Foundries News

• GlobalFoundries and Biden-Harris Administration Announce CHIPS and Science Act Funding for Essential Chip Manufacturing (Monday Feb. 19, 2024)
  The U.S. Department of Commerce today announced $1.5 billion in planned direct funding for GlobalFoundries (Nasdaq: GFS) (GF) as part of the U.S. CHIPS and Science Act.
  
  
• Intel and UMC Announce New Foundry Collaboration (Thursday Jan. 25, 2024)
  Intel Corp. (Nasdaq: INTC) and United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, today announced that they will collaborate on the development of a 12-nanometer semiconductor process platform to address high-growth markets such as mobile, communication infrastructure and networking.
  
  
• Infineon and GlobalFoundries extend long-term agreement with focus on automotive microcontrollers (Tuesday Jan. 23, 2024)
  Infineon Technologies AG and GlobalFoundries (GF) today announced a new multi-year agreement on the supply of Infineon’s AURIX™ TC3x 40 nanometer automotive microcontrollers as well as power management and connectivity solutions.
  
  
• ITRI and TSMC Collaborate on Advancing High-Speed Computing with SOT-MRAM (Thursday Jan. 18, 2024)
  ITRI has joined forces with Taiwan Semiconductor Manufacturing Company (TSMC) for pioneering research into the development of a spin-orbit-torque magnetic random-access memory (SOT-MRAM) array chip.
  
  
• Valens Semiconductor and Intel Foundry Services Announce Strategic Relationship for Next Generation A-PHY Product (Tuesday Jan. 09, 2024)
  Valens Semiconductor and Intel Foundry Services (IFS) announce that IFS will fabricate Valens Semiconductor's MIPI A-PHY chipsets using its advanced process nodes, aiming to address the robust demand in the market for this innovative connectivity solution.
  
  
• SkyWater Announces Availability of Cadence Open-Source PDK and Reference Design for SkyWater's 130 nm Process (Monday Nov. 06, 2023)
  SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, today announced a new SkyWater open-source 130 nm process design kit (PDK) from Cadence Design Systems, Inc., which will be available in the Cadence® VLSI (very large-scale integration) Fundamentals Education Kit.
  
  
• UMC Launches W2W 3D IC Project with Partners, Targeting Growth in Edge AI (Tuesday Oct. 31, 2023)
  United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, today announced it has initiated the W2W (wafer-to-wafer) 3D IC project in collaboration with partners Winbond, Faraday, ASE, and Cadence to help customers accelerate production of their 3D products.
  
  
• Samsung Electronics Unveils Automotive Process Strategy at Samsung Foundry Forum 2023 EU (Thursday Oct. 19, 2023)
  Samsung Electronics today unveiled its advanced and wide ranging automotive process solutions, from the most advanced 2-nanometer process to the 8-inch legacy process.
  
  
• TSMC Announces Breakthrough Set to Redefine the Future of 3D IC (Thursday Sep. 28, 2023)
  TSMC today announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform® (OIP) 3DFabric Alliance at the TSMC 2023 OIP Ecosystem Forum.
  
  
• GlobalFoundries Unveils Power-Efficient Advancements to 22FDX® Platform at Annual Tech Summit (Wednesday Sep. 27, 2023)
  The new features include ultra-low power memory, designed to operate with exceptional energy efficiency, even in the most power-sensitive environments. Additionally, GF’s 22FDX platform introduces advanced temperature-resistant capabilities, which are critical for the auto industry as they ensure the long-term durability, reliability and safety of vehicle electronic systems, particularly in high-heat environments found under the hood and during demanding operations.
  
  
• GlobalFoundries Announces Opening of New Malaysia Office to Support Global Manufacturing Operations (Tuesday Sep. 26, 2023)
  GlobalFoundries (Nasdaq: GFS) (GF) today announced the official opening of a new hub facility in Penang, Malaysia. This new facility will create 300 high-value manufacturing support roles, including technicians, engineers, administrative and support functions.
  
  
• GlobalFoundries Submits Applications for U.S. CHIPS and Science Act Funding (Monday Sep. 25, 2023)
  GlobalFoundries (Nasdaq: GFS) (GF) announced today it has applied for U.S. CHIPS and Science Act Funding, with two full applications submitted to the CHIPS Program Office of the U.S. Department of Commerce.
  
  
• U.S. Government Awards GlobalFoundries New $3.1 Billion, 10-Year Contract for Secure Chip Manufacturing (Thursday Sep. 21, 2023)
  With $3.1 billion spending ceiling, new 10-year contract provides U.S. Dept. of Defense an assured supply of securely manufactured semiconductors for use in the nation’s most sensitive applications
  
  
• GlobalFoundries Officially Opens US$4 Billion Expansion Facility in Singapore, Creating 1,000 New Jobs (Tuesday Sep. 12, 2023)
  GlobalFoundries (NASDAQ: GFS) (GF) today announced the official opening of its US$4 billion (S$5 billion) expansion fabrication plant (“fab”) in Singapore.
  
  
• MediaTek Successfully Develops First Chip Using TSMC's 3nm Process, Set for Volume Production in 2024 (Thursday Sep. 07, 2023)
  MediaTek and TSMC today announced that MediaTek has successfully developed its first chip using TSMC’s leading-edge 3nm technology, taping out MediaTek’s flagship Dimensity system-on-chip (SoC) with volume production expected next year.
  
  
• Intel Foundry Services and Tower Semiconductor Announce New US Foundry Agreement (Tuesday Sep. 05, 2023)
  Intel Foundry Services (IFS) and Tower Semiconductor (Nasdaq: TSEM), a leading foundry for analog semiconductor solutions, today announced an agreement where Intel will provide foundry services and 300mm manufacturing capacity to help Tower serve its customers globally.
  
  
• GlobalFoundries Announces 9SW RFSOI Technology for Next-Generation Mobile and 5G Applications (Wednesday Aug. 30, 2023)
  At its annual Technology Summit beginning today, GlobalFoundries (GF) (Nasdaq: GFS), announced advancements in the industry’s first RFSOI foundry solution manufactured on 300mm wafers.
  
  
• GlobalFoundries Enhances Technology Platforms to Enable Critical Applications for Next Generation Electric and Autonomous Vehicles (Wednesday Aug. 30, 2023)
  At its annual Technology Summit beginning today, GlobalFoundries (GF) (Nasdaq: GFS), announced advancements for two of its technology platforms that will support the growing demand for the technologies needed for autonomous, connected and electrified vehicles.
  
  
• GlobalFoundries Unveils Key Innovations at Technology Summit 2023 (Monday Aug. 28, 2023)
  At its annual Technology Summit beginning today, GlobalFoundries (Nasdaq: GFS), is spotlighting its differentiated technology advancements that are enabling more efficient deployment of power, more seamless connectivity and more intelligence that is driving innovation and enabling transformative products in the world’s most critical markets.
  
  
• SMIC: Resignation of Chairman of the Board and Executive Director Appointment of Chairman of the Board and Change of Authorised Representative (Monday Jul. 17, 2023)
  Dr. Gao Yonggang (“Dr. Gao”), has resigned as the chairman of the Board, executive director of the Company and chairman of the nomination committee of the Board with effect from 17 July 2023 due to job adjustment.
  
  
• Samsung Electronics Unveils Foundry Vision in the AI Era at Samsung Foundry Forum 2023 (Wednesday Jun. 28, 2023)
  
  
  
• Intel Provides Update on Internal Foundry Model (Thursday Jun. 22, 2023)
  Intel leaders told analysts and investors during a webinar Wednesday that its transition to a new internal foundry model will be a key enabler to achieving its stated cost savings goal of more than $8-10 billion exiting 2025.
  
  
• Lockheed Martin and GlobalFoundries Collaborate to Advance Innovation and Resiliency of Chips for National Security (Tuesday Jun. 13, 2023)
  Lockheed Martin (NYSE: LMT) and GlobalFoundries (Nasdaq: GFS) (GF) today announced a strategic collaboration to advance U.S. semiconductor manufacturing and innovation and to increase the security, reliability and resiliency of domestic supply chains for national security systems.
  
  
• TSMC Announces the Opening of Advanced Backend Fab 6, Marking a Milestone in the Expansion of 3DFabric™ System Integration Technology (Friday Jun. 09, 2023)
  TSMC (TWSE: 2330, NYSE: TSM) today announced the opening of its Advanced Backend Fab 6, the Company’s first all-in-one automated advanced packaging and testing fab to realize 3DFabric™ integration of front-end to back-end process and testing services.
  
  
• GlobalFoundries and STMicroelectronics Finalize Agreement for New 300mm Semiconductor Manufacturing Facility in France (Monday Jun. 05, 2023)
  GlobalFoundries  and STMicroelectronics announced today the conclusion of the agreement to create a new, jointly-operated, high-volume semiconductor manufacturing facility in Crolles (France), which was announced on 11 July 2022.
  
  
• Intel Foundry Services Ushers in a New Era (Wednesday May. 31, 2023)
  In April, Intel Foundry Services (IFS) and Arm announced a multigenerational agreement to enable chip designers to build low-power compute system-on-chip (SoCs) on Intel technology. We are excited to provide our customers with the opportunity to design their mobile SoCs on Intel’s leading-edge 18A process technology paired with the latest, most powerful Arm CPU core — the recently launched next-generation Cortex-X4 — for improved power and performance.
  
  
• U.S. Government Accredits GlobalFoundries to Manufacture Trusted Semiconductors at New York Facility (Tuesday May. 30, 2023)
  The U.S. Department of Defense (DoD), through the Defense Microelectronics Activity (DMEA), Trusted Access Program Office (TAPO), has accredited GlobalFoundries’ (Nasdaq: GFS) (GF) advanced manufacturing facility in Malta, New York, as a Category 1A Trusted Supplier with the ability to manufacture secure semiconductors for a range of critical aerospace and defense applications.
  
  
• NXP and TSMC to Deliver Industry's First Automotive 16 nm FinFET Embedded MRAM (Tuesday May. 16, 2023)
  NXP Semiconductors (NASDAQ: NXPI), the world leader in automotive processing, today announced its collaboration with TSMC to deliver the industry’s first automotive embedded MRAM (Magnetic Random Access Memory) in 16 nm FinFET technology.
  
  
• UMC Announces 40nm RFSOI Platform to Accelerate 5G mmWave Applications (Wednesday May. 03, 2023)
  UMC today announced that its 40nm RFSOI technology platform is now ready for production of millimeter-wave (mmWave) radio frequency (RF) front-end products, enabling the proliferation of 5G wireless networks and applications including smartphones, Fixed Wireless Access (FWA) systems, and small cell base stations.
  
  
• PsiQuantum Expands Development Engagement and Plan for Production Ramp of Quantum Computing Technology at SkyWater's Minnesota Fab (Tuesday May. 02, 2023)
  SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, today announced announced PsiQuantum has expanded its development agreement with the company and its plan to produce silicon photonic chips that will become part of future quantum computing systems.