Foundries News

• UMC Reports Sales for October 2012 (Thursday Nov. 08, 2012)
  UMC today reported unaudited net sales for the month of October 2012.
  
  
• X-FAB and Anvo-Systems Dresden Cooperate to Provide High-Speed Non-Volatile Memory Solutions (Tuesday Nov. 06, 2012)
  X-FAB Silicon Foundries and Anvo-Systems Dresden today announced a cooperative agreement to offer high-speed non-volatile memory solutions that combine SRAM, DRAM and SONOS FLASH technologies; the compact design results in a small silicon footprint that keeps device costs low.
  
  
• SMIC Reports 2012 Third Quarter Results (Monday Nov. 05, 2012)
  SMIC today announced its consolidated results of operations for the three months ended September 30, 2012. Quarterly revenue hit a record high of $461.2 million in 3Q12, which was up by 9.3% from $421.8 million in 2Q12 and grew by 50.3% year over year.
  
  
• TSMC Reports Third Quarter EPS of NT$1.90 (Thursday Oct. 25, 2012)
  TSMC today announced consolidated revenue of NT$141.38 billion, net income of NT$49.30 billion, and diluted earnings per share of NT$1.90 (US$0.32 per ADR unit) for the third quarter ended September 30, 2012.
  
  
• UMC Qualifies Foundry's First True 12V eFlash Solution (Friday Oct. 19, 2012)
  UMC today announced that it has qualified the foundry industry's first high voltage (HV) embedded flash (eFlash) process that incorporates a true 12-volt solution.
  
  
• TSMC Tapes Out Foundry's First CoWoS Test Vehicle Integrating with JEDEC Wide I/O Mobile DRAM Interface (Friday Oct. 12, 2012)
  TSMC today announced that it has taped out the foundry segment’s first CoWoS™ (Chip on Wafer on Substrate) test vehicle using JEDEC Solid State Technology Association’s Wide I/O mobile DRAM interface.
  
  
• Silterra Released 180nm Embedded Flash Technology for Mass Production (Friday Oct. 12, 2012)
  SilTerra officially announced the production release of 0.18-micron embedded Flash technology, dubbed C18E. SilTerra has licensed SuperFlash © technology from Silicon Storage Technology Inc (SST)
  
  
• TSMC 20nm and CoWoS Design Infrastructure Ready (Tuesday Oct. 09, 2012)
  TSMC announced today that the readiness of 20nm and CoWoS™ design support within the Open Innovation Platform® (OIP) is demonstrated by the delivery of two foundry-first reference flows supporting 20nm and CoWoS™ (Chip on Wafer on Subsrate) technologies.
  
  
• TSMC September 2012 Sales Report (Tuesday Oct. 09, 2012)
  TSMC today announced its net sales for September 2012: On an unconsolidated basis, net sales were approximately NT$42.82 billion, a decrease of 12.4 percent over August 2012 and an increase of 30.3 percent over September 2011.
  
  
• UMC Reports Sales for September 2012 (Tuesday Oct. 09, 2012)
  UMC today reported unaudited net sales for the month of September 2012
  
  
• Sand 9 Partners with GLOBALFOUNDRIES as High-Volume Foundry for MEMS Timing Products (Wednesday Oct. 03, 2012)
  Sand 9, Inc., a pioneer in precision MEMS timing products for wireless and wired applications, today announced that it has partnered with GLOBALFOUNDRIES to support high-volume manufacturing for Sand 9 products.
  
  
• Samsung and STMicroelectronics Enter Strategic Relationship for Advanced Foundry Services at 32/28nm Technology (Friday Sep. 28, 2012)
  STMicroelectronics has selected Samsung's foundry business unit for the production of ICs using a 32/28-nm high-K metal gate manufacturing process.
  
  
• X-FAB to Invest More than $50M in MEMS Operations (Wednesday Sep. 26, 2012)
  -FAB Silicon Foundries today announced it will invest more than $50M during the next three years in cleanroom space, new equipment, R&D and staff for its MEMS operations. These investments reflect X-FAB’s significant focus on MEMS to support the expected growth in MEMS services.
  
  
• GLOBALFOUNDRIES Unveils FinFET Transistor Architecture Optimized for Next-Generation Mobile Devices (Thursday Sep. 20, 2012)
  GLOBALFOUNDRIES today accelerated its leading-edge roadmap with the launch of a new technology designed for the expanding mobile market. The company’s 14nm-XM offering will give customers the performance and power benefits of three-dimensional “FinFET” transistors with less risk and a faster time-to-market.
  
  
• SMIC Unveils 0.13um-1.2V Low-Power Embedded EEPROM Platform (Wednesday Sep. 19, 2012)
  SMIC today announced the availability of its 1.2-volt Low-Power Embedded EEPROM Platform, which is fully compatible with its 0.13-micron (um) low-leakage (LL) process.
  
  
• LFoundry launches several technology enhancement projects in R&D and innovations (Monday Sep. 17, 2012)
  Thanks to the materialization of several large-scale projects, LFoundry plans to invest a total EUR 25 million in R&D and innovation projects over the next three years.
  
  
• X-FAB Goes 3D (Wednesday Sep. 12, 2012)
  X-FAB Silicon Foundries today announced the industry’s first open-platform MEMS 3D inertial sensor process available directly from a high-volume pure-play foundry.
  
  
• TSMC August 2012 Sales Report (Monday Sep. 10, 2012)
  TSMC today announced its net sales for August 2012: On an unconsolidated basis, net sales were approximately NT$48.9 billion, an increase of 2 percent over July 2012 and an increase of 32 percent over August 2011.
  
  
• UMC Reports Sales for August 2012 (Friday Sep. 07, 2012)
  UMC today reported unaudited net sales for the month of August 2012.
  
  
• UMC to Develop 65nm BSI CMOS Image Sensor Process with STMicroelectronics (Thursday Sep. 06, 2012)
  UMC today announced a collaborative effort with STMicroelectronics for 65nm CMOS image sensor technology using backside illumination (BSI).
  
  
• SMIC Interim Results: Double-Digit Growth in First Two Quarters (Thursday Aug. 30, 2012)
  SMIC today released its unaudited results for the six months ended June 30, 2012. Taking advantage of better-than-expected growth opportunities in the global semiconductor market, SMIC achieved stable growth in the first half of the year.
  
  
• UMC to shutter Japanese fab (Thursday Aug. 23, 2012)
  Taiwanese foundry United Microelectronics Corp. (UMC) said Tuesday (Aug. 21) its board of directors voted to close the company's 200-mm fab in Japan in an effort to cut costs amid difficult macroeconomic conditions and customer demand decline.
  
  
• TSMC Board of Directors Meeting Resolutions (Tuesday Aug. 14, 2012)
  TSMC Board approved capital appropriations of US$2,407.80 million to expand and upgrade advanced technology capacity, and capital appropriations of approximately US$378.73 million to construct a fab building and install facility systems
  
  
• ARM and GLOBALFOUNDRIES Collaborate to Enable Next-Generation Devices on 20nm and FinFET Process Technologies (Monday Aug. 13, 2012)
  GLOBALFOUNDRIES and ARM today announced a multi-year agreement to jointly deliver optimized system-on-chip (SoC) solutions for ARM® processor designs on GLOBALFOUNDRIES’ 20-nanometer (nm) and FinFET process technologies.
  
  
• TSMC July 2012 Sales Report (Friday Aug. 10, 2012)
  TSMC today announced its net sales for July 2012: On an unconsolidated basis, net sales were approximately NT$47.92 billion, an increase of 11.8 percent over June 2012 and an increase of 37.3 percent over July 2011.
  
  
• SMIC Reports 2012 Second Quarter Results (Wednesday Aug. 08, 2012)
  SMIC today announced its consolidated results of operations for the three months ended June 30, 2012.
  
  
• TSMC and ASML Reach Agreement to Develop Next Generation Lithography Technologies as an Extension of Long-Term Partnership (Monday Aug. 06, 2012)
  TSMC today announced it has joined ASML Holding N.V. Customer Co-Investment Program, aimed at accelerating the development and industrialization of key next-generation semiconductor manufacturing technologies, which include extreme ultraviolet (EUV) lithography technology and 450-millimeter lithography tools. The agreement includes an investment amount of 838 million euros in ASML to acquire a 5% of its equity; and to commit 276 million euros, spread over 5 years, to ASML’s research and development programs.
  
  
• UMC Obtains LEED Gold Certification for Fab 12A P3 & P4 (Monday Jul. 30, 2012)
  UMC today announced that its 300mm Fab 12A P3 & P4 in Tainan, Taiwan, has gained LEED-NC (Leadership in Energy and Environmental Design – New Construction) Gold recognition from the U.S. Green Building Council.
  
  
• Rambus and GLOBALFOUNDRIES Demonstrate Outstanding Performance and Power Results in 28nm Silicon Test Chips (Wednesday Jul. 25, 2012)
  Rambus Inc. and GLOBALFOUNDRIES today announced the results from their collaboration on two separate memory architecture-based silicon test chips. The first test chip demonstrates solutions for mobile memory applications, such as smartphones and tablets. The second test chip demonstrates solutions for compute main memory applications, such as servers.
  
  
• GLOBALFOUNDRIES Extending Fab 8 to Meet Strong Customer Demand (Wednesday Jul. 25, 2012)
  GLOBALFOUNDRIES today announced it is moving forward with the final construction for the extension of Module 1 at the Fab 8 campus in New York. The project will add 90,000 square feet of manufacturing capacity, bringing the total capacity for Fab 8 Module 1 to 300,000 square feet. Construction activities are scheduled to begin in August and work is expected to be completed in December 2013.