Foundries News
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GlobalFoundries Submits Applications for U.S. CHIPS and Science Act Funding (Monday Sep. 25, 2023)
GlobalFoundries (Nasdaq: GFS) (GF) announced today it has applied for U.S. CHIPS and Science Act Funding, with two full applications submitted to the CHIPS Program Office of the U.S. Department of Commerce.
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U.S. Government Awards GlobalFoundries New $3.1 Billion, 10-Year Contract for Secure Chip Manufacturing (Thursday Sep. 21, 2023)
With $3.1 billion spending ceiling, new 10-year contract provides U.S. Dept. of Defense an assured supply of securely manufactured semiconductors for use in the nation’s most sensitive applications
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GlobalFoundries Officially Opens US$4 Billion Expansion Facility in Singapore, Creating 1,000 New Jobs (Tuesday Sep. 12, 2023)
GlobalFoundries (NASDAQ: GFS) (GF) today announced the official opening of its US$4 billion (S$5 billion) expansion fabrication plant (“fab”) in Singapore.
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MediaTek Successfully Develops First Chip Using TSMC's 3nm Process, Set for Volume Production in 2024 (Thursday Sep. 07, 2023)
MediaTek and TSMC today announced that MediaTek has successfully developed its first chip using TSMC’s leading-edge 3nm technology, taping out MediaTek’s flagship Dimensity system-on-chip (SoC) with volume production expected next year.
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Intel Foundry Services and Tower Semiconductor Announce New US Foundry Agreement (Tuesday Sep. 05, 2023)
Intel Foundry Services (IFS) and Tower Semiconductor (Nasdaq: TSEM), a leading foundry for analog semiconductor solutions, today announced an agreement where Intel will provide foundry services and 300mm manufacturing capacity to help Tower serve its customers globally.
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GlobalFoundries Announces 9SW RFSOI Technology for Next-Generation Mobile and 5G Applications (Wednesday Aug. 30, 2023)
At its annual Technology Summit beginning today, GlobalFoundries (GF) (Nasdaq: GFS), announced advancements in the industry’s first RFSOI foundry solution manufactured on 300mm wafers.
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GlobalFoundries Enhances Technology Platforms to Enable Critical Applications for Next Generation Electric and Autonomous Vehicles (Wednesday Aug. 30, 2023)
At its annual Technology Summit beginning today, GlobalFoundries (GF) (Nasdaq: GFS), announced advancements for two of its technology platforms that will support the growing demand for the technologies needed for autonomous, connected and electrified vehicles.
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GlobalFoundries Unveils Key Innovations at Technology Summit 2023 (Monday Aug. 28, 2023)
At its annual Technology Summit beginning today, GlobalFoundries (Nasdaq: GFS), is spotlighting its differentiated technology advancements that are enabling more efficient deployment of power, more seamless connectivity and more intelligence that is driving innovation and enabling transformative products in the world’s most critical markets.
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SMIC: Resignation of Chairman of the Board and Executive Director Appointment of Chairman of the Board and Change of Authorised Representative (Monday Jul. 17, 2023)
Dr. Gao Yonggang (“Dr. Gao”), has resigned as the chairman of the Board, executive director of the Company and chairman of the nomination committee of the Board with effect from 17 July 2023 due to job adjustment.
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Samsung Electronics Unveils Foundry Vision in the AI Era at Samsung Foundry Forum 2023 (Wednesday Jun. 28, 2023)
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Intel Provides Update on Internal Foundry Model (Thursday Jun. 22, 2023)
Intel leaders told analysts and investors during a webinar Wednesday that its transition to a new internal foundry model will be a key enabler to achieving its stated cost savings goal of more than $8-10 billion exiting 2025.
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Lockheed Martin and GlobalFoundries Collaborate to Advance Innovation and Resiliency of Chips for National Security (Tuesday Jun. 13, 2023)
Lockheed Martin (NYSE: LMT) and GlobalFoundries (Nasdaq: GFS) (GF) today announced a strategic collaboration to advance U.S. semiconductor manufacturing and innovation and to increase the security, reliability and resiliency of domestic supply chains for national security systems.
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TSMC Announces the Opening of Advanced Backend Fab 6, Marking a Milestone in the Expansion of 3DFabric™ System Integration Technology (Friday Jun. 09, 2023)
TSMC (TWSE: 2330, NYSE: TSM) today announced the opening of its Advanced Backend Fab 6, the Company’s first all-in-one automated advanced packaging and testing fab to realize 3DFabric™ integration of front-end to back-end process and testing services.
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GlobalFoundries and STMicroelectronics Finalize Agreement for New 300mm Semiconductor Manufacturing Facility in France (Monday Jun. 05, 2023)
GlobalFoundries and STMicroelectronics announced today the conclusion of the agreement to create a new, jointly-operated, high-volume semiconductor manufacturing facility in Crolles (France), which was announced on 11 July 2022.
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Intel Foundry Services Ushers in a New Era (Wednesday May. 31, 2023)
In April, Intel Foundry Services (IFS) and Arm announced a multigenerational agreement to enable chip designers to build low-power compute system-on-chip (SoCs) on Intel technology. We are excited to provide our customers with the opportunity to design their mobile SoCs on Intel’s leading-edge 18A process technology paired with the latest, most powerful Arm CPU core — the recently launched next-generation Cortex-X4 — for improved power and performance.
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U.S. Government Accredits GlobalFoundries to Manufacture Trusted Semiconductors at New York Facility (Tuesday May. 30, 2023)
The U.S. Department of Defense (DoD), through the Defense Microelectronics Activity (DMEA), Trusted Access Program Office (TAPO), has accredited GlobalFoundries’ (Nasdaq: GFS) (GF) advanced manufacturing facility in Malta, New York, as a Category 1A Trusted Supplier with the ability to manufacture secure semiconductors for a range of critical aerospace and defense applications.
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NXP and TSMC to Deliver Industry's First Automotive 16 nm FinFET Embedded MRAM (Tuesday May. 16, 2023)
NXP Semiconductors (NASDAQ: NXPI), the world leader in automotive processing, today announced its collaboration with TSMC to deliver the industry’s first automotive embedded MRAM (Magnetic Random Access Memory) in 16 nm FinFET technology.
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UMC Announces 40nm RFSOI Platform to Accelerate 5G mmWave Applications (Wednesday May. 03, 2023)
UMC today announced that its 40nm RFSOI technology platform is now ready for production of millimeter-wave (mmWave) radio frequency (RF) front-end products, enabling the proliferation of 5G wireless networks and applications including smartphones, Fixed Wireless Access (FWA) systems, and small cell base stations.
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PsiQuantum Expands Development Engagement and Plan for Production Ramp of Quantum Computing Technology at SkyWater's Minnesota Fab (Tuesday May. 02, 2023)
SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, today announced announced PsiQuantum has expanded its development agreement with the company and its plan to produce silicon photonic chips that will become part of future quantum computing systems.
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GlobalFoundries Completes Purchase of 800 Acres Adjacent to New York Manufacturing Facility (Monday May. 01, 2023)
GlobalFoundries Inc. (Nasdaq: GFS) (GF) today announced it has completed the purchase of approximately 800 acres of additional land adjacent to its Malta, New York, manufacturing facility.
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TSMC Showcases New Technology Developments at 2023 Technology Symposium (Thursday Apr. 27, 2023)
Debuts Enhanced N3P Process, HPC-Focused N3X Process, N3AE Auto Early Program, and Updates 2nm and TSMC 3DFabric™ Progress
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SkyWater Establishes Cryogenic Lab, Utilizes FormFactor's Leading Tool for RTS Noise Detection in Read-Out Integrated Circuit Applications (Tuesday Mar. 21, 2023)
SkyWater Technology, the trusted technology realization partner, today announced it has established a new cryogenic lab to characterize random telegraph signal (RTS) noise for read-out integrated circuits (ROICs).
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Infineon and UMC Extend Automotive Partnership with Long-Term Agreement for 40nm eNVM Microcontroller Production (Tuesday Mar. 07, 2023)
The high-performance microcontroller product leverages Infineon’s proprietary eNVM (embedded non-volatile memories) technology and will be manufactured at UMC’s Singapore fab on its 40nm process.
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UMC Introduces New 28eHV+ Platform for Wireless, VR/AR, and IoT Display Applications (Thursday Mar. 02, 2023)
United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, today unveiled its 28eHV+ platform, the newest enhancement to its industry-leading 28nm embedded high voltage (eHV) technology.
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Samsung Electronics' World-Class 5nm Technology Selected by Ambarella for New Automotive AI Central Domain Controller (Thursday Feb. 23, 2023)
Samsung Electronics, a world leader in advanced semiconductor technology, and Ambarella, Inc. (NASDAQ: AMBA), an edge AI semiconductor company, today announced that Samsung’s Foundry business is providing its 5-nanometer (nm) process technology to Ambarella for its newly announced CV3-AD685 automotive AI central domain controller.
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Amkor Technology and GlobalFoundries to Provide At-scale Semiconductor Test and Assembly Services in Europe (Monday Feb. 20, 2023)
Amkor Technology, Inc. (Nasdaq: AMKR), a leading provider of semiconductor packaging and test services, and GlobalFoundries (Nasdaq: GFS) (GF), a global leader in feature-rich semiconductor manufacturing, announced today that the two companies have formed a strategic partnership.
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Oculi Forms strategic partnership with GlobalFoundries to advance edge sensing technology (Thursday Feb. 16, 2023)
Oculi today announced a strategic partnership with GlobalFoundries Inc. (GF) (Nasdaq: GFS), a global leader in feature-rich semiconductor manufacturing, to manufacture OCULI SPU S12, the world's first single-chip intelligent Software-Defined Vision Sensor.
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GlobalFoundries and GM Announce Long-Term Direct Supply Agreement for U.S. Production of Semiconductor Chips (Friday Feb. 10, 2023)
General Motors Co. (NYSE: GM) and GlobalFoundries (NASDAQ: GFS) (GF) today announced a strategic, long-term agreement establishing a dedicated capacity corridor exclusively for GM’s chip supply.
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UMC and Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow (Wednesday Feb. 01, 2023)
United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, and Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that the Cadence® 3D-IC reference flow, featuring the IntegrityÔ 3D-IC Platform, has been certified for UMC’s chip stacking technologies, enabling faster time to market.
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VORAGO Technologies to Move All its Manufacturing Stateside in Strategic Partnership with SkyWater's Trusted Foundry (Tuesday Jan. 24, 2023)
SkyWater to implement VORAGO’s patented HARDSIL® technology that enhances performance of radiation-hardened and radiation-tolerant devices used in commercial, aerospace and defense applications