Foundries News

• Intel Custom Foundry Demonstrates Industry-Leading General Purpose SerDes on 14nm Process (Tuesday Mar. 25, 2014)
  Intel Corporation today demonstrated silicon results for its 1 to 16 Gbps 14nm general purpose SerDes (Serializer Deserializer). This 14nm SerDes is first in a family of SerDes that will include industry-leading 10 to 32 Gbps high-speed SerDes and 1 to 10 Gbps low-power SerDes.
  
  
• SMIC Offers a Full Set of ESD Protection Service to Enhance the Whole Chip ESD Design for Customers (Tuesday Mar. 25, 2014)
  SMIC announced today that a full set of Electrostatic Discharge (ESD) protection service, including documents, checklists, PERC Suite, floor plan review, and risk management services, has been offered to IC design customers to enhance the whole chip ESD design and ensure their first silicon success.
  
  
• GloFo Shows Progress in 3D Stacks (Thursday Mar. 20, 2014)
  GlobalFoundries will describe, in May, a way to make 3D chip stacks without a large keep-out zone around its through-silicon vias. The work is being hailed as an advance in silicon integration at a time when Moore's Law is slowing getting more costly.
  
  
• Samsung Proliferates the Internet of Things with the Addition of RF Capabilities to its 28nm Process Technology for Foundry Customers (Friday Mar. 07, 2014)
  Samsung Electronics, Co., Ltd. today announced that it has expanded its 28nm technology offerings with the addition of RF capabilities. As the Internet of Things quickly becomes a reality, Samsung’s foundry business offers chip designers the ability to integrate advanced RF functionality into their designs, making connectivity applications such as the connected home appliances, auto infotainment systems and heating/cooling systems possible.
  
  
• SMIC and JCET Establish a Joint Venture to Build China's Local IC Manufacturing Supply Chain (Thursday Feb. 20, 2014)
  SMIC and JCET, the largest packaging service provider in China, jointly announced today a joint venture for 12" bumping and related testing. JCET will also build advanced back-end package production lines nearby.
  
  
• Synopsys, Realtek and UMC Collaborate on Industry's First Single-Chip Ultra High Definition Smart TV SoC (Wednesday Feb. 12, 2014)
  Synopsys, Realtek and UMC today announced that their collaboration has resulted in first-pass silicon success of Realtek’s RTD2995 UHD Smart TV Controller SoC implemented in UMC’s 40LP, the foundry’s volume production, low-power 40-nanometer (nm) process technology.
  
  
• ARM and SMIC Broaden IP Partnership with 28nm Process for Mobile and Consumer Applications (Monday Feb. 10, 2014)
  ARM and SMIC today announced an agreement to offer the ARM® Artisan® physical IP platform for SMIC's 28nm poly SiON (PS) process to provide high-performance, high-density and low-power technologies for SoC designs.
  
  
• SMIC Unveils 28nm Readiness and MPW Milestone (Monday Jan. 27, 2014)
  SMIC announced today that its 28nm technology has been process frozen and the company has successfully entered Multi Project Wafer (MPW) stage to support customer's requirements on both 28nm PolySiON (PS) and 28nm high-k dielectrics metal gate (HKMG) processes.
  
  
• Dual-interface Financial IC Card Chip Based on SMIC's eEEPROM Platform Gains CC EAL4+ Certification (Wednesday Jan. 22, 2014)
  SMIC and SHHIC both announced today the dual-interface financial IC card chip based on SMIC's eEEPROM platform has passed CC EAL4+ certification. SHHIC's SHC1302/2907M4 is the first and only Chinese domestic designed IC to obtain this security certification which is the most recognized in the international IT field.
  
  
• ARM and UMC Extend 28nm IP Partnership to Target Cost-Effective Mobile and Consumer Applications (Tuesday Jan. 14, 2014)
  ARM and UMC today announced an agreement to offer the ARM® Artisan® physical IP platform along with POP™ IP for UMC’s 28nm high-performance low-power (HLP) process technology.
  
  
• UMC Surpasses 15 Million Shipments for Customer 55nm SDDI Chips (Tuesday Jan. 07, 2014)
  UMC today announced that it has surpassed 15 million shipments for customer small display driver ICs (SDDI) manufactured using the foundry’s 55nm embedded high voltage (eHV) technology. The 55nm eHV process, utilized by customers to enable high-end, high-resolution smartphones, is being produced with excellent manufacturing yields in the foundry’s 300mm fabs in Taiwan and Singapore.
  
  
• GLOBALFOUNDRIES Demonstrates Collaborative Model for Next-Generation Chip Packaging Technologies (Friday Nov. 22, 2013)
  GLOBALFOUNDRIES today unveiled details of a project that demonstrates the value of its open and collaborative approach to delivering next-generation chip packaging technologies.
  
  
• Open-Silicon and GLOBALFOUNDRIES Demonstrate Custom 28nm SoC Using 2.5D Technology (Friday Nov. 22, 2013)
  Open-Silicon and GLOBALFOUNDRIES today announced the industry's first demonstration of a functional SoC solution featuring two 28nm logic chips, with embedded ARM processors, connected across a 2.5D silicon interposer.
  
  
• Peregrine and GLOBALFOUNDRIES Collaborate to Advance RF SOI Technology (Wednesday Oct. 30, 2013)
  Peregrine Semiconductor and GLOBALFOUNDRIES are sampling the first RF Switches built on Peregrine’s new UltraCMOS 10 RF SOI technologies.
  
  
• SMIC Announces Formation of Center for Vision, Sensors and 3DIC (Tuesday Oct. 22, 2013)
  SMIC announced today the formation of SMIC's Center for Vision, Sensors and 3DIC (CVS3D).
  
  
• SMIC Offers Differentiated 0.13um Low-Leakage Embedded Flash Manufacturing Process (Tuesday Oct. 15, 2013)
  SMIC announced today its 0.13um Low-Leakage (LL) embedded Flash (eFlash) process has entered volume production stage. SMIC's 0.13um LL eFlash technology is a continuation of SMIC's Non-Volatile Memory (NVM) offering to provide customers a differentiated solution to address performance, power consumption and cost.
  
  
• Bank Card IC Products Adopting SMIC eEEPROM Platform Certified by China Union Pay (Tuesday Oct. 08, 2013)
  
  
  
• SMIC IP R&D Center Applies EDA Solution of Beijing Empyrean (Friday Oct. 04, 2013)
  SMIC and Empyrean today jointly announced that SMIC's IP R&D center adopted Aeolus, a high-performance paralleled circuit simulation tool, along with other customized tools from Empyrean.
  
  
• SMIC Introduces Its Diversifying Embedded Non-Volatile Memory Platform (Monday Sep. 23, 2013)
  SMIC's eNVM platform includes eEEPROM (embedded Electrically Erasable Programmable Read-Only Memory), eFlash (embedded Flash memory), MTP (Multi-Time Programmable), and OTP (One-Time Programmable) at both 0.18µm and 0.13µm technology nodes, along with 55nm eFlash process with target readiness by 2Q14.
  
  
• TSMC and OIP Ecosystem Partners Deliver 16FinFET and 3D IC Reference Flows (Tuesday Sep. 17, 2013)
  TSMC today released three silicon-validated Reference Flows within the Open Innovation Platform® (OIP) that enable 16FinFET systems-on-chip (SoC) designs and 3D chip stacking packages.
  
  
• Soitec licencing to TSMC its IP portfolio related to back-side illumination technology for image sensors (Tuesday Sep. 10, 2013)
  Soitec has licensed some of its intellectual property (IP) portfolio related to back-side illumination (BSI) technology for image sensors to TSMC
  
  
• SMIC's 2013 Technology Symposiums Kicks Off in Shanghai (Wednesday Sep. 04, 2013)
  SMIC kicked off its 13th technology symposium series in Shanghai today. The theme of this year's series is "Advanced and Value-added Technology Platforms for Your Vision."
  
  
• Imagination and TSMC partner to drive industry-leading performance on GPUs (Thursday Aug. 29, 2013)
  Imagination Technologies announced today that it is working together with TSMC to drive next-generation performance to new levels on Imagination’s industry-leading PowerVR GPUs.
  
  
• AltoBeam and UMC Successfully Demonstrate DVB-T2/T/C/S2/S Demodulator (Monday Jul. 29, 2013)
  AltoBeam and UMC today announced the release of AltoBeam’s DVB-T2/T/C/S2/S demodulator to target DTV markets that have adopted these standards.
  
  
• UMC and SuVolta Announce Joint Development of 28nm Low-Power Process Technology (Tuesday Jul. 23, 2013)
  UMC and SuVolta, Inc., today announced joint technology development of a 28nm process that integrates SuVolta’s Deeply Depleted Channel™ (DDC) transistor technology into UMC's 28nm High-K Metal Gate (HKMG) high-performance mobile (HPM) process.
  
  
• Altis Semiconductor Introduces an Innovative Secure Product (Thursday Jul. 04, 2013)
  Altis is announcing a new product using state-of-the-art cryptology and technologies to address security and performances for mobile and connected devices.
  
  
• Rockchip Launches New Tablet SoCs on GLOBALFOUNDRIES' 28nm HKMG Process Technology (Tuesday Jun. 18, 2013)
  GLOBALFOUNDRIES and Fuzhou Rockchip Electronics Co., Ltd. today announced that Rockchip’s next-generation mobile processors are ramping to production on GLOBALFOUNDRIES’ 28nm High-K Metal Gate (HKMG) process technology.
  
  
• UMC joins IBM chip alliance for 10nm process development (Thursday Jun. 13, 2013)
  IBM and UMC today announced that UMC will join the IBM Technology Development Alliances as a participant in the group’s development of 10nm CMOS process technology.
  
  
• ARM and GLOBALFOUNDRIES to Optimize Next-Generation ARM Mobile Processors for 28nm-SLP Process Technology (Monday Jun. 03, 2013)
  In conjunction with the launch of the ARM® Cortex®-A12 processor, ARM and GLOBALFOUNDRIES today announced new power, performance and cost-optimized POP™ technology offerings for the ARM Cortex-A12 and Cortex-A7 processors for GLOBALFOUNDRIES 28nm-SLP High-K Metal Gate (HKMG) process technology.
  
  
• GLOBALFOUNDRIES Accelerates Adoption of 20nm-LPM and 14nm-XM FinFET Processes with Comprehensive Production-Ready Design Flows (Friday May. 31, 2013)