in May with mass production scheduled to start in September.
  
  
• Socionext Develops Small, Low Power 4K/60p HEVC Codec (Tuesday Apr. 11, 2017)
  Socionext Inc., an emerging leader in advanced SoC based video and imaging solutions, today introduced the SC2M50, a new HEVC / H.265 Codec IC. Sample shipments will start in May 2017.
  
  
• NXP Announces ARM Cortex-M4-based MCU with Industry's Largest Embedded SRAM Memory, Optimized for Portable Devices (Wednesday Mar. 15, 2017)
  NXP Semiconductors N.V. (NASDAQ:NXPI) announced today its new Kinetis K27/K28 family of ARM® Cortex®-M4-based microcontrollers (MCUs) that uniquely address the growing requirements of portable display applications.
  
  
• Kalray Announces the Release of an Efficient Manycore Processing Solution Dedicated to Deep Learning (Tuesday Mar. 14, 2017)
  Rounding out its embedded technology offer, Kalray has expanded its processing capabilities to the world of artificial intelligence. The company is introducing a highly optimized deep learning solution targeting embedded applications like autonomous cars, avionics, drones, robotics and more.
  
  
• NXP Taps into FD-SOI Technology to Enable the Industry's Lowest Power General Purpose Applications Processors (Monday Mar. 13, 2017)
  NXP Semiconductors N.V. (NASDAQ:NXPI) is first to market with a new applications processor design that leverages Fully Depleted Silicon On Insulator (FD-SOI) technology to offer the industry’s lowest power consuming general-purpose processor.
  
  
• Everspin Expands MRAM Ecosystem with Xilinx FPGAs (Wednesday Mar. 08, 2017)
  Everspin Technologies, Inc., as the leading provider of MRAM solutions, today announced compatibility for its Spin Torque MRAM memory and Xilinx’s UltraScale™ FPGAs.