Foundries News

• UMC Establishes its Specialty Technology Center of Excellence in Singapore (Wednesday May. 22, 2013)
  
  
  
• Imec and GLOBALFOUNDRIES collaborate to advance high-density memory technolog (Tuesday May. 21, 2013)
  Imec and GLOBALFOUNDRIES announced today that they have expanded joint development efforts to advance STT-MRAM (spin-transfer torque magnetoresistive random access memory) technology.
  
  
• Samsung Announces Industry-First 45 nanometer Embedded Flash Logic Process Development (Tuesday May. 21, 2013)
  Samsung Electronics announced the industry's first 45nm embedded flash ("eFlash") logic process development. Samsung successfully implemented the new process into the smart card test chip, which means that this process technology fulfills the stringent quality requirements of the security solution market and can be successfully deployed on a commercial scale.
  
  
• Infineon and GLOBALFOUNDRIES Announce Joint Development and Production Collaboration for 40nm Embedded Flash Process Technology (Monday Apr. 29, 2013)
  Infineon and GLOBALFOUNDRIES today announced a joint technology development and production agreement for 40nm embedded flash (eFlash) process technology. The cooperation will focus on technology development based on Infineon’s eFlash cell design and manufacturing of automotive and security microcontrollers (MCUs) with 40nm process structures.
  
  
• GLOBALFOUNDRIES Demonstrates 3D TSV Capabilities on 20nm Technology (Tuesday Apr. 02, 2013)
  At its Fab 8 campus in Saratoga County, N.Y., GLOBALFOUNDRIES has demonstrated its first functional 20nm silicon wafers with integrated Through-Silicon Vias (TSVs).
  
  
• Altis Semiconductor Introduces the Next Generation of Embedded CBRAM Technology (Tuesday Apr. 02, 2013)
  Altis announced today the next generation of embedded CBRAM (eCBRAM) technology, a new platform available for demonstration in Q2 2013. eCBRAM technology was developed through Altis’ partnership with Adesto Technologies and will enhance the Altis eNVM (embedded non-volatile memory) foundry service portfolio, today based on 130nm CMOS technologies.
  
  
• ALTIS Semiconductor Selected as Long Term Foundry Partner for IBM Microelectronics SOI Technology (Friday Mar. 15, 2013)
  ALTIS Semiconductor announced today the finalization of a foundry agreement with IBM Microelectronics. Under the terms of this agreement, ALTIS will be the foundry partner for the IBM 180nm SOI technology.
  
  
• TSMC February 2013 Sales Report (Friday Mar. 08, 2013)
  TSMC today announced its net sales for February 2013: On a consolidated basis, net sales for February 2013 were approximately NT$41.18 billion, a decrease of 13.2 percent from January 2013 and an increase of 21.5 percent over February 2012.
  
  
• UMC Reports Sales for February 2013 (Friday Mar. 08, 2013)
  UMC today reported unaudited net sales for the month of February 2013.
  
  
• Spansion and UMC Announce Joint Technology Development and Licensing Agreement (Monday Mar. 04, 2013)
  Spansion and UMC today announced the joint development of a 40nm process that integrates UMC’s 40nm LP logic process with Spansion® proprietary embedded Charge Trap (eCT) Flash memory technology.
  
  
• GLOBALFOUNDRIES Offers Enhanced 55nm CMOS Logic Process with ARM Next-Generation Memory and Logic IP Support for Low Voltage (Wednesday Feb. 20, 2013)
  GLOBALFOUNDRIES today announced additional enhancements to the foundry’s 55-nanometer (nm) Low-Power Enhanced (LPe) process technology platform – 55nm LPe 1V – with qualified, next-generation memory and logic IP solutions from ARM.
  
  
• TSMC January 2013 Sales Report (Friday Feb. 08, 2013)
  TSMC today announced its net sales for January 2013: On a consolidated basis, net sales for January 2013 were approximately NT$47.44 billion, an increase of 27.7 percent from December 2012 and an increase of 37.1 percent over January 2012.
  
  
• UMC Reports Sales for January 2013 (Friday Feb. 08, 2013)
  UMC today reported unaudited net sales for the month of January 2013.
  
  
• GLOBALFOUNDRIES and Cyclos Semiconductor Partner to Develop High-Performance, Low-Power ARM Cortex-A15 Processors Using Resonant Clock Mesh Technology (Tuesday Feb. 05, 2013)
  GLOBALFOUNDRIES and Cyclos Semiconductor announced plans to implement Cyclos’ low-power semiconductor intellectual property in ARM® CortexTM-A15 processors using 28nm High-K Metal Gate (HKMG) process technology from GLOBALFOUNDRIES.
  
  
• GLOBALFOUNDRIES To Offer Adapteva's Processor IP For 28nm SoC Designs (Tuesday Feb. 05, 2013)
  At today’s Common Platform Technology Forum, GLOBALFOUNDRIES announced a partnership with Adapteva to offer the company’s Epiphany IV microarchitecture to customers using GLOBALFOUNDRIES’ leading-edge 28nm-SLP process technology.
  
  
• STATS ChipPAC and UMC Unveil World's First 3D IC Developed under an Open Ecosystem Model (Tuesday Jan. 29, 2013)
  STATS ChipPAC and UMC today announced the world’s first demonstration of TSV-enabled 3D IC chip stacking technology developed under an open ecosystem collaboration.
  
  
• Faraday and UMC Deliver 300 Million Gate 40nm Customer SoC (Tuesday Jan. 22, 2013)
  Faraday and UMC today announced that they have produced customer SoC ICs with a density of over 300 million gates. The successful fabrication of the communication infrastructure ICs demonstrates the two companies’ ability to deliver highly complex SoCs for third-party customers with lower development risk, design effort, and overall time-to-market.
  
  
• TSMC Reports Fourth Quarter EPS of NT$1.61 (Thursday Jan. 17, 2013)
  TSMC today announced consolidated revenue of NT$131.31 billion, net income of NT$41.57 billion, and diluted earnings per share of NT$1.61 (US$0.28 per ADR unit) for the fourth quarter ended December 31, 2012.
  
  
• UMC Introduces Thick Plated Copper Process for Monolithic PMIC Applications (Tuesday Jan. 15, 2013)
  The TPC solution, developed with Taiwan-based packaging house Chipbond Technology Corp. (6147, TWO), provides thick plated copper layers to achieve higher current flow and better thermal dissipation, reducing chip resistance by 20% or more compared with conventional Aluminum top metal, thus increasing power conversion efficiency and extending battery life.
  
  
• TSMC December 2012 Sales Report (Thursday Jan. 10, 2013)
  TSMC today announced its net sales for December 2012: On an unconsolidated basis, net sales were approximately NT$36.56 billion, a decrease of 16.2 percent from November 2012 and an increase of 19.6 percent over December 2011.
  
  
• Nitero Demonstrates High-Speed 60GHz Wi-Fi Solution on GLOBALFOUNDRIES' 65nm-LPe RF Technology (Thursday Jan. 10, 2013)
  Nitero demonstrated its innovative 60GHz Wi-Fi solution manufactured on GLOBALFOUNDRIES' 65 nanometer (nm) Low Power Enhanced (LPe) RF platform optimized for mobile SoC applications.
  
  
• GLOBALFOUNDRIES To Build R&D Facility in New York to Accelerate Advanced Manufacturing Technologies for Global Customers (Wednesday Jan. 09, 2013)
  GLOBALFOUNDRIES today announced plans to build a multi-billion dollar R&D facility at its Fab 8 campus in Saratoga County, N.Y. The new Technology Development Center (TDC) is expected to play a key role in the company's strategy to develop innovative semiconductor solutions allowing customers to compete at the leading edge of technology.
  
  
• UMC Reports Sales for December 2012 (Tuesday Jan. 08, 2013)
  UMC today reported unaudited net sales for the month of December 2012.
  
  
• SMIC Achieves Breakthrough in Backside-Illuminated Image Sensors (Thursday Dec. 20, 2012)
  SMIC today announced a breakthrough in its development of backside-illuminated (BSI) CMOS image sensor (CIS) technology, with the first test chip demonstrating good image quality even in low-light conditions.
  
  
• UMC Achieves Foundry's First 55nm SDDI Customer Product Tape-out (Tuesday Dec. 18, 2012)
  UMC today announced that it has taped out the foundry industry’s first customer product utilizing 55nm small display driver IC (SDDI) process technology.
  
  
• TSMC November 2012 Sales Report (Tuesday Dec. 11, 2012)
  TSMC today announced its net sales for November 2012: On an unconsolidated basis, net sales were approximately NT$43.64 billion, a decrease of 11.4 percent over October 2012 and an increase of 23.9 percent over November 2011.
  
  
• UMC Reports Sales for November 2012 (Friday Dec. 07, 2012)
  UMC today reported unaudited net sales for the month of November 2012.
  
  
• UMC Unveils 80nm SDDI Foundry Process Featuring the Industry's Most Competitive SRAM Bitcell (Wednesday Nov. 21, 2012)
  UMC today introduced an 80nm SDDI (Small-panel Display Driver IC) foundry process with the most competitive SDDI SRAM bitcell in the foundry industry.
  
  
• UMC Restructures Executive Team (Monday Nov. 19, 2012)
  UMC announced that its board of directors today appointed senior vice president Mr. Po-Wen Yen as the company’s new CEO, effective immediately.
  
  
• TSMC October 2012 Sales Report (Friday Nov. 09, 2012)
  TSMC today announced its net sales for October 2012: On an unconsolidated basis, net sales were approximately NT$49.28 billion, an increase of 15.1 percent over September 2012 and an increase of 32.3 percent over October 2011.