Foundries News

• TSMC Announces Updates for TSMC Arizona (Wednesday Dec. 07, 2022)
  TSMC today announced that in addition to TSMC Arizona’s first fab, which is scheduled to begin production of N4 process technology in 2024, TSMC has also started the construction of a second fab which is scheduled to begin production of 3nm process technology in 2026.
  
  
• The MOSIS Service of the USC Information Sciences Institute and SkyWater Collaborate on Silicon IC Design Enablement and Manufacturing Service (Tuesday Nov. 29, 2022)
  The MOSIS Service of the Information Sciences Institute, University of Southern California and SkyWater Technology (NASDAQ: SKYT), today announced a collaboration to enable design-to-manufacturing for integrated circuit (IC) prototyping and production utilizing SkyWater’s CMOS process technologies.
  
  
• TSMC Launches OIP 3DFabric Alliance to Shape the Future of Semiconductor and System Innovations (Thursday Oct. 27, 2022)
  This alliance will help customers achieve speedy implementation of silicon and system-level innovations and enable next-generation HPC and mobile applications using TSMC’s 3DFabric technologies, a comprehensive family of 3D silicon stacking and advanced packaging technologies.
  
  
• Intel Foundry Services Forms Alliance to Enable National Security, Government Applications (Monday Oct. 24, 2022)
  IFS USMAG Alliance combines a trusted design ecosystem with U.S.-based manufacturing to enable assured chip design and production at leading-edge nodes.
  
  
• US Government to Fund Expansion of IP Ecosystem for SkyWater's 90 nm Rad-Hard Platform (Wednesday Oct. 12, 2022)
  SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, today announced the Department of Defense (DOD) is investing $12 million to expand the intellectual property (IP) ecosystem for the company’s 90 nm radiation-hardened (rad-hard) by process offering, as part of the previously announced $27 million investment.
  
  
• Samsung Electronics Unveils Plans for 1.4nm Process Technology and Investment for Production Capacity at Samsung Foundry Forum 2022 (Thursday Oct. 06, 2022)
  Samsung Electronics, a world leader in advanced semiconductor technology, announced today a strengthened business strategy for its Foundry Business with the introduction of cutting-edge technologies at its annual Samsung Foundry Forum event.
  
  
• Valens Semiconductor Collaborates with Intel to Boost Automotive MIPI A-PHY Implementations (Wednesday Sep. 28, 2022)
  Valens Semiconductor (NYSE: VLN) today announced a collaboration with Intel to develop MIPI A-PHY-compliant automotive technologies for foundry customers, leveraging Valens Semiconductor’s expertise as a leading contributor to MIPI A-PHY technology.
  
  
• U.S. Department of Defense Awards SkyWater up to $99M in Additional Funding to Advance Rad-Hard Technology to Productization and Qualification (Tuesday Sep. 27, 2022)
  SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, today announced the Department of Defense (DOD) has awarded the company up to $99 million as a continuation of the previous initiative to broaden onshore production capabilities for strategic radiation-hardened (rad-hard) electronics.
  
  
• SkyWater to Provide Foundry Service for new NIST and Google Partnership to Create Supply of Chips for Researchers and Tech Startups (Friday Sep. 16, 2022)
  SkyWater Technology today announced it will manufacture chips that researchers can use to develop new nanotechnology and semiconductor devices through a cooperative research and development agreement between the U.S. Department of Commerce’s National Institute of Standards and Technology (NIST) and Google.
  
  
• Avalanche Technology and UMC Announce 22nm Production of High-Density MRAM-Based Devices for Aerospace Applications (Tuesday Sep. 13, 2022)
  Avalanche Technology, the leader in next generation MRAM technology, and United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading semiconductor foundry, announced today the immediate availability of new High-Reliability Persistent SRAM (P-SRAM) memory devices through UMC’s 22nm process technology.
  
  
• Intel Introduces First-of-its-Kind Semiconductor Co-Investment Program (Wednesday Aug. 24, 2022)
  Intel signs agreement with Brookfield to jointly invest up to $30 billion in leading-edge chip factories in Arizona.
  
  
• GlobalFoundries and Qualcomm Announce Extension of Long-term Agreement to Secure U.S. Supply through 2028 (Monday Aug. 08, 2022)
  Following the recent passage of the U.S. CHIPS and Science Act last week, GlobalFoundries (Nasdaq: GFS) (GF), a global leader in feature-rich semiconductor manufacturing and Qualcomm Technologies, Inc. today announced they are more than doubling their existing strategic global long-term semiconductor manufacturing agreement previously entered into by GF’s and Qualcomm’s respective subsidiaries.
  
  
• SkyWater Receives Funding from DOD, Partners with Google to Facilitate Open Source Design for its new 90 nm Technology Offering (Thursday Jul. 28, 2022)
  SkyWater Technology (NASDAQ: SKYT), the trusted technology realization partner, today announced it is receiving $15 million in funding from the Department of Defense (DOD) to facilitate open source design for its 90 nm process offering, part of the previously announced $27 million investment.
  
  
• Intel and MediaTek Form Foundry Partnership (Monday Jul. 25, 2022)
  Intel and MediaTek today announced a strategic partnership to manufacture chips using Intel Foundry Services’ (IFS) advanced process technologies.
  
  
• SkyWater Plans to Build Advanced $1.8B Semiconductor Manufacturing Facility in Partnership with the State of Indiana and Purdue University (Thursday Jul. 21, 2022)
  SkyWater Technology today announced its plans to build a $1.8 billion U.S. semiconductor R&D and production facility in Indiana through a dynamic public-private partnership with the State and Purdue University to pursue CHIPS (Creating Helpful Incentives to Produce Semiconductors) for America Act funding.
  
  
• GlobalFoundries Statement Following Senate Procedural Vote on Legislation To Bolster U.S. Competitiveness (Wednesday Jul. 20, 2022)
  GlobalFoundries (Nasdaq: GFS) (GF) today released the following statement on today’s bipartisan procedural vote in the U.S. Senate to advance CHIPS Act funding that will strengthen the competitiveness of semiconductor chip manufacturing in America:
  
  
• US Department of Defense Awards SkyWater a $27M Option to Facilitate American-Made Semiconductors Critical to National Security and Domestic Supply Chains (Wednesday Jul. 13, 2022)
  SkyWater Technologytoday announced the Department of Defense (DOD) is funding a $27 million Other Transactional (OT) Agreement Option to further develop intellectual property (IP) for its 90 nm Strategic Rad-Hard by Process (RH90) FDSOI technology platform.
  
  
• STMicroelectronics and GlobalFoundries to advance FD-SOI ecosystem with new 300mm manufacturing facility in France (Monday Jul. 11, 2022)
  STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, and GlobalFoundries Inc. (Nasdaq: GFS), a global leader in feature-rich semiconductor manufacturing, today announced they have signed a Memorandum of Understanding to create a new, jointly-operated 300mm semiconductor manufacturing facility adjacent to ST’s existing 300mm facility in Crolles, France.
  
  
• Intel Foundry Services Forms Alliance to Enable Design in the Cloud (Thursday Jun. 30, 2022)
  Intel Foundry Services (IFS) today launched the next phase of its Accelerator ecosystem program. The IFS Cloud Alliance will enable secure design environments in the cloud, improving foundry customer design efficiency and accelerating time-to-market by harnessing the power of massive on-demand compute.
  
  
• Samsung Begins Chip Production Using 3nm Process Technology With GAA Architecture (Thursday Jun. 30, 2022)
  Samsung Electronics, the world leader in semiconductor technology, today announced that it has started initial production of its 3-nanometer (nm) process node applying Gate-All-Around (GAA) transistor architecture.
  
  
• TSMC Japan 3DIC R&D Center Completes Clean Room Construction in AIST Tsukuba Center (Monday Jun. 27, 2022)
  TSMC (TWSE: 2330, NYSE: TSM) today announced that its subsidiary, the TSMC Japan 3DIC R&D Center, has completed construction of its clean room in the Tsukuba Center of the National Institute of Advanced Industrial Science and Technology (AIST). An opening event was held today.
  
  
• GlobalFoundries Celebrates New Singapore Fab with Arrival of First Tool (Thursday Jun. 23, 2022)
  GlobalFoundries (Nasdaq: GFS) (GF), a global leader in feature-rich semiconductor manufacturing, today announced that its first tool has been moved into the company’s new facility on its Singapore campus.
  
  
• TSMC FINFLEX™, N2 Process Innovations Debut at 2022 North American Technology Symposium (Friday Jun. 17, 2022)
  TSMC today showcased the newest innovations in its advanced logic, specialty, and 3D IC technologies at the Company’s 2022 North America Technology Symposium, with the next-generation leading-edge N2 process powered by nanosheet transistors and the unique FINFLEX™ technology for the N3 and N3E processes making their debut.
  
  
• Fujikura collaborates with GlobalFoundries to accelerate large-scale commercialization of 5G mmWave Technologies (Friday May. 20, 2022)
  Fujikura, Ltd., a leading supplier to the telecom market is pleased to announce it is collaborating with GlobalFoundries (GF) in enabling the commercial availability of FutureAccess™, industry’s most integrated 28GHz 5G mmWave module, for both mobile as well as fixed wireless infrastructure markets.
  
  
• GlobalFoundries Advances RF Leadership with GF Connex™ Portfolio and Customer Collaborations (Friday May. 20, 2022)
  At its annual GF Technology Summit (GTS), GlobalFoundries (Nasdaq: GFS) (GF), today announced GF Connex, the industry’s most comprehensive and advanced portfolio of feature-rich radio frequency (RF) technology solutions for next generation wireless connectivity.
  
  
• GlobalFoundries Unveils GF Labs to Accelerate Technology Innovation (Friday May. 20, 2022)
  At its annual GF Technology Summit (GTS), GlobalFoundries (Nasdaq: GFS) (GF) today announced the launch of GF Labs, a new program that extends the development horizon of innovative, differentiated semiconductor technology and broadens the company’s portfolio of feature-rich and enablement solutions.
  
  
• GlobalFoundries and Motorola Solutions Announce Strategic Agreement for Chip Supply (Thursday May. 19, 2022)
  GlobalFoundries Inc. (GF) (Nasdaq: GFS) and Motorola Solutions (NYSE: MSI) today announced a long-term agreement to safeguard the supply of innovative chip solutions for Motorola Solutions’ radios, which are widely used by public safety, critical infrastructure and enterprise organizations across the world.
  
  
• Tower Semiconductor Expands its Leading-Edge Power Management Platforms Supporting Higher Power and Higher Voltage ICs (Monday May. 09, 2022)
  Releasing its second-generation 65nm BCD scalable power LDMOS expanding voltages to 24V operation and 20% lower Rdson; and adding deep trench isolation (DTI) to its 180nm BCD platform enabling up to 40% die size reduction for operation up to 125V
  
  
• U.S. Department of Defense and GlobalFoundries Partner to Secure Supply of Chips Critical to National Security Systems (Tuesday May. 03, 2022)
  GlobalFoundries Inc. (Nasdaq: GFS) (GF), a global leader in feature-rich semiconductor manufacturing, today announced a $117 million agreement with the U.S. Department of Defense (DoD) to provide a strategic supply of U.S.-made semiconductors that are critical to national security systems.
  
  
• GlobalFoundries Announces Next Generation in Silicon Photonics Solutions and Collaborates with Industry Leaders to Advance a New Era of More in the Data Center (Monday Mar. 07, 2022)
  GlobalFoundries Inc (Nasdaq: GFS) (GF) today announced it is collaborating with industry leaders including Broadcom, Cisco Systems, Inc, Marvell and NVIDIA, along with breakthrough photonic leaders including Ayar Labs, Lightmatter, PsiQuantum, Ranovus and Xanadu, to deliver innovative, unique, feature-rich solutions to solve some of the biggest challenges facing data centers today.